Plastic thermal enhanced very thin small outline package; no leads; 16 terminals

081
SO
T 13
SOT1308-1
Plastic thermal enhanced very thin small outline package; no
leads; 16 terminals
10 June 2016
Package information
1. Package summary
Terminal position code
D (double)
Package type descriptive code
HVSON16
Package type industry code
HVSON16
Package style descriptive code
HVSON (thermal enhanced very thin small
outline; no leads)
Package body material type
P (plastic)
IEC package outline code
---
JEDEC package outline code
MO-229
JEITA package outline code
---
Mounting method type
S (surface mount)
Issue date
4-7-2011
Table 1. Package summary
Symbol
Parameter
Min
Typ
Nom
Max
Unit
D
package length
5.4
-
5.5
5.6
mm
E
package width
3.4
-
3.5
3.6
mm
A
seated height
0.8
-
0.85
1
mm
e
nominal pitch
-
-
0.65
-
mm
n2
actual quantity of termination
-
-
16
-
SOT1308-1
NXP Semiconductors
Plastic thermal enhanced very thin small outline package; no leads; 16 terminals
2. Package outline
HVSON16: plastic thermal enhanced very thin small outline package; no leads;
16 terminals; body 3.5 x 5.5 x 0.85 mm
SOT1308-1
X
D
B
A
A
E
A1
A3
detail X
terminal 1
index area
terminal 1
index area
e1
e
v
w
b
1
8
C
C A B
C
y1 C
y
L
E1
K
16
9
D1
0
3
Unit
mm
6 mm
scale
Dimensions
A
A1
max 1.00 0.05
nom 0.85
min 0.80 0.00
A3
b
D
D1
E
E1
0.2
0.35
0.32
0.29
5.6
5.5
5.4
3.75
3.70
3.65
3.6
3.5
3.4
e
e1
1.85
1.80 0.65 4.55
1.75
k
L
v
0.2
0.55
0.50
0.45
0.1
w
y
0.05 0.05
y1
0.1
sot1308-1_po
Outline
version
SOT1308-1
References
IEC
JEDEC
JEITA
European
projection
Issue date
11-07-04
11-11-25
MO-229
Fig. 1. Package outline HVSON16 (SOT1308-1)
SOT1308-1
Package information
All information provided in this document is subject to legal disclaimers.
10 June 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
2/5
SOT1308-1
NXP Semiconductors
Plastic thermal enhanced very thin small outline package; no leads; 16 terminals
3. Soldering
Footprint information for reflow soldering of HVSON16 package
SOT1308-1
Gx
D
(0.105)
P
C
SPx
nSPx
Hy
SPy tot
SPy
Gy
SLy
nSPy
By
Ay
SPx tot
SLx
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
solder paste deposit
solder land plus solder paste
occupied area
DIMENSIONS in mm
P
Ay
By
C
D
SLx
SLy
SPx tot
SPy tot
SPx
SPy
Gx
Gy
Hy
nSPx
nSPy
0.65
4.45
2.60
0.925
0.35
3.75
1.85
2.05
0.70
0.70
0.70
5.75
3.75
4.70
2
1
Issue date
11-08-01
11-08-25
sot1308-1_fr
Fig. 2. Reflow soldering footprint for HVSON16 (SOT1308-1)
SOT1308-1
Package information
All information provided in this document is subject to legal disclaimers.
10 June 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
3/5
SOT1308-1
NXP Semiconductors
Plastic thermal enhanced very thin small outline package; no leads; 16 terminals
4. Legal information
Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
SOT1308-1
Package information
All information provided in this document is subject to legal disclaimers.
10 June 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
4/5
SOT1308-1
NXP Semiconductors
Plastic thermal enhanced very thin small outline package; no leads; 16 terminals
5. Contents
1. Package summary........................................................ 1
2. Package outline............................................................ 2
3. Soldering....................................................................... 3
4. Legal information......................................................... 4
©
NXP Semiconductors N.V. 2016. All rights reserved
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 10 June 2016
SOT1308-1
Package information
All information provided in this document is subject to legal disclaimers.
10 June 2016
©
NXP Semiconductors N.V. 2016. All rights reserved
5/5
Similar pages
DFN2020D-6: plastic, thermally enhanced ultra thin and small outline package ...
plastic compatible thermal enhanced extremely thin quad flat package; no lea ...
plastic shrink small outline package/transparent; 16 leads (straight leads); ...
plastic, extremely thin quad flat package; no leads
plastic thin fine-pitch ball grid array package; 112 balls; body 7 x 7 x 0.8 ...
plastic very thin fine-pitch ball grid array package; 49 balls
plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0 ...
plastic leadless module carrier package; 35 mm wide tape
plastic dual in-line compatible thermal enchanged super thin quad flat packa ...
plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die...
Data Sheet
plastic thermal enhanced thin quad flat package; 64 leads; exposed die pad
plastic thermal enhanced low profile quad flat package; no leads; 16 termina ...
plastic, thermal enhanced very thin small outline package; no leads; 14 terminals
plastic thermal enhanced very thin small outline package; no leads; 8 terminals
plastic thermal enhanced very thin quad flat package; no leads; 44 terminals
plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm
DFN5050-32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm
plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad
plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad
plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm
plastic thermal enhanced thin quad flat package; 64 leads; body 10 x 10 x 1 mm; exposed die pad