0 Features § forward current ≦30mA § Wide viewing angle:120° § Operating Temperature -40~80℃ § Storage temperature-40~100℃ § Junction Temperature110℃ § ROHS and REACH-compliant § PACKAGE:2000 PCS/REEL. § Qualified according to JEDEC moisturevity Level 3 § Chip material: InGaN § Reverse Voltage:5V Product Identification Code 0000000000000000000000000000000000000000000000000000000 1 Process Type Category LED Type 00000000000000 0 0 Size 0 S C 3528 W32E 0 W E 10 Special White code PCB module code Cap color Lap polarity Dice wavelength 0 0 0 Electrical-Optical Characteristics（Ta=25℃） Value Parameter Symbol Min. Typ. Max. Unit Test condition Forward Voltage Vf 2.8 3.2 3.8 V If=20mA Luminous intensity Iv 1850 2050 ﹍ mcd If=20mA X 0.2921 If=20mA y 0.2986 ﹍ ﹍ If=20mA Wavelength Ir ﹍ ﹍ 10 μ A Vr=5V 2θ 1/2 ﹍ 120 ﹍ Deg If=20mA Reverse Current Viewing angle 0000000000000000000000000000000000000000000000000000000 1.Luminous intensity (IV) ±10%, Forward Voltage (VF) ±0.1V, Wavelength(X,Y) ±0.01, CRI±5. 2.IS standard testing Range of bins 00000000000000 Bin5 0 Bin 0 Iv(mcd) 1850-2050 0 Bin WL(nm) ST3 Bin6 Bin7 Bin8 2050-2250 2250-2450 2450-2650 ST4 ST5 HU3 HU4 HU5 0 0 0 Color Coordinate Comparison 0000000000000000000000000000000000000000000000000000000 BIN 碼 X Y X Y X Y X Y ST3 0.2934 0.2954 0.2962 0.2884 0.3050 0.2972 0.3030 0.3050 ST4 0.2910 0.3024 0.2934 0.2954 0.3030 0.3050 0.3011 0.3127 ST5 0.2882 0.3098 0.2910 0.3024 0.3011 0.3127 0.2989 0.3213 0.2837 0.2845 0.2868 0.2781 0.2962 0.2884 0.2934 0.2954 0.2806 0.2908 0.2837 0.2845 0.2934 0.2954 0.2910 0.3024 0.2773 0.2967 0.2806 0.2908 0.2910 0.3024 0.2882 0.3098 HU3 00000000000000 0 HU4 0 HU5 0 IS Main BIN. 0 0 0 Optical Characteristics-1 100% 80% 60% 40% 20% 0% 350 450 550 650 750 850 Typical Spatial Distribution Relative luminous Intensity(%) Relative Radiant Power(%) Relative Spectral Power Distribution Genealogies angle Wavelength(nm) Relative Luminous Flux .Ambient Temperature Relative Luminous Flux(%) Relative Lumious Flux(%) Relative Luminous Flux .Current 150 110% 0000000000000000000000000000000000000000000000000000000 125 100 75 50 25 0 0 10 5 15 20 25 30 50% 30% 20 40 60 100 115 80 Thermal Design Maximum Current(mA) Forward Current IF(mA) Electrical Characteristics 20 15 10 5 0 1.5 70% Junction Temperature(°) Forward Current (mA) 00000000000000 0 30 0 0 25 90% 2 2.5 Forward Voltage VF(V) 3 3.5 Ambient Temperature(°) 0 0 0 Optical Characteristics-2 Light effect VS Current Forward Light effect(%) Voltage(%) Forward Voltage Temperature Temperature(℃) Forward Current (mA) 0000000000000000000000000000000000000000000000000000000 00000000000000 0 0 0 0 0 0 Outline Dimensions 0000000000000000000000000000000000000000000000000000000 RECOMMEND PADLAYOUT 00000000000000 0 0 0 § All dimensions are in millimeters. § Tolerance is ±0.1 ㎜ unless other specified § Specifications are subject to change without notice. 0 0 0 Reflow Profile 1. IR reflow soldering Profile Lead Free solder 300 ℃ 250 temperature 10sec. max 1-5℃/sec 2-5℃/sec 230℃ max Pre heating 150-180℃ 200 260℃ max 2-5℃/sec 150 120sec.Max 50sec.max 100 50 25℃ 0 0 50 100 Time 150 200 250 300 sec 2.IR reflow soldering Profile Lead solder 0000000000000000000000000000000000000000000000000000000 300 ℃ 1-5℃/sec temperature 250 10sec. max 210℃ max Pre heating 150-180℃ 200 240℃ max 2-5℃/sec 2-5℃/sec 150 120sec.Max 50sec.max 100 50 25℃ 00000000000000 0 0 NOTES: 0 0 0 50 100 Time 150 200 250 300 sec 1.We recommend the reflow temperature 240℃(±5℃).the maximum soldering temperature should be limited to 260℃. 2.Don’t cause stress to the silicone resin while it is exposed to high temperature. 3.Number of reflow process shall be 1 time. 0 0 0 Test circuit and handling precautions Test circuit V LED Handling precautions 1. Over-current-proof 0000000000000000000000000000000000000000000000000000000 Customer must apply resistors for protection; otherwise slight voltage shift will cause big current change (Burn out will happen). 2.Storage 2.1 It is recommended to store the products in the following conditions: Humidity: 60% R.H. Max. Temperature : 5℃~30℃(41℉~86℉) 2.2 Shelf life in sealed bag: 12 month at ＜5℃~30℃ and ＜60% R.H. after the package is 00000000000000 Opened, the products should be used within a week or they should be keeping to stored at 0 ≦20%R.H. with zip-lock sealed. 0 3.Baking 0 It is recommended to baking before soldering when the pack is unsealed after 24hrs. The Conditions are as followings: 3.1 70±3℃ x 24hrs and ＜5%RH, taped reel type 3.2 100±3℃ x 2hrs , bulk type 3.3 130±3℃ x(15~30min), bulk type It shall be normal to see slight color fading of carrier(light yellow) after baking in process 0 0 0 Packing-1 3528 Single-Color High Performance SMD Top LEDs Packaging Specifications Feeding Direction Dimensions of Reel (Unit: mm) Feeding Direction Dimensions of Tape (Unit: mm) 0000000000000000000000000000000000000000000000000000000 Arrangement of Tape 00000000000000 0 0 0 NOTES 0 1. Empty component pockets are sealed with top cover tape; 2. The maximum number of missing lamps is two; 3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA 0 RS-481 specifications; 4. 2,000pcs/Reel 0 Packing-2 3528 Single-Color High Performance SMD Top LEDs Packaging Specifications Packaging specifications 0000000000000000000000000000000000000000000000000000000 NOTES: Reeled products (The most numbers of products are 2,000pcs) packed in a seal off moisture-proof bag 00000000000000 0 along with a desiccant one by one, Seven moisture-proof bag of maximums (total maximum number of 0 0 products are 14,000pcs) packed in an inside box (size: about 238mm x about 194mm x about 102mm) and four inside boxes of maximums are put in the outside box (size: about 410mm x about 254mm x about 229mm) Together with buffer material, and it is packed. (Part No., Lot No., quantity should appear on the label on the moisture-proof bag, part No. And quantity should appear on the in section request form on the cardboard box.) . 0 0 0 Precautions 1、Abnormal situation caused by improper setting of collet To choose the right collet is the key issue in improving the product’s quality. LED is different from other electronic components, which is not only about electrical output but also for optical output. This characteristic made LED more fragile in the process of SMT. If the collet’s lowering down height is not well set, it will bring damage to the gold wire at the time of collet’s picking up and loading which will cause the LED fail to light up, light up now and then or other quality problems 2、How to choose the collet During SMT, please choose the collet that has larger outer diameter than the lighting area of lens, in case that improper position of collet will damage the gold wire inside the LED. Different collets fit for different products, please refer to the following pictures cross out:. Outer diameter of collet should be larger than the lighting area Outer diameter of collet 0000000000000000000000000000000000000000000000000000000 Picture 1（） Picture 2（×） 3、How to set the height of collet The reason why for top view SMD, the height of collet before it presses downward will directly affect the quality of products during SMT is that if the collect go down too much, it will press lens and cause the distortion or breaking of gold wire. The setting of collet position should follow the pictures belowed. 00000000000000 0 Picture 3（） 0 0 No.3、Other points for attention Picture 4（×） A、No pressure should be exerted to the epoxy shell of the SMD under high temperature. B、Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross out easy to break. C、LED should be used as soon as possible when being taken out of the original package, and should be stored in anti-moisture and anti-ESD package. No.4、This usage and handling instruction is only for your reference. 0 0 0 Test items and results of reliability Type Test Item Test Standard Environmental Sequence Temperature Cycle Thermal Shock High Temperature Storage Humidity Heat Storage Low Temperature Storage Test Conditions Note Number of Damaged 100 cycle 0/50 20 cycle 0/22 1000 hrs 0/22 1000 hrs 0/22 1000 hrs 0/22 1000 hrs 0/22 500 hrs 0/22 1000 hrs 0/22 -40℃ 30min JEITA ED-4701 ↑↓5 min 300 303 100℃ 30min -10℃ 15min JEITA ED-4701 ↑↓5sec 200 303 100℃ 15min JEITA ED-4701 Ta=100℃ 200 201 JEITA ED-4701 Ta=60℃ 100 103 RH=90% JEITA ED-4701 Ta=-40℃ 200 202 0000000000000000000000000000000000000000000000000000000 Tested with Life Test Ta=25℃ Brightek IF=20mA Operation Sequence standard High Humidity Heat Life Test Tested with Brightek 60℃ RH=90% standard Tested with Low Temperature Life Test Brightek standard IF=15mA Ta=-20℃ IF=20mA 00000000000000 0 Judgment criteria of failure for the reliability 0 0 Measuring items Symbol Measuring conditions Forward voltage Vf(V) IF=20mA Reverse current IR(uA) Vr=5V Judgement criteria for failure Over Over U×1.2 U×2 0 0