LBSxx Q

1.0 A Miniature Glass Passivated Single-Phase
Surface Mount Bridge Rectifier - 50 - 1000 V
QFNB
LBSxx-Q
Package
QFNB
Features
• Low Profile Package : 1.00 mm (typ.)
• Glass passivated chip junciton.
• Flat Lead Plastic Package.
• Ideally Suited for Automatic Assembly.
• Ultra Thin Profile Package for Space Constrained Utilization.
• Low Forward Voltage Drop.
• Lead-free parts meet RoHS requirments.
Mechanical data
ina
MIL-STD-202, Method 208
ry
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, QFNB
• Terminals : Solder plated, solderable per
Marking Code :
• Polarity : marked on body
• Mounting Position : Any
Type number
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• Moisure Sensitivity Level 1
Maximum ratings (AT
/BS05-Q
/BS1-Q
/BS2-Q
/BS4-Q
/BS6-Q
/BS8-Q
/BS10-Q
Marking code
/BS05
/BS1
/BS2
/BS4
/BS6
/BS8
/BS10
T A=25 oC unless otherwise noted)
SYMBOLS
/BS05-Q
/BS1-Q
Maximum repetitive peak reverse voltage
VRRM
50
100
Maximum RMS voltage
VRMS
35
Maximum DC blocking voltage
VDC
50
Maximum average forward rectified current
IO
1.0
A
Peak forward surge current 8.3ms
single half sine-wave(JEDEC method)
IFSM
30
A
Maximum Rating for fusing (t < 8.3 ms)
I 2t
3.7
A 2s
Operating junction temperature range
TJ
-55 to +150
°C
Storage temperature range
TSTG
-55 to +150
°C
PARAMETER
Electrical Characteristics (AT
PARAMETER
/BS2-Q
/BS4-Q
/BS6-Q
/BS8-Q
200
400
600
800
1000
V
70
140
280
420
560
700
V
100
200
400
600
800
1000
V
/BS10-Q
UNIT
T A =25 oC unless otherwise noted)
SYMBOLS /BS05-Q
/BS1-Q
/BS2-Q
/BS4-Q
/BS6-Q
LBS8-Q
LBS10-Q
UNIT
Maximum forward voltage at I F =1.0A
VF
1.10
V
Maximum DC reverse current T J =25°C
at rated DC blocking voltage T J =125°C
IR
5.0
500
uA
uA
Note: Mounted on Aluminum substrate 15 x 15 x 1.7mm.
2014.08
www.willas.com.tw
Rev. A
第1頁
1.0 A Miniature Glass Passivated Single-Phase
Surface Mount Bridge Rectifier - 50 - 1000 V
QFNB
LBSxx-Q
Package
Pr
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CASE TEMPERATURE, ℃
ina
Mounted on Aluminum
substrate 15 x 15 x 1.7mm.
ry
Rating and characteristic curves ( LBSxx-Q )
2
1
0.1
TJ=25°C
0.01
2014.08
0.4
0.5
www.willas.com.tw
0.6
0.7
0.8
0.9
1.0
1.1
1.2
Rev. A
第2頁
1.0 A Miniature Glass Passivated Single-Phase
Surface Mount Bridge Rectifier - 50 - 1000 V
QFNB
LBSxx-Q
Package
Package outline
QFNB
ina
ry
.221(5.6)
.213(5.4)
Pr
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.249(6.3)
.241(6.1)
.010(0.25)
.006(0.15)
.256(6.5)
.249(6.3)
.044(1.10)
.036(0.90)
.0256(0.65)
.0217(0.55)
.0335(0.85)
.0296(0.75)
.006(0.15)
.002(0.05)
.1595(4.05)
.1556(3.95)
Dimensions in inches and (millimeters)
2014.08
www.willas.com.tw
Rev. A
第3頁
1.0 A Miniature Glass Passivated Single-Phase
Surface Mount Bridge Rectifier - 50 - 1000 V
QFNB
LBSxx-Q
Package
Suggested solder pad layout
D
Pr
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ina
ry
A
B
C
Dimensions in inches and (millimeters)
PACKAGE
QFNB
2014.08
A
0.032 (0.80)MIN
B
C
D
0.032 (0.80)MIN 0.158(4.00)REF 0.182 (4.60)REF
www.willas.com.tw
Rev. A
第4頁
1.0 A Miniature Glass Passivated Single-Phase
Surface Mount Bridge Rectifier - 50 - 1000 V
QFNB
LBSxx-Q
Package
Reel packing
PACKAGE
QFNB
REEL SIZE
13"
REEL
(pcs)
COMPONENT
SPACING
(m/m)
5,000
8.0
BOX
(pcs)
10,000
INNER
BOX
(m/m)
REEL
DIA,
(m/m)
360*340*45
330
CARTON
SIZE
(m/m)
380*365*400
CARTON
(pcs)
APPROX.
GROSS WEIGHT
(kg)
80,000
14.0
Packing information
ina
ry
C
Pr
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D
D1
D2
W1
unit:mm
Item
Symbol
Tolerance
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
t
W
W1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.05
0.1
0.1
0.05
0.1
0.3
1.0
QFNB
5.75
6.65
1.25
1.50
330.00
50.00
13.00
1.75
5.50
8.00
4.00
2.00
0.30
12.00
12~14.4
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
2014.08
www.willas.com.tw
Rev. A
第5頁
1.0 A Miniature Glass Passivated Single-Phase
Surface Mount Bridge Rectifier - 50 - 1000 V
QFNB
Device PN Part Number -T(1),(2)-WS
LBSxx-Q
Package
Packing Tape&Reel: ϱ Kpcs/Reel Note: (1) Packing code, Tape & Reel Packing ry
(2) Haloge
free p
roduct for packing code suffix “H”
***Disclaimer***
Pr
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mi
na
WILLAS reserves the right to make changes without notice to any product
specification herein, to make corrections, modifications, enhancements or other
changes. WILLAS or anyone on its behalf assumes no responsibility or liability
for any errors or inaccuracies. Data sheet specifications and its information
contained are intended to provide a product description only. "Typical" parameters
which may be included on WILLAS data sheets and/ or specifications can
and do vary in different applications and actual performance may vary over time.
WILLAS does not assume any liability arising out of the application or
use of any product or circuit.
WILLAS products are not designed, intended or authorized for use in medical,
life-saving implant or other applications intended for life-sustaining or other related
applications where a failure or malfunction of component or circuitry may directly
or indirectly cause injury or threaten a life without expressed written approval
of WILLAS. Customers using or selling WILLAS components for use in
such applications do so at their own risk and shall agree to fully indemnify WILLAS
Inc and its subsidiaries harmless against all claims, damages and expenditures.
2014.08
www.willas.com.tw
Rev. A
第6頁