506AP

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WDFN6 2x2
CASE 506AP−01
ISSUE B
DATE 26 APR 2006
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND
IS MEASURED BETWEEN 0.15 AND 0.20mm FROM
TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS
WELL AS THE TERMINALS.
5. CENTER TERMINAL LEAD IS OPTIONAL. TERMINAL
LEAD IS CONNECTED TO TERMINAL LEAD # 4.
6. PINS 1, 2, 5 AND 6 ARE TIED TO THE FLAG.
SCALE 4:1
D
A
B
ÍÍÍ
ÍÍÍ
ÍÍÍ
E
PIN ONE
REFERENCE
DIM
A
A1
A3
b
b1
D
D2
E
E2
e
K
L
L2
J
J1
0.10 C
2X
0.10 C
2X
A3
0.10 C
A
0.08 C
7X
A1
C
D2
6X
GENERIC
MARKING DIAGRAM*
SEATING
PLANE
4X
1
6
2 XX M 5
3
4
e
L2
L
1
3
b1
XX = Specific Device Code
M = Date Code
6X
0.10 C A
E2
B
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
0.05 C
NOTE 5
K
6
4
b
6X
0.10 C A
J
J1
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.05
0.20 REF
0.25
0.35
0.51
0.61
2.00 BSC
1.00
1.20
2.00 BSC
1.10
1.30
0.65 BSC
0.15 REF
0.20
0.30
0.20
0.30
0.27 REF
0.65 REF
0.05 C
SOLDERMASK DEFINED
MOUNTING FOOTPRINT
B
NOTE 3
2.30
BOTTOM VIEW
STYLE 1:
PIN 1. DRAIN
2. DRAIN
3. GATE
4. SOURCE
5. DRAIN
6. DRAIN
STYLE 2:
PIN 1. COLLECTOR
2. COLLECTOR
3. BASE
4. EMITTER
5. COLLECTOR
6. COLLECTOR
1.10
6X
6X
0.35
0.43
1
0.60
1.25
0.35
0.34
0.65
PITCH
0.66
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER:
98AON20860D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
October, DESCRIPTION:
2002 − Rev. 0
PAGE 1 OFXXX
2
6 PIN WDFN 2X2, 0.65P
1
DOCUMENT NUMBER:
98AON20860D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY JAY LIU.
23 JUN 2005
A
ADJUSTED BOTTOM VIEW. FIXED DIMENSION K TO 0.15 REF. DELETED STYLE
1. REQ. BY JAY LIU.
06 FEB 2006
B
ADDED STYLES 1 AND 2. REQ. BY K. JAMES.
26 APR 2006
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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© Semiconductor Components Industries, LLC, 2006
April, 2006 − Rev. 01B
Case Outline Number:
506AP
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