Freescale Semiconductor Inc PART INFORMATION Mfg Item Number Mfg Item Name MMA8652FCR1 DFN 10 2*2*0.95 P0.4 SUPPLIER Company Name Company Unique ID Response Date Response Document ID Contact Name Contact Title Contact Phone Contact Email Authorized Representative Representative Title Representative Phone Representative Email URL for Additional Information Freescale Semiconductor Inc 14-141-7928 2016-03-22 008HK50008S260A1.13 Freescale Semiconductor Inc Product Technical Support 1-800-521-6274 [email protected] Daniel Binyon EPP Customer Response 512-895-3406 [email protected] www.freescale.com DECLARATION EU RoHS Pb Free HalogenFree Plating Indicator EU RoHS Exemption(s) Yes No Yes e4 7c-I MANUFACTURING Mfg Item Number Mfg Item Name Version Weight UoM Unit Volume J-STD-020 MSL Rating Peak Processing Temperature Max Time at Peak Temperature Number of Processing Cycles MMA8652FCR1 DFN 10 2*2*0.95 P0.4 ALL 0.014400 g EACH 1 260 C 40 seconds 3 RoHS RoHS Directive RoHS Definition RoHS Legal Definition RoHS Declaration Supplier Acceptance Signature Exemption List Version Exemptions in this part List of Freescale Accepted Exemptions 2011/65/EU RoHS Definition: Quantity limit of 0.1% by mass (1000 PPM) of homogeneous material for: Lead (Pb), Mercury, Hexavalent Chromium, Polybrominated Biphenyls (PBB), Polybrominated Diphenyl Ethers (PBDE) and quantity limit of 0.01% by mass (100 PPM) of homogeneous material of Cadmium Please indicate whether any homogeneous material (as defined by the RoHS Directive, EU 2011/65/EU and implemented by the laws of the European Union member states) of the part(s) identified on this form contains lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and/or polybrominated diphenyl ethers (each a RoHS restricted substance) in excess of the applicable quantity limit identified below. If a homogeneous material within the part(s) contains a RoHS restricted substance in excess of an applicable quantity limit, please indicate below which, if any, RoHS exemption you believe may apply. If the part is an assembly with lower level components, the declaration shall encompass all such components. Supplier certifies that it gathered the information it provides in this form using appropriate methods to ensure its accuracy and that such information is true and correct to the best of its knowledge and belief, as of the date that Supplier completes this form. Supplier acknowledges that Company will rely on this certification in determining the compliance of its products with European Union member state laws that implement the RoHS Directive. Company acknowledges that Supplier may have relied on information provided by others in completing this form, and that Supplier may not have independently verified such information. However, in situations where Supplier has not independently verified information provided by others, Supplier agrees that, at a minimum, its suppliers have provided certifications regarding their contributions to the part(s), and those certifications are at least as comprehensive as the certification in this paragraph. If the Company and the Supplier enter into a written agreement with respect to the identified part(s),the terms and conditions of that agreement, including any warranty rights and/or remedies provided as part of that agreement, will be the sole and exclusive source of the Suppliers liability and the Companys remedies for issues that arise regarding information the Supplier provides in this form. In the absence of such written agreement, the warranty rights and/or remedies of Suppliers Standard Terms and Conditions of Sale applicable to such part(s) shall apply. 4 - Item(s) does not contain RoHS restricted substances per the definition above except for selected exemptions Accepted Daniel Binyon 2012/51/EU 7c-I:Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 6(a) : Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0.35% lead by weight 6(b) : Lead as an alloying element in aluminium containing up to 0.4% lead by weight 6(c) : Copper alloy containing up to 4% lead by weight 7(a) : Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead) 7(b) : Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission, and network management for telecommunications 7(c)-I : Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound 7(c)-II : Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher 7(c)-III : Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC 7(c)-IV : Lead in PZT based dielectric ceramic materials for capacitors being part of integrated circuits or discrete semiconductors 15 : Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages MATERIAL