download 692121330100.pdf

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TECHNICAL CHARACTERISTICS
MATERIAL
INSULATOR: LCP
FLAMABILITY RATING: UL94-V0
COLOR: BLUE
CONTACT MATERIAL: PHOSPHORE BRONZE
CONTACT TYPE: STAMPED
CONTACT PLATING: UNDERPLATE 1.27 to 2.54 µm Ni
CONTACT AREA 0.76 µm Gold
SOLDER TAIL AREA 2.54 to 5.08 µm Matt Tin
SHIELDING: BRASS MATT TIN PLATED
A
ENVIRONMENTAL
OPERATING TEMPERATURE: -20 up to +85°C
COMPLIANCE: RoHS & LEAD FREE AS PER DIRECTIVE 2002/95/EC
HALOGEN FREE COMPLIANT AS PER IEC 61249-2-21
ELECTRICAL
CURRENT RATING:
- PIN 1 & PIN 4 (Vbus & corresponding ground PIN) 1.8A Max
- OTHER PINS 0.25 A Max
WORKING VOLTAGE: 30Vac
DIELECTRIC WITHSTANDING VOLTAGE: 100Vac/min
INSULATION RESISTANCE: > 100MΩ
CONTACT RESISTANCE:
- PIN 1 & PIN 4: 30mΩ Max
- OTHER PINS: 50mΩ Max
B
STANDARD
CERTIFIED: E323964 / MODEL NUMBER 692121330100
MECHANICAL
INSERTION FORCE: 35.0N Max
EXTRACTION FORCE: 10.0N min
QUALITY CLASS: 5000 MATING CYCLES
SOLDERING
WAVE PROCESS AS PER JEDEC J-STD-020D
C
PACKAGING
TAPE & REEL
PCB LAYOUT * - COMPONENT VIEW
RoHS Compliant
G
F
DRILL BIGGER HOLES FOR THE CLIPS. PLEASE CHECK THIS CARFULLY.
PROJECTION:
GENERAL TOLERANCE
SOLDERING
DWG & CHARAC
QL
QL
09-NOV-11
STENCIL
GG
D
21-SEP-11
NOTE
GG
C
10-MAY-11
UL
GG
B
02-MAY-11
DIMENSION
GG
SCALE:
DESCRIPTION: USB 3.0 REVERSE HORIZONTAL TYPE A
WITH OFFSET 1.75 MM
A
04-AUG-10
PDF
JP
SHEET: 1/3
FILE
BY
DRAW: JOE
WERI PART NO: 692 121 330 100
E
REV
01-APR-14
12-AUG-13
* NOTE: THE RECOMMENDED PCB LAYOUT IS FOR AN OPTIMIZED RETENTION FORCE OF CONNECTOR ON PCB BUT IT IMPLIES INSERTION FORCE THAT A LOT OF PICK AND PLACE MACHINES ARE NOT ABLE TO HANDLE. THEREFORE IT MIGHT BE NECESSARY TO
DATE
.X = +/- 0.2
.XX = +/- 0.15
APPROVAL: RJ
UNIT: MM
SIZE
A4
D
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A
B
C
RoHS Compliant
PROJECTION:
G
F
GENERAL TOLERANCE
.X = +/- 0.2
.XX = +/- 0.15
E
D
C
APPROVAL: RJ
B
A
REV
DATE
FILE
BY
UNIT: MM
SCALE:
DESCRIPTION: USB 3.0 REVERSE HORIZONTAL TYPE A
WITH OFFSET 1.75 MM
SHEET: 2/3
WERI PART NO: 692 121 330 100
DRAW: JOE
SIZE
A4
D
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2
3
4
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PCB cross section
Stencil information for Through Hole Reflow soldering
A
Pin Volume
1,67
0,11
Hole
Volume
1,56
1
2,5
Free volume for solder paste
B
6
Theoritical Formula for Through Hole pins
Volume of the stencil aperture = (Hole volume - Pin volume) x 2
or
Volume of solder paste = (Hole volume - Pin volume) x 2
1,82
Stencil
Stencil Thickness: 150 µm
STENCIL LAYOUT * - COMPONENT VIEW
PCB
PCB thickness: 1.6mm
RoHS Compliant
* NOTE: SEE PCB LAYOUT PAGE 1/3 FOR MISSING DIMENSIONS
PROJECTION:
G
F
GENERAL TOLERANCE
.X = +/- 0.2
.XX = +/- 0.15
E
D
C
APPROVAL: RJ
B
A
REV
C
DATE
FILE
BY
UNIT: MM
SCALE:
DESCRIPTION: USB 3.0 REVERSE HORIZONTAL TYPE A
WITH OFFSET 1.75 MM
SHEET: 3/3
WERI PART NO: 692 121 330 100
DRAW: JOE
SIZE
A4
D
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