1SC5050VGB00MG02

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Customer Part No.:
Brightek Part No.: 1SC5050VGB00MG02
Specification.:
Documents No.:
Prepared By:
TD0120A20H04000
BT-50-1005002
Huanhuan.Yi
Checke By:
Time:
2012/04/14
Customer Comfirmation:
Features
§
5.0mm×5.0mm SMT LED , 1.6mm Thickness.
§
Low Power Consumption.
§ Viewing Angle 120°.
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§
Various Colors And Types Available.
§
Package: 1000 PCS/Reel.
§
Resin(Mold): Silicone
§
Dice: Red(AlGaInP)、Green(InGaN)、Blue、
(InGaN)
§
Pulsed Forward Current 100 mA※(Duty 1/10, Pulse Width 0.1ms.)
§
Reverse Voltage:5 V
§
Operating Temperature: -40~ +80℃
§
Storage Temperature: -40 ~ +100℃
§
Soldering Temperature: 260for5sec℃
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Catalog
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0 Electrical-Optical Characteristics……………………………………………………………2
0 Intensity Bin Limit ………………………………………………………………………………3
Optical Characteristics …………………………………………………………………………4-7
Outline Dimensions
Reflow Profile
………………………………………………………………………………8
……………………………………………………………………………………9
Test items and results of reliability ………………………………………………………10
Packing ………………………………………………………………………………………………11-12
Test circuit and handling precautions ………………………………………………………13
LED Usage and Handling Instructions …………………………………………………………14-15
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Electrical-Optical Characteristics(Ta=25℃)
Value
Symbol
Parameter
Forward Voltage
Typ.
Max.
R
1.7
1.9
2.6
V
If=20mA
G
2.8
3.2
3.8
V
If=20mA
B
2.8
3.2
3.8
V
If=20mA
R
430
620
﹍
mcd
If=20mA
G
1120
1500
﹍
mcd
If=20mA
B
260
260
﹍
mcd
If=20mA
R
620
﹍
635
(nm)
If=20mA
G
520
﹍
535
(nm)
If=20mA
B
461
﹍
476
(nm)
If=20mA
Ir
﹍
﹍
10
μA
Vr=5V
2θ 1/2
﹍
120
﹍
Deg
If=20mA
Tj
110
℃
If=20mA
Iv
λ
Wavelength
d
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Reverse Current
Viewing angle
Test condition
Min.
Vf
Luminous intensity
Unit
JunctionTemperature
Electrostatic Discharge
Clsaaification
ESD
1000V
1.Luminous intensity (IV) ±10%, Forward Voltage (VF) ±0.1V, Wavelength(λd) ±0.5nm
2.IS standard testing
3. JunctionTemperature R=G=B=110℃
4. Electrostatic Discharge Clsaaification R=G=B=1000V
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0 Product Identification Code
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0
1
S
C
5050
VGB0
0
M
G
02
Type
0:OEM product
1:Brightek product
Special white code
PCB module&code
Cap color
Category
F:Flash,S:SMD
LED type
A:PCB top view,B:PCB side view
C:PLCC top view D:PLCC side view
Size
PLCC
0 carrier size in mm,
PCB carrier size in inches
Lead polarity
0:Normal 1:commonAnode
2:common cathode
Dice color
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0
Intensity Bin Limit (IF = 20 mA)
Red
Green
Blue
Bin Code
Min.(mcd)
Max.(mcd)
Bin Code
Min.(mcd)
Max.(mcd)
Bin Code
Min.(mcd)
Max.(mcd)
11
430
540
12
1120
1400
11
260
325
12
540
675
13
1400
1700
12
325
405
13
675
845
14
1700
2120
13
405
505
※
Tolerance of measurement of luminous intensity is ±10%.
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Color Bin Limit (IF = 20 mA)
Red
Green
Blue
Bin Code
Min.(nm)
Max.(nm)
Bin Code
Min.(nm)
Max.(nm)
Bin Code
Min.(nm)
Max.(nm)
1
620
625
2
520
525
2
461
466
2
625
630
3
525
530
3
466
471
535
4
471
476
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3
630
635
4
530
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0
0 ※ Tolerance of measurement of dominant wavelength is ±1 nm.

Please check sorting method, We will amend the Bin code to maintain Bin Code centralize .
