PHILIPS GTL2008PW

GTL2008; GTL2107
12-bit GTL to LVTTL translator with power good control and
high-impedance LVTTL and GTL outputs
Rev. 02 — 26 September 2006
Product data sheet
1. General description
The GTL2008/GTL2107 is a customized translator between dual Xeon processors,
Platform Health Management, South Bridge and Power Supply LVTTL and GTL signals.
Functionally and footprint identical to the GTL2007, the GTL2008/GTL2107 LVTTL and
GTL outputs were changed to put them into a high-impedance state when EN1 and EN2
are LOW, with the exception of 11BO because its normal state is LOW, so it is forced
LOW. EN1 and EN2 will remain LOW until VCC is at normal voltage, the other inputs are in
valid states and VREF is at its proper voltage to assure that the outputs will remain
high-impedance through power-up.
Both the GTL2008/GTL2107 and the GTL2007 are derived from the GTL2006. They add
an enable function that disables the error output to the monitoring agent for platforms that
monitor the individual error conditions from each processor. This enable function can be
used so that false error conditions are not passed to the monitoring agent when the
system is unexpectedly powered down. This unexpected power-down could be from a
power supply overload, a CPU thermal trip, or some other event of which the monitoring
agent is unaware.
A typical implementation would be to connect each enable line to the system power good
signal or the individual enables to the VRD power good for each processor.
Typically Xeon processors specify a VTT of 1.1 V to 1.2 V, as well as a nominal Vref of
0.73 V to 0.76 V. To allow for future voltage level changes that may extend Vref to 0.63 of
VTT (minimum of 0.693 V with VTT of 1.1 V) the GTL2008/GTL2107 allows a minimum Vref
of 0.66 V. Characterization results show that there is little DC or AC performance variation
between these levels.
The GTL2008 is the companion chip to the GTL2009 3-bit GTL Front-Side Bus frequency
comparator that is used in dual-processor Xeon applications.
The GTL2107 is the Intel designation for the GTL2008.
2. Features
n Operates as a GTL to LVTTL sampling receiver or LVTTL to GTL driver
n EN1 and EN2 disable error output
n All LVTTL and GTL outputs are put in a high-impedance state when EN1 and EN2 are
LOW
n 3.0 V to 3.6 V operation
n LVTTL I/O not 5 V tolerant
GTL2008; GTL2107
Philips Semiconductors
GTL translator with power good control and high-impedance outputs
n Series termination on the LVTTL outputs of 30 Ω
n ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per
JESD22-A115, and 1000 V CDM per JESD22-C101
n Latch-up testing is done to JEDEC Standard JESD78 Class II, Level A which exceeds
500 mA
n Package offered: TSSOP28
3. Quick reference data
Table 1.
Quick reference data
Tamb = 25 °C
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Cio
input/output capacitance
A port; VO = 3.0 V or 0 V
-
2.5
3.5
pF
B port; VO = VTT or 0 V
-
1.5
2.5
pF
LOW-to-HIGH
propagation delay
nA to nBI; see Figure 4
1
4
8
ns
nBI to nA or nAO (open-drain outputs);
see Figure 14
2
13
18
ns
HIGH-to-LOW
propagation delay
nA to nBI; see Figure 4
2
5.5
10
ns
nBI to nA or nAO (open-drain outputs);
see Figure 14
2
4
10
ns
LOW-to-HIGH
propagation delay
nA to nBI; see Figure 4
1
4
8
ns
nBI to nA or nAO (open-drain outputs);
see Figure 14
2
13
18
ns
HIGH-to-LOW
propagation delay
nA to nBI; see Figure 4
2
5.5
10
ns
nBI to nA or nAO (open-drain outputs);
see Figure 14
2
4
10
ns
Vref = 0.73 V; VTT = 1.1 V
tPLH
tPHL
Vref = 0.76 V; VTT = 1.2 V
tPLH
tPHL
4. Ordering information
Table 2.
