PHILIPS PEMB9

DISCRETE SEMICONDUCTORS
DATA SHEET
PEMB9; PUMB9
PNP/PNP resistor-equipped
transistors; R1 = 10 kΩ, R2 = 47 kΩ
Product specification
Supersedes data of 2003 Feb 03
2003 Oct 03
Philips Semiconductors
Product specification
PNP/PNP resistor-equipped transistors;
R1 = 10 kΩ, R2 = 47 kΩ
FEATURES
PEMB9; PUMB9
QUICK REFERENCE DATA
• Built-in bias resistors
SYMBOL
• Simplified circuit design
VCEO
collector-emitter
voltage
IO
MAX.
UNIT
−
−50
V
output current (DC)
−
−100
mA
TR1
PNP
−
−
−
APPLICATIONS
TR2
PNP
−
−
−
• Low current peripheral drivers
R1
bias resistor
10
−
kΩ
• Replacement of general purpose transistors in digital
applications
R2
bias resistor
47
−
kΩ
• Reduction of component count
• Reduced pick and place costs.
PARAMETER
TYP.
• Control of IC inputs.
DESCRIPTION
PNP/PNP resistor-equipped transistors (see “Simplified
outline, symbol and pinning” for package details).
PRODUCT OVERVIEW
PACKAGE
TYPE NUMBER
MARKING CODE(1)
NPN/PNP
COMPLEMENT
NPN/NPN
COMPLEMENT
PHILIPS
EIAJ
PEMB9
SOT666
−
Z6
PEMD9
PEMH9
PUMB9
SOT363
SC-88
B*9
PUMD9
PUMH9
Note
1. * = p: Made in Hong Kong.
* = t: Made in Malaysia.
* = W: Made in China.
SIMPLIFIED OUTLINE, SYMBOL AND PINNING
PINNING
TYPE NUMBER
SIMPLIFIED OUTLINE AND SYMBOL
PIN
PEMB9
PUMB9
6
5
6
4
5
R1
4
R2
TR2
TR1
R2
1
2
3
1
Top view
2003 Oct 03
R1
MAM477
2
2
3
DESCRIPTION
1
emitter TR1
2
base TR1
3
collector TR2
4
emitter TR2
5
base TR2
6
collector TR1
Philips Semiconductors
Product specification
PNP/PNP resistor-equipped transistors;
R1 = 10 kΩ, R2 = 47 kΩ
PEMB9; PUMB9
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
PEMB9
−
plastic surface mounted package; 6 leads
SOT666
PUMB9
−
plastic surface mounted package; 6 leads
SOT363
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
Per transistor
VCBO
collector-base voltage
open emitter
−
−50
V
VCEO
collector-emitter voltage
open base
−
−50
V
VEBO
emitter-base voltage
open collector
−
−10
V
VI
input voltage
positive
−
+6
V
negative
−
−40
V
IO
output current (DC)
−
−100
mA
ICM
peak collector current
−
−100
mA
Ptot
total power dissipation
Tamb ≤ 25 °C
SOT363
note 1
−
200
mW
SOT666
notes 1 and 2
−
200
mW
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
−
150
°C
Tamb
operating ambient temperature
−65
+150
°C
Per device
Ptot
total power dissipation
Tamb ≤ 25 °C
SOT363
note 1
−
300
mW
SOT666
notes 1 and 2
−
300
mW
Notes
1. Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint.
2. Reflow soldering is the only recommended soldering method.
2003 Oct 03
3
Philips Semiconductors
Product specification
PNP/PNP resistor-equipped transistors;
R1 = 10 kΩ, R2 = 47 kΩ
PEMB9; PUMB9
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Per transistor
Rth j-a
Tamb ≤ 25 °C
thermal resistance from junction to ambient
SOT363
note 1
625
K/W
SOT666
notes 1 and 2
625
K/W
Per device
Rth j-a
Tamb ≤ 25 °C
thermal resistance from junction to ambient
SOT363
note 1
416
K/W
SOT666
note 1
416
K/W
Notes
1. Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint.
2. Reflow soldering is the only recommended soldering method.
CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
ICBO
collector-base cut-off current
ICEO
collector-emitter cut-off current
CONDITIONS
VCB = −50 V; IE = 0
MIN.
−
TYP.
−
MAX.
−100
UNIT
nA
VCE = −30 V; IB = 0
−
−
−1
µA
VCE = −30 V; IB = 0; Tj = 150 °C
−
−
−50
µA
VEB = −5 V; IC = 0
−
−
−150
µA
IEBO
emitter-base cut-off current
hFE
DC current gain
VCE = −5 V; IC = −5 mA
100
−
−
VCEsat
saturation voltage
IC = −5 mA; IB = −0.25 mA
−
−
−100
mV
Vi(off)
input-off voltage
VCE = −5 V; IC = −100 µA
−
−0.7
−0.5
V
Vi(on)
input-on voltage
VCE = −0.3 V; IC = −1 mA
−1.4
−0.8
−
V
R1
input resistor
7
10
13
kΩ
R2
-------R1
resistor ratio
3.7
4.7
5.7
Cc
collector capacitance
−
−
3
2003 Oct 03
IE = ie = 0; VCB = −10 V;
f = 1 MHz
4
pF
Philips Semiconductors
Product specification
PNP/PNP resistor-equipped transistors;
R1 = 10 kΩ, R2 = 47 kΩ
PEMB9; PUMB9
PACKAGE OUTLINES
Plastic surface mounted package; 6 leads
SOT666
D
E
A
X
Y S
S
HE
6
5
4
pin 1 index
A
1
2
e1
c
3
bp
w M A
Lp
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
bp
c
D
E
e
e1
HE
Lp
w
y
mm
0.6
0.5
0.27
0.17
0.18
0.08
1.7
1.5
1.3
1.1
1.0
0.5
1.7
1.5
0.3
0.1
0.1
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
01-01-04
01-08-27
SOT666
2003 Oct 03
EUROPEAN
PROJECTION
5
Philips Semiconductors
Product specification
PNP/PNP resistor-equipped transistors;
R1 = 10 kΩ, R2 = 47 kΩ
PEMB9; PUMB9
Plastic surface mounted package; 6 leads
SOT363
D
E
B
y
X
A
HE
6
v M A
4
5
Q
pin 1
index
A
A1
1
2
e1
3
bp
c
Lp
w M B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
c
D
E
e
e1
HE
Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.30
0.20
0.25
0.10
2.2
1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45
0.15
0.25
0.15
0.2
0.2
0.1
OUTLINE
VERSION
SOT363
2003 Oct 03
REFERENCES
IEC
JEDEC
EIAJ
SC-88
6
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
Philips Semiconductors
Product specification
PNP/PNP resistor-equipped transistors;
R1 = 10 kΩ, R2 = 47 kΩ
PEMB9; PUMB9
DATA SHEET STATUS
LEVEL
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
Development
DEFINITION
I
Objective data
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Production
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2003 Oct 03
7
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: [email protected].
SCA75
© Koninklijke Philips Electronics N.V. 2003
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R75/02/pp8
Date of release: 2003
Oct 03
Document order number:
9397 750 11796