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Optical Characteristics
Relative Radiant Power(%)
Relative Spectral Power Distribution(Ta=25℃)
100%
80%
60%
40%
20%
0%
350
450
550
650
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750
850
Wavelength(nm)
Relati ve luminous Intensity(%)
Typical Spatial Distribution
1.00
0.75
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0
0.50
0
0
0.25
0.00
-90
-60
-30
0
-30
-60
-90
Angle(°) R=G=B
0
0
0
Relative Flux vs.Current
(Ta=25℃)
Relative Luminous Flux
10000
1000
100
10
0
5
0
10
15
20
25
30
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Forward Current (mA)
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0
0
0
Relative Luminous Flux(%)
Relative Flux vs.Ambient Temperature
110%
100%
90%
80%
70%
0
20
40
60
80
100
Ambient Temperature(°)
0
0
0
Forward Voltage .Ambient Temperature
Forward Voltage
3.4
3.2
3.0
2.0
1.8
1.6
25
85
45
65
Ambient Temperature(°)
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105
Electrical Characteristics℃)
Forward Current IF(mA)
30
25
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0
0
15
0
10
5
0
1.5
2
2.5
Forward Voltage (V)
0
3
3.5
0
0
Choromaticity Coordinates(wd)
Chromaticity Coordinates .Forward Current
620
600
520
500
470
450
420
0
10
20
30
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40
50
Forward Current (mA)
Forward Current IF(mA)
Thermal Design
50
40
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30
0
0
0
20
10
0
0
20
40
60
80
Ambient Temperature Ta(°C)
100
0
0
0
Outline Dimensions
0.6
0.6
5.0±0.05
3
B
G
5
5
3
1
6
1.1
4
2
1.1
5.4±0.05
1
R
C 0.70
2
4
6
0.2
3
5
2
4
6
B
G
R
4.90±0.05
1
45°
0.8
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d=3.34
3.4
1.6±0.05
unit:mm
RECOMMEND PADLAYOUT
1.4
0.6
1
0.6
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0
0
0
2
2.4
2
`
All dimensions are in millimeters.
§ Tolerance is ±0.1 ㎜ unless other specified
§
§ Specifications are subject to change without notice.
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Reflow Profile
 Reflow Temp/Time
IR reflow soldering Profile
Lead Free solder
300
℃
250
temperature
10sec. max
1-5℃/sec
2-5℃/sec
230℃ max
Pre heating 150-180℃
200
260℃ max
2-5℃/sec
150
120sec.Max
50sec.max
100
50
25℃
0
0
50
100
Time
150
200
250
300
sec
IR reflow soldering Profile
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Lead solder
300
℃
1-5℃/sec
temperature
250
Pre heating 150-180℃
200
240℃ max
10sec. max
210℃ max
2-5℃/sec
2-5℃/sec
150
120sec.Max
50sec.max
100
50
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0
0
0
25℃
0
0
50
100
Time
150
200
250
300
sec
NOTES:
1. We recommend the reflow temperature 240℃(±5℃).the maximum soldering temperature
should be limited to 260℃.
2. Don’t cause stress to the silicone resin while it is exposed to high temperature.
3. Number of reflow process shall be 1 time.
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Test items and results of reliability
Test Item
Test Conditions
–40℃ 30min
Temperature Cycle ↑↓25℃(5 min)
100℃ 30min
Thermal Shock
–40℃ 30min
↑↓5sec
110℃ 30min
Duration/
Cycle
Number of
Damage
Reference
100 cycle
0/22
JEITA ED-4701
300 303
100 cycle
0/22
JEITA ED-4701
200 303
High Temperature
Ta=100℃
1000 hrs
Storage
Ta=85℃
Humidity Heat
1000 hrs
Storage
RH=85%
Low Temperature
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Ta=-40℃
1000 hrs
Storage
0/22
0/22
0/22
Life Test
Ta=25℃
IF=20mA
1000 hrs
0/22
High Humidity Heat
Life Test
60℃ RH=90%
IF=20mA
1000 hrs
0/22
Low Temperature
Life Test
Ta=-40℃
IF=20mA
1000 hrs
0/22
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1KV at
0
ESD(HBM)
3 Time
1.5kΩ;100pf
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*Criteria for Judging the Damage
Item
Symbol
Condition
Forward Voltage
Reverse Current
Luminous Intensity
VF
IR
Iv
IF=20mA
VR=5V
IF=20mA
0/22
EIAJED-4701
200 201
EIAJED-4701
100 103
EIAJED-4701
200 202
Tested with
Brightek
standard
Tested with
Brightek
standard
Tested with
Brightek
standard
MIL-STD-883D
Criteria for Judgement
MIN
MAX
_
_
*2
LSL ×0.7
USL*1×1.1
10μA
_
[Note]*1USL:Upper Specification Level
*2 LSL: Lower Specification Level
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Packing
5050 Full-Color High Performance SMD Top LEDs Packaging Specifications
 Dimensions of Reel (Unit: mm)
178±1.0
60±0.5
13±0.5
12.4+0.2
18.4max
Note: 01.The tolerance unless mentioned is ±0.1mm.
