1SC3528W32E0WE10

0
Features
§
forward current ≦30mA
§
Wide viewing angle:120°
§
Operating Temperature -40~80℃
§
Storage temperature-40~100℃
§
Junction Temperature110℃
§
ROHS and REACH-compliant
§
PACKAGE:2000 PCS/REEL.
§
Qualified according to JEDEC moisturevity Level 3
§
Chip material: InGaN
§
Reverse Voltage:5V
Product Identification Code
0000000000000000000000000000000000000000000000000000000
1
Process
Type
Category
LED Type
00000000000000
0
0
Size
0
S
C 3528 W32E 0 W
E 10
Special
White code
PCB module
code
Cap color
Lap polarity
Dice wavelength
0
0
0
Electrical-Optical Characteristics(Ta=25℃)
Value
Parameter
Symbol
Min.
Typ.
Max.
Unit
Test condition
Forward Voltage
Vf
2.8
3.2
3.8
V
If=20mA
Luminous intensity
Iv
1850
2050
﹍
mcd
If=20mA
X
0.2921
If=20mA
y
0.2986
﹍
﹍
If=20mA
Wavelength
Ir
﹍
﹍
10
μ A
Vr=5V
2θ 1/2
﹍
120
﹍
Deg
If=20mA
Reverse Current
Viewing angle
0000000000000000000000000000000000000000000000000000000
1.Luminous intensity (IV) ±10%, Forward Voltage (VF) ±0.1V, Wavelength(X,Y) ±0.01, CRI±5.
2.IS standard testing
Range of bins
00000000000000
Bin5
0 Bin
0 Iv(mcd) 1850-2050
0 Bin
WL(nm)
ST3
Bin6
Bin7
Bin8
2050-2250
2250-2450
2450-2650
ST4
ST5
HU3
HU4
HU5
0
0
0
Color Coordinate Comparison
0000000000000000000000000000000000000000000000000000000
BIN 碼
X
Y
X
Y
X
Y
X
Y
ST3
0.2934
0.2954
0.2962
0.2884
0.3050
0.2972
0.3030
0.3050
ST4
0.2910
0.3024
0.2934
0.2954
0.3030
0.3050
0.3011
0.3127
ST5
0.2882
0.3098
0.2910
0.3024
0.3011
0.3127
0.2989
0.3213
0.2837
0.2845
0.2868
0.2781
0.2962
0.2884
0.2934
0.2954
0.2806
0.2908
0.2837
0.2845
0.2934
0.2954
0.2910
0.3024
0.2773
0.2967
0.2806
0.2908
0.2910
0.3024
0.2882
0.3098
HU3
00000000000000
0
HU4
0
HU5
0
IS Main BIN.
0
0
0
Optical Characteristics-1
100%
80%
60%
40%
20%
0%
350
450
550
650
750
850
Typical Spatial Distribution
Relative luminous Intensity(%)
Relative Radiant Power(%)
Relative Spectral Power Distribution
Genealogies angle
Wavelength(nm)
Relative Luminous Flux .Ambient Temperature
Relative Luminous Flux(%)
Relative Lumious Flux(%)
Relative Luminous Flux .Current
150
110%
0000000000000000000000000000000000000000000000000000000
125
100
75
50
25
0
0
10
5
15
20
25
30
50%
30%
20
40
60
100 115
80
Thermal Design
Maximum Current(mA)
Forward Current IF(mA)
Electrical Characteristics
20
15
10
5
0
1.5
70%
Junction Temperature(°)
Forward Current (mA)
00000000000000
0
30
0
0
25
90%
2
2.5
Forward Voltage VF(V)
3
3.5
Ambient Temperature(°)
0
0
0
Optical Characteristics-2
Light effect VS Current
Forward
Light effect(%)
Voltage(%)
Forward Voltage Temperature
Temperature(℃)
Forward Current (mA)
0000000000000000000000000000000000000000000000000000000
00000000000000
0
0
0
0
0
0
Outline Dimensions
0000000000000000000000000000000000000000000000000000000
RECOMMEND PADLAYOUT
00000000000000
0
0
0
§
All dimensions are in millimeters.
§
Tolerance is ±0.1 ㎜ unless other specified
§
Specifications are subject to change without notice.
0
0
0
Reflow Profile
1. IR reflow soldering Profile
Lead Free solder
300
℃
250
temperature
10sec. max
1-5℃/sec
2-5℃/sec
230℃ max
Pre heating 150-180℃
200
260℃ max
2-5℃/sec
150
120sec.Max
50sec.max
100
50
25℃
0
0
50
100
Time
150
200
250
300
sec
2.IR reflow soldering Profile
Lead solder
0000000000000000000000000000000000000000000000000000000
300
℃
1-5℃/sec
temperature
250
10sec. max
210℃ max
Pre heating 150-180℃
200
240℃ max
2-5℃/sec
2-5℃/sec
150
120sec.Max
50sec.max
100
50
25℃
00000000000000
0
0
NOTES:
0
0
0
50
100
Time
150
200
250
300
sec
1.We recommend the reflow temperature 240℃(±5℃).the maximum soldering temperature
should be limited to 260℃.
2.Don’t cause stress to the silicone resin while it is exposed to high temperature.
3.Number of reflow process shall be 1 time.