COMPOSITION Homogeneous Material Weight Bonding Wire 0.0001 Bonding Wire Non-conductive Epoxy SubstanceClass Substance CAS Metals Gold, metal 7440-57-5 Exemption SubstanceWeight UoM SubPart PPM SubPart% ARTICLEPPM ARTICLE% 1000000 100 6944 0.6944 g 0.0001 0.0007 g g Non-conductive Epoxy Solvents, additives, and other materials Bisphenol A 80-05-7 0.0000035 g 4996 0.4996 243 0.0243 Non-conductive Epoxy Plastics/polymers Epikote 862 28064-14-4 0.00006994 g 99915 9.9915 4856 0.4856 Non-conductive Epoxy Plastics/polymers 4,4'-Isopropylidenediphenol-1-chloro-2,3-epoxypropane concentrate 25068-38-6 0.0000035 g 4996 0.4996 243 0.0243 Non-conductive Epoxy Plastics/polymers Phenol, polymer with formaldehyde 9003-35-4 0.00006994 g 99915 9.9915 4856 0.4856 Non-conductive Epoxy Glass Proprietary Material-Other silica compounds - 0.00001399 g 19983 1.9983 971 0.0971 Non-conductive Epoxy Plastics/polymers Proprietary Material-Other Non-halogenated Epoxy resins - 0.00046919 g 670280 67.028 32582 3.2582 Non-conductive Epoxy Solvents, additives, and other materials 4,4'-Diaminodiphenylsulfone 0.00006994 g 99915 9.9915 4856 0.4856 Copper Lead Frame 80-08-0 0.0033 g Copper Lead Frame Metals Copper, metal 7440-50-8 0.00312108 g 945780 94.578 216741 21.6741 Copper Lead Frame Metals Gold, metal 7440-57-5 0.00000097 g 295 0.0295 67 0.0067 Copper Lead Frame Solvents, additives, and other materials Silicon 7440-21-3 0.00002354 g 7134 0.7134 1634 0.1634 Copper Lead Frame Metals Magnesium, metal 7439-95-4 0.00000568 g 1722 0.1722 394 0.0394 Copper Lead Frame Nickel (external applications only) Nickel 7440-02-0 0.0001464 g 44363 4.4363 10166 1.0166 Copper Lead Frame Metals Palladium, metal 7440-05-3 0.00000162 g 491 0.0491 112 0.0112 Copper Lead Frame Metals Silver, metal 7440-22-4 0.00000071 g 215 0.0215 49 0.0049 Die Encapsulant 0.0047 g Die Encapsulant Arsenic/Arsenic Compounds Arsenic 7440-38-2 0.00000003 g 6 0.0006 2 0.0002 Die Encapsulant Bismuth/Bismuth Compounds Bismuth 7440-69-9 0.00004719 g 10040 1.004 3277 0.3277 Die Encapsulant Plastics/polymers Proprietary Material-Other Epoxy resins - 0.00035391 g 75300 7.53 24577 2.4577 Die Encapsulant Solvents, additives, and other materials Carbon Black 1333-86-4 0.00001416 g 3012 0.3012 983 0.0983 Die Encapsulant Lead/Lead Compounds Lead 7439-92-1 0.00000008 g 16 0.0016 5 0.0005 Die Encapsulant Solvents, additives, and other materials Other organic phosphorous compounds - 0.00001416 g 3012 0.3012 983 0.0983 Die Encapsulant Plastics/polymers Proprietary Material-Other phenolic resins - 0.00025953 g 55219 5.5219 18022 1.8022 Die Encapsulant Glass Silica, vitreous 60676-86-0 0.00401094 g 853395 85.3395 278551 27.8551 Silicon Semiconductor Die 0.0028 g Silicon Semiconductor Die Solvents, additives, and other materials Other miscellaneous substances (less than 5%). - 0.000056 g 20000 2 3888 0.3888 Silicon Semiconductor Die Glass Silicon, doped - 0.002744 g 980000 98 190555 19.0555 Pb Glass Frit Semiconductor Di 0.0028 7c-I g Pb Glass Frit Semiconductor Di Lead/Lead Compounds Lead (II) titanate 12060-00-3 0.00002907 g 10381 1.0381 2018 0.2018 Pb Glass Frit Semiconductor Di Glass Fibrous-glass-wool 65997-17-3 0.00002784 g 9943 0.9943 1933 0.1933 Pb Glass Frit Semiconductor Di Solvents, additives, and other materials 2,2,4-trimethyl-1,3-pentanediol-1-monoisobutyrate 25265-77-4 0.00002784 g 9943 0.9943 1933 0.1933 Pb Glass Frit Semiconductor Di Glass Silicon, doped - 0.00271525 g 969733 96.9733 188559 18.8559 LINKS MCD LINK NXP website GENERAL ENVIRONMENTAL COMPLIANCE LINKS RoHS signed letter China RoHS REACH signed letter ELV signed letter Conflict Minerals statement NXP ENVIRONMENTAL INFORMATION Environmental Compliance website FAQ Technical Service Request LINKS TO BLANK IPC1752 FORMS Blank IPC1752 v1.1 Form http://www.nxp.com http://www.nxp.com/files/corporate/doc/support_info/NXP-ROHS-DECLARATION.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/china-rohs:ENV_CHINA_ROHS_STRATEGY http://www.nxp.com/files/corporate/doc/support_info/NXP-REACH-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-ELV-STATEMENT.pdf http://www.nxp.com/files/corporate/doc/support_info/NXP-STATEMENT-CONFLICT-MINERALS.pdf http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization:ABUENVPRFPRDX http://www.nxp.com/about/corporate-responsibility/environmental-compliance-organization/eco-product-faqs:ENVIRON_FAQ http://www.nxp.com/support/sales-and-support:SUPPORTHOME http://www.NXP.com/files/abstract/corporate/ehs_epp/IPC-1752-2_v1.1_MCD_Template.pdf IPC1752 XML LINKS http://www.freescale.com/mcds/MMA8652FCR1_IPC1752_v11.xml http://www.freescale.com/mcds/MMA8652FCR1_IPC1752A.xml