Ordering information
Tamb = −40 °C to +85 °C
Type
number
Topside
mark
Package
Name
Description
Version
GTL2008PW GTL2008
TSSOP28
plastic thin shrink small outline package; 28 leads; body width 4.4 mm
SOT361-1
GTL2107PW GTL2107
TSSOP28
plastic thin shrink small outline package; 28 leads; body width 4.4 mm
SOT361-1
The GTL2107 is the Intel designation for the GTL2008 and is identical to the GTL2008
except for the type number and the topside markings.
GTL2008_GTL2107_2
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 02 — 26 September 2006
2 of 20
GTL2008; GTL2107
Philips Semiconductors
GTL translator with power good control and high-impedance outputs
5. Functional diagram
GTL2008/GTL2107
GTL VREF
1AO
2AO
5A
LVTTL inputs/outputs
(open-drain)
6A
GTL input
27
2
1BI
GTL inputs
LVTTL outputs
(open-drain)
LVTTL input
1
EN1
11BI
LVTTL input/output
(open-drain)
11A
GTL input
9BI
26
3
4
&
5
25
2BI
7BO1
GTL outputs
&
24
7BO2
6
23
7
1
EN2
LVTTL input
11BO
GTL output
(2)
22
DELAY(1)
8
21
5BI
DELAY(1)
9
20
6BI
GTL inputs
3AO
LVTTL outputs
(open-drain)
4AO
19
10
18
11
1
10AI1
12
1
LVTTL inputs
10AI2
13
17
3BI
4BI
10BO1
GTL outputs
16
15
10BO2
9AO
LVTTL output
002aab968
(1) The enable on 7BO1/7BO2 include a delay that prevents the transient condition where 5BI/6BI go from LOW to HIGH, and
the LOW to HIGH on 5A/6A lags up to 100 ns from causing a LOW glitch on the 7BO1/7BO2 outputs.
(2) The 11BO output is driven LOW after VCC is powered up with EN2 LOW to prevent reporting of a fault condition before EN2
goes HIGH.
Fig 1. Logic diagram of GTL2008/GTL2107
GTL2008_GTL2107_2
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 02 — 26 September 2006
3 of 20
GTL2008; GTL2107
Philips Semiconductors
GTL translator with power good control and high-impedance outputs
6. Pinning information
6.1 Pinning
VREF
1
28 VCC
1AO
2
27 1BI
2AO
3
26 2BI
5A
4
25 7BO1
6A
5
24 7BO2
EN1
6
11BI
7
11A
8
9BI
9
20 6BI
3AO 10
19 3BI
4AO 11
18 4BI
23 EN2
GTL2008PW
GTL2107PW
22 11BO
21 5BI
10AI1 12
17 10BO1
10AI2 13
16 10BO2
GND 14
15 9AO
002aab969
Fig 2. Pin configuration for TSSOP28
6.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
VREF
1
GTL reference voltage
1AO
2
data output (LVTTL), open-drain
2AO
3
data output (LVTTL), open-drain
5A
4
data input/output (LVTTL), open-drain
6A
5
data input/output (LVTTL), open-drain
EN1
6
enable input (LVTTL)
11BI
7
data input (GTL)
11A
8
data input/output (LVTTL), open-drain
9BI
9
data input (GTL)
3AO
10
data output (LVTTL), open-drain
4AO
11
data output (LVTTL), open-drain
10AI1
12
data input (LVTTL)
10AI2
13
data input (LVTTL)
GND
14
ground (0 V)
9AO
15
data output (LVTTL), 3-state
10BO2
16
data output (GTL)
10BO1
17
data output (GTL)
4BI
18
data input (GTL)
3BI
19
data input (GTL)
GTL2008_GTL2107_2
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 02 — 26 September 2006
4 of 20
GTL2008; GTL2107
Philips Semiconductors
GTL translator with power good control and high-impedance outputs
Table 3.