0
0
0
Test circuit and handling precautions
 Test circuit
V
LED
 Handling precautions
1. Over-current-proof
0000000000000000000000000000000000000000000000000000000
Customer must apply resistors for protection; otherwise slight voltage shift will cause
big current change (Burn out will happen).
2.Storage
2.1 It is recommended to store the products in the following conditions:
Humidity: 60% R.H. Max.
Temperature : 5℃~30℃(41℉~86℉)
2.2 Shelf life in sealed bag: 12 month at <5℃~30℃ and <60% R.H. after the package is
00000000000000
Opened, the products should be used within a week or they should be keeping to stored at
0
≦20%R.H. with zip-lock sealed.
0
3.Baking
0
It is recommended to baking before soldering when the pack is unsealed after 24hrs. The
Conditions are as followings:
3.1 70±3℃ x 24hrs and <5%RH, taped reel type
3.2 100±3℃ x 2hrs , bulk type
3.3 130±3℃ x(15~30min), bulk type
It shall be normal to see slight color fading of carrier(light yellow) after baking in process
0
0
0
Packing-1
3528 Single-Color High Performance SMD Top LEDs Packaging Specifications
 Feeding Direction
 Dimensions of Reel (Unit: mm)
Feeding Direction
 Dimensions of Tape (Unit: mm)
0000000000000000000000000000000000000000000000000000000
 Arrangement of Tape
00000000000000
0
0
0
NOTES
0
1. Empty component pockets are sealed with top cover tape;
2. The maximum number of missing lamps is two;
3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA
0
RS-481 specifications;
4. 2,000pcs/Reel
0
Packing-2
3528 Single-Color High Performance SMD Top LEDs Packaging Specifications
 Packaging specifications
0000000000000000000000000000000000000000000000000000000
NOTES:
Reeled products (The most numbers of products are 2,000pcs) packed in a seal off moisture-proof bag
00000000000000
0 along with a desiccant one by one, Seven moisture-proof bag of maximums (total maximum number of
0
0 products are 14,000pcs) packed in an inside box (size: about 238mm x about 194mm x about 102mm) and
four inside boxes of maximums are put in the outside box (size: about 410mm x about 254mm x about
229mm) Together with buffer material, and it is packed. (Part No., Lot No., quantity should appear on the
label on the moisture-proof bag, part No. And quantity should appear on the in section request form on the
cardboard box.) .
0
0
0
Precautions
1、Abnormal situation caused by improper setting of collet
To choose the right collet is the key issue in improving the product’s quality. LED is different from
other electronic components, which is not only about electrical output but also for optical output. This
characteristic made LED more fragile in the process of SMT. If the collet’s lowering down height is not
well set, it will bring damage to the gold wire at the time of collet’s picking up and loading which will
cause the LED fail to light up, light up now and then or other quality problems
2、How to choose the collet
During SMT, please choose the collet that has larger outer diameter than the lighting area of lens, in case
that improper position of collet will damage the gold wire inside the LED. Different collets fit for different
products, please refer to the following pictures cross out:.
Outer diameter of collet should
be larger than the lighting area
Outer diameter of collet
0000000000000000000000000000000000000000000000000000000
Picture 1()
Picture 2(×)
3、How to set the height of collet
The reason why for top view SMD, the height of collet before it presses downward will directly affect
the quality of products during SMT is that if the collect go down too much, it will press lens and cause
the distortion or breaking of gold wire. The setting of collet position should follow the pictures
belowed.
00000000000000
0
Picture 3()
0
0 No.3、Other points for attention
Picture 4(×)
A、No pressure should be exerted to the epoxy shell of the SMD under high temperature.
B、Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross out easy
to break.
C、LED should be used as soon as possible when being taken out of the original package, and should be
stored in anti-moisture and anti-ESD package.
No.4、This usage and handling instruction is only for your reference.
0
0
0
Test items and results of reliability
Type
Test Item
Test Standard
Environmental
Sequence
Temperature Cycle
Thermal Shock
High Temperature Storage
Humidity Heat Storage
Low Temperature Storage
Test Conditions
Note
Number of
Damaged
100 cycle
0/50
20 cycle
0/22
1000 hrs
0/22
1000 hrs
0/22
1000 hrs
0/22
1000 hrs
0/22
500 hrs
0/22
1000 hrs
0/22
-40℃ 30min
JEITA ED-4701
↑↓5 min
300 303
100℃ 30min
-10℃ 15min
JEITA ED-4701
↑↓5sec
200 303
100℃ 15min
JEITA ED-4701
Ta=100℃
200 201
JEITA ED-4701
Ta=60℃
100 103
RH=90%
JEITA ED-4701
Ta=-40℃
200 202
0000000000000000000000000000000000000000000000000000000
Tested with
Life Test
Ta=25℃
Brightek
IF=20mA
Operation
Sequence
standard
High Humidity
Heat Life Test
Tested with
Brightek
60℃ RH=90%
standard
Tested with
Low Temperature Life Test
Brightek
standard
IF=15mA
Ta=-20℃
IF=20mA
00000000000000
0 Judgment criteria of failure for the reliability
0
0
Measuring items
Symbol
Measuring conditions
Forward voltage
Vf(V)
IF=20mA
Reverse current
IR(uA)
Vr=5V
Judgement criteria for failure
Over
Over
U×1.2
U×2
0
0
Similar pages