02.The measured unit is "mm".
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 Dimensions of Tape (Unit: mm)
8.0±0.1
1.5±0.01
1.75±0.1
0.3±0.5
5.3±0.1
5.5±0.05
12±0.2
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0
0
5.35±0.1
4.0±0.05
1.75±0.1
1.5±0.10 2.0±0.05
NOTES
1. Empty component pockets are sealed with top cover tape;
2. The maximum number of missing SMDs is two;
3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA RS-481 specifications;
4. 1,000pcs/Reel
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5050 Full-Color High Performance SMD Top LEDs Packaging Specifications

Packaging specifications
Reel(1,000pcs)
Moisture-poof bag
Loble
insection request form
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Inside box Maximums seven reels
Loble
Outside box
Maximums for inside
boses
NOTES:
Reeled products (The most numbers of products are1,000pcs) packed in a seal off
moisture-proof bag along with a desiccant one by one, Five moisture-proof bag of
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0 maximums (total maximum number of products are5,000pcs) packed in an inside box
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(size: about 238mm x about 194mm x about 102mm) and four inside boxes of maximums
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are put in the outside box (size: about 410mm x about 254mm x about 229mm) Together
with buffer material, and it is packed. (Part No., Lot No., quantity should appear on the
label on the moisture-proof bag, part No. And quantity should appear on the in section
request form on the cardboard box.) .
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Test circuit and handling precautions
 Test circuit
V
LED
 Handling precautions
1. Over-current-proof
Customer must apply resistors for protection; otherwise slight voltage shift will cause
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big current change (Burn out will happen).
2.Storage
2.1 It is recommended to store the products in the following conditions:
Humidity: 60% R.H. Max.
Temperature : 5℃~30℃(41℉~86℉)
2.2 Shelf life in sealed bag: 12 month at <5℃~30℃ and <60% R.H. after the package is
Opened, the products should be used within a week or they should be keeping to stored at
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≦20%R.H. with zip-lock sealed.
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3.Baking
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It is recommended to baking before soldering when the pack is unsealed after 24hrs. The
Conditions are as followings:
3.1 70±3℃
x 24hrs and <5%RH, taped reel type
3.2 100±3℃ x 2hrs , bulk type
3.3 130±3℃ x(15~30min), bulk type
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LED Usage and Handling Instructions
No.1、soldering
A、It is not better to be manual soldering
B、Reflow soldering:
1、Soldering according to the following temperature chart is highly recommended
300
℃
250
temperature
10sec. max
1-5℃/sec
Pre heating 150-180℃
200
260℃ max
2-5℃/sec
230℃ max
2-5℃/sec
150
120sec.Max
50sec.max
100
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50
25℃
0
0
50
100
Time
150
200
250
300
sec
2、Soldering paste
Use soldering paste with the melting point at 230℃ is recommended
No.2、Collet
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(1)、Abnormal situation caused by improper setting of collet
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To choose the right collet is the key issue in improving the product’s quality. LED is different
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from other electronic components, which is not only about electrical output but also for optical output.
This characteristic made LED more fragile in the process of SMT. If the collet’s lowering down height
is not well set, it will bring damage to the gold wire at the time of collet’s picking up and loading which
will cause the LED fail to light up, light up now and then or other quality problems
(2)、How to choose the collet
During SMT, please choose the collet that has larger outer diameter than the lighting area of
lens, in case that improper position of collet will damage the gold wire inside the LED. Different collets
fit for different products, please refer to the following pictures cross out:.
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Outer diameter of collet should be
larger than the lighting area
Outer diameter of collet
Picture 1()
Picture 2(×)
3、How to set the height of collet
The reason why for top view SMD, the height of collet before it presses downward will directly
affect the quality of products during SMT is that if the collect go down too much, it will press lens
and cause the distortion or breaking of gold wire. The setting of collet position should follow the
pictures belowed.
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Picture 3()
Picture 4(×)
No.3、Other points for attention
A、No pressure should be exerted to the epoxy shell of the SMD under high temperature.
B、Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross
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out easy to break.
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C、LED should be used as soon as possible when being taken out of the original package, and should
be stored in anti-moisture and anti-ESD package.
No.4、This usage and handling instruction is only for your reference.
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