Pin description …continued
Symbol
Pin
Description
6BI
20
data input (GTL)
5BI
21
data input (GTL)
11BO
22
data output (GTL)
EN2
23
enable input (LVTTL)
7BO2
24
data output (GTL)
7BO1
25
data output (GTL)
2BI
26
data input (GTL)
1BI
27
data input (GTL)
VCC
28
positive supply voltage
7. Functional description
Refer to Figure 1 “Logic diagram of GTL2008/GTL2107”.
7.1 Function tables
Table 4.
GTL input signals
H = HIGH voltage level; L = LOW voltage level.
Input
Output[1]
1BI/2BI/3BI/4BI/9BI
1AO/2AO/3AO/4AO/9AO
L
L
H
H
[1]
1AO, 2AO, 3AO, 4AO and 5A/6A condition changed by ENn power good signal as described in Table 5 and
Table 6.
Table 5.
EN1 power good signal
H = HIGH voltage level; L = LOW voltage level.
EN1
1AO and 2AO
5A
L
1BI and 2BI disconnected (high-Z)
5BI disconnected
H
follows BI
5BI connected
Table 6.
EN2 power good signal
H = HIGH voltage level; L = LOW voltage level.
EN2
3AO and 4AO
L
3BI and 4BI disconnected (high-Z)
6BI disconnected
H
follows BI
6BI connected
GTL2008_GTL2107_2
Product data sheet
6A
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 02 — 26 September 2006
5 of 20
GTL2008; GTL2107
Philips Semiconductors
GTL translator with power good control and high-impedance outputs
Table 7.
SMI signals
H = HIGH voltage level; L = LOW voltage level; X = Don’t care.
Inputs
Output
10AI1/10AI2
EN2
9BI
10BO1/10BO2
L
H
L
L
L
H
H
L
H
H
L
L
H
H
H
H
L
L
X
L
H
L
X
H
Table 8.
PROCHOT signals
H = HIGH voltage level; L = LOW voltage level.
Input
Input/output
Output
5BI/6BI
5A/6A (open-drain)
7BO1/7BO2
L
L
H[1]
H
L[2]
L
H
H
H
[1]
The enable on 7BO1/7BO2 includes a delay that prevents the transient condition where 5BI/6BI go from
LOW to HIGH, and the LOW to HIGH on 5A/6A lags up to 100 ns from causing a low glitch on the
7BO1/7BO2 outputs.
[2]
Open-drain input/output terminal is driven to logic LOW state by other driver.
Table 9.
NMI signals
H = HIGH voltage level; L = LOW voltage level; X = Don’t care.
Inputs
Input/output
Output
11A (open-drain)
11BO
11BI
EN2
L
H
H
L
L
H
L[1]
H
H
H
L
H
X
L
H
L
L
L[1]
H
X
[1]
Open-drain input/output terminal is driven to logic LOW state by other driver.
GTL2008_GTL2107_2
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 02 — 26 September 2006
6 of 20
GTL2008; GTL2107
Philips Semiconductors
GTL translator with power good control and high-impedance outputs
8. Application design-in information
VTT
VTT
56 Ω
1.5 kΩ to 1.2 kΩ
56 Ω
R
VCC
2R
1.5 kΩ
PLATFORM
HEALTH
MANAGEMENT
VCC
VREF
VCC
CPU1
CPU1 1ERR_L
1AO
1BI
IERR_L
CPU1 THRMTRIP L
2AO
2BI
THRMTRIP L
CPU1 PROCHOT L
5A
7BO1
FORCEPR_L
CPU2 PROCHOT L
6A
7BO2
EN1
EN2
11B1
11B0
GTL2008
11A GTL2107 5BI
NMI_L
PROCHOT L
NMI
CPU1 DISABLE_L
FORCEPR_L
9BI
6BI
PROCHOT L
CPU2 IERR_L
3AO
3BI
IERR_L
CPU2 THRMTRIP L
4AO
4BI
THRMTRIP L
CPU1 SMI L
10AI1
10BO1
NMI
CPU2 SMI L
10AI2
10BO2
CPU2 DISABLE_L
SMI_BUFF_L
GND
9AO
CPU2
(1)
SOUTHBRIDGE NMI
SOUTHBRIDGE SMI_L
power supply
POWER GOOD
002aab970
(1) If 9AO needs to be HIGH before EN2 goes HIGH, a pull-up resistor is required because it is high-impedance until EN2 goes
HIGH. All other outputs, both GTL and LVTTL, require pull-up resistors because they are open-drain.
Fig 3. Typical application
GTL2008_GTL2107_2
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 02 — 26 September 2006
7 of 20
GTL2008; GTL2107
Philips Semiconductors
GTL translator with power good control and high-impedance outputs
9. Limiting values
Table 10. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
Min
Max
Unit
VCC
supply voltage
−0.5
+4.6
V
IIK
input clamping current
VI < 0 V
-
−50
mA
VI
input voltage
A port (LVTTL)
−0.5[1]
+4.6
V
B port (GTL)
−0.5[1]
+4.6
V
IOK
output clamping current
VO < 0 V
-
−50
mA
VO
output voltage
output in OFF or HIGH state; A port
−0.5[1]
+4.6
V
output in OFF or HIGH state; B port
−0.5[1]
+4.6
V
A port
-
32
mA
B port
-
30
mA
A port
-
−32
mA
−60
+150
°C
-
+125
°C
current[2]
IOL
LOW-level output
IOH
HIGH-level output current[3]
Tstg
storage temperature
Tj(max)
[4]
maximum junction temperature
[1]
The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.
[2]
Current into any output in the LOW state.
[3]
Current into any output in the HIGH state.
[4]
The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150 °C.
10. Recommended operating conditions
Table 11.
Operating conditions
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VCC
supply voltage
3.0
3.3
3.6
V
VTT
termination voltage
GTL
-
1.2
-
V
Vref
reference voltage
GTL
0.64
0.8
1.1
V
VI
input voltage
A port
0
3.3
3.6
V
B port
0
VTT
3.6
V
VIH
HIGH-level input voltage
A port and ENn
2
-
-
V
B port
Vref + 0.050
-
-
V
A port and ENn
-
-
0.8
V
VIL
LOW-level input voltage
B port
-
-
Vref − 0.050
V
IOH
HIGH-level output current
A port
-
-
−16
mA
IOL
LOW-level output current
A port
-
-
16
mA
B port
-
-
15
mA
operating in free-air
−40
-
+85
°C
Tamb
ambient temperature
GTL2008_GTL2107_2
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 02 — 26 September 2006
8 of 20
GTL2008; GTL2107
Philips Semiconductors
GTL translator with power good control and high-impedance outputs
11. Static characteristics
Table 12. Static characteristics
Recommended operating conditions; voltages are referenced to GND (ground = 0 V). Tamb = −40 °C to +85 °C
Symbol
VOH
Typ[1]
Max
Unit
9AO; VCC = 3.0 V to 3.6 V; IOH = −100 µA
[2]
VCC − 0.2
3.0
-
V
9AO; VCC = 3.0 V; IOH = −16 mA
[2]
2.1
2.3
-
V
A port; VCC = 3.0 V; IOL = 4 mA
[2]
-
0.15
0.4
V
A port; VCC = 3.0 V; IOL = 8 mA
[2]
-
0.3
0.55
V
A port; VCC = 3.0 V; IOL = 16 mA
[2]
-
0.6
0.8
V
B port; VCC = 3.0 V; IOL = 15 mA
[2]
Conditions
HIGH-level output
voltage
LOW-level output
voltage
VOL
Min
Parameter
-
0.13
0.4
V
IOH
HIGH-level output
current
open-drain outputs; A port other than 9AO;
VO = VCC; VCC = 3.6 V
-
-
±1
µA
II
input current
A port; VCC = 3.6 V; VI = VCC
-
-
±1
µA
A port; VCC = 3.6 V; VI = 0 V
-
-
±1
µA
B port; VCC = 3.6 V; VI = VTT or GND
-
-
±1
µA
ICC
supply current
A or B port; VCC = 3.6 V; VI = VCC or GND;
IO = 0 mA
-
8
12
mA
∆ICC[3]
additional supply
current
per input; A port or control inputs;
VCC = 3.6 V; VI = VCC − 0.6 V
-
-
500
µA
Cio
input/output
capacitance
A port; VO = 3.0 V or 0 V
-
2.5
3.5
pF
B port; VO = VTT or 0 V
-
1.5
2.5
pF
[1]
All typical values are measured at VCC = 3.3 V and Tamb = 25 °C.
[2]
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[3]
This is the increase in supply current for each input that is at the specified LVTTL voltage level rather than VCC or GND.
GTL2008_GTL2107_2
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 02 — 26 September 2006
9 of 20
GTL2008; GTL2107
Philips Semiconductors
GTL translator with power good control and high-impedance outputs
12. Dynamic characteristics
Table 13. Dynamic characteristics
VCC = 3.3 V ± 0.3 V
Symbol Parameter
Conditions
Min
Typ[1]
Max
Unit
nA to nBI; see Figure 4
1
4
8
ns
9BI to 9AO; see Figure 5
2
5.5
10
ns
nBI to nA or nAO (open-drain outputs);
see Figure 14
2
13
18
ns
Vref = 0.73 V; VTT = 1.1 V
tPLH
tPHL
LOW-to-HIGH propagation delay
HIGH-to-LOW propagation delay
9BI to 10BOn
2
6
11
ns
11A to 11BO; see Figure 10
1
4
8
ns
11BI to 11A; see Figure 9
2
7.5
11
ns
11BI to 11BO
2
8
13
ns
5BI to 7BO1 or 6BI to 7BO2;
see Figure 7
4
7
12
ns
nA to nBI; see Figure 4
2
5.5
10
ns
9BI to 9AO; see Figure 5
2
5.5
10
ns
nBI to nA or nAO (open-drain outputs);
see Figure 14
2
4
10
ns
9BI to 10BOn
2
6
11
ns
11A to 11BO; see Figure 10
1
5.5
10
ns
2
8.5
13
ns
2
14
21
ns
5BI to 7BO1 or 6BI to 7BO2;
see Figure 7
100
205
350
ns
EN1 to nAO or EN2 to nAO;
see Figure 8
1
3
10
ns
EN1 to 5A (I/O) or EN2 to 6A (I/O);
see Figure 8
1
3
7
ns
EN1 to nAO or EN2 to nAO;
see Figure 8
2
7
10
ns
EN1 to 5A (I/O) or EN2 to 6A (I/O);
see Figure 8
2
7
10
ns
11BI to 11A; see Figure 9
11BI to 11BO
tPLZ
tPZL
LOW to OFF-state
propagation delay
OFF-state to LOW
propagation delay
[2]
tPHZ
HIGH to OFF-state
propagation delay
EN2 to 9AO; see Figure 11
2
5
10
ns
tPZH
OFF-state to HIGH
propagation delay
EN2 to 9AO; see Figure 11
1
4
10
ns
GTL2008_GTL2107_2
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 02 — 26 September 2006
10 of 20
GTL2008; GTL2107
Philips Semiconductors
GTL translator with power good control and high-impedance outputs
Table 13. Dynamic characteristics …continued
VCC = 3.3 V ± 0.3 V
Symbol Parameter
Conditions
Min
Typ[1]
Max
Unit
nA to nBI; see Figure 4
1
4
8
ns
Vref = 0.76 V; VTT = 1.2 V
LOW-to-HIGH propagation delay
tPLH
HIGH-to-LOW propagation delay
tPHL
9BI to 9AO; see Figure 5
2
5.5
10
ns
nBI to nA or nAO (open-drain outputs);
see Figure 14
2
13
18
ns
9BI to 10BOn
2
6
11
ns
11A to 11BO; see Figure 10
1
4
8
ns
11BI to 11A; see Figure 9
2
7.5
11
ns
11BI to 11BO
2
8
13
ns
5BI to 7BO1 or 6BI to 7BO2;
see Figure 7
4
7
12
ns
nA to nBI; see Figure 4
2
5.5
10
ns
9BI to 9AO; see Figure 5
2
5.5
10
ns
nBI to nA or nAO (open-drain outputs);
see Figure 14
2
4
10
ns
9BI to 10BOn
2
6
11
ns
11A to 11BO; see Figure 10
1
5.5
10
ns
2
8.5
13
ns
11BI to 11A; see Figure 9
2
14
21
ns
5BI to 7BO1 or 6BI to 7BO2;
see Figure 7
100
205
350
ns
EN1 to nAO or EN2 to nAO;
see Figure 8
1
3
10
ns
EN1 to 5A (I/O) or EN2 to 6A (I/O);
see Figure 8
1
3
7
ns
EN1 to nAO or EN2 to nAO;
see Figure 8
2
7
10
ns
EN1 to 5A (I/O) or EN2 to 6A (I/O);
see Figure 8
2
7
10
ns
11BI to 11BO
LOW to OFF-state propagation
delay
tPLZ
OFF-state to LOW
propagation delay
tPZL
[2]
tPHZ
HIGH to OFF-state
propagation delay
EN2 to 9AO; see Figure 11
2
5
10
ns
tPZH
OFF-state to HIGH
propagation delay
EN2 to 9AO; see Figure 11
2
4
10
ns
[1]
All typical values are at VCC = 3.3 V and Tamb = 25 °C.
[2]
Includes ~7.6 ns RC rise time of test load pull-up on 11A, 1.5 kΩ pull-up and 21 pF load on 11A has about 23 ns RC rise time.
GTL2008_GTL2107_2
Product data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 02 — 26 September 2006
11 of 20
GTL2008; GTL2107
Philips Semiconductors
GTL translator with power good control and high-impedance outputs
12.1 Waveforms
VM = 1.5 V at VCC ≥ 3.0 V for A ports; VM = Vref for B ports.
3.0 V
input
1.5 V
1.5 V
0V
tPLH
tp
tPHL
VTT
VOH
VM
output
VM
Vref
Vref
VOL
0V
002aab000
002aaa999
VM = 1.5 V for A port and Vref for B port
A port to B port
a. Pulse duration
b. Propagation delay times
Fig 4. Voltage waveforms
VTT
input
Vref
Vref
VTT
input
1/ V
3 TT
tPLH
tPHL
Vref
Vref
tPZL
tPLZ
1/ V
3 TT
VOH
1.5 V
output
1.5 V
VCC
output
1.5 V
VOL + 0.3 V
VOL
002aab001
002aab002
PRR ≤ 10 MHz; Zo = 50 Ω; tr ≤ 2.5 ns; tf ≤ 2.5 ns
Fig 5. Propagation delay, 9BI to 9AO
Fig 6. nBI to nA (I/O) or nBI to nAO open-drain outputs
VTT
input
Vref
Vref
tPLH
tPHL
3.0 V
input
1/ V
3 TT
1.5 V
1.5 V
tPLZ
tPZL
0V
VTT
output
Vref
VOH
output
Vref
VOL
002aac195
Fig 7. 5BI to 7BO1 or 6BI to 7BO2
1.5 V
VOL
002aab005
Fig 8. EN1 to 5A (I/O) or EN2 to 6A (I/O) or EN1 to nAO
or EN2 to nAO
GTL2008_GTL2107_2
Product data sheet
VOL + 0.3 V
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GTL2008; GTL2107
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GTL translator with power good control and high-impedance outputs
VTT
input
Vref
Vref
tPLZ
tPZL
3.0 V
input
1.5 V
1.5 V
0V
0V
tPLH
tPHL
VTT
VOH
output
VOL + 0.3 V
output
1.5 V
Vref
Vref
VOL
VOL
002aac196
002aac197
Fig 9. 11BI to 11A
Fig 10. 11A to 11BO
3.0 V
input
1.5 V
1.5 V
tPHZ
tPZH
0V
VOH
output
VOL + 0.3 V
1.5 V
VOL
002aab980
Fig 11. EN2 to 9AO
GTL2008_GTL2107_2
Product data sheet
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Rev. 02 — 26 September 2006
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GTL2008; GTL2107
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GTL translator with power good control and high-impedance outputs
13. Test information
VCC
PULSE
GENERATOR
VI
VO
DUT
RL
500 Ω
CL
50 pF
RT
002aab981
Fig 12. Load circuit for A outputs (9AO)
VTT
VCC
50 Ω
VI
PULSE
GENERATOR
VO
DUT
CL
30 pF
RT
002aab264
Fig 13. Load circuit for B outputs
VCC
VCC
PULSE
GENERATOR
VI
RL
1.5 kΩ
VO
DUT
CL
21 pF
RT
002aab265
Fig 14. Load circuit for open-drain LVTTL I/O and open-drain outputs
6V
VCC
PULSE
GENERATOR
VI
RL
500 Ω
VO
DUT
RT
CL
50 pF
RL
500 Ω
002aab982
Fig 15. Load circuit for 9AO OFF-state to LOW and LOW to OFF-state
RL — Load resistor
CL — Load capacitance; includes jig and probe capacitance
RT — Termination resistance; should be equal to Zo of pulse generators.
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Product data sheet
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Rev. 02 — 26 September 2006
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GTL translator with power good control and high-impedance outputs
14. Package outline
TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm
D
SOT361-1
E
A
X
c
HE
y
v M A
Z
15
28
Q
A2
(A 3)
A1
pin 1 index
A
θ
Lp
1
L
14
detail X
w M
bp
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
9.8
9.6
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.8
0.5
8
o
0
o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT361-1
REFERENCES
IEC
JEDEC
JEITA
MO-153
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 16. Package outline SOT361-1 (TSSOP28)
GTL2008_GTL2107_2
Product data sheet
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Rev. 02 — 26 September 2006
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15. Soldering
15.1 Introduction to soldering surface mount packages
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
15.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow temperatures range from 215 °C to 260 °C depending on solder paste
material. The peak top-surface temperature of the packages should be kept below:
Table 14.
SnPb eutectic process - package peak reflow temperatures (from J-STD-020C
July 2004)
Package thickness
Volume mm3 < 350
Volume mm3 ≥ 350
< 2.5 mm
240 °C + 0/−5 °C
225 °C + 0/−5 °C
≥ 2.5 mm
225 °C + 0/−5 °C
225 °C + 0/−5 °C
Table 15.
Pb-free process - package peak reflow temperatures (from J-STD-020C July
2004)
Package thickness
Volume mm3 < 350
Volume mm3 350 to
2000
Volume mm3 > 2000
< 1.6 mm
260 °C + 0 °C
260 °C + 0 °C
260 °C + 0 °C
1.6 mm to 2.5 mm
260 °C + 0 °C
250 °C + 0 °C
245 °C + 0 °C
≥ 2.5 mm
250 °C + 0 °C
245 °C + 0 °C
245 °C + 0 °C
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
15.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
• Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
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Product data sheet
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GTL translator with power good control and high-impedance outputs
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45° angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250 °C
or 265 °C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.
15.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270 °C and 320 °C.
15.5 Package related soldering information
Table 16.
Suitability of surface mount IC packages for wave and reflow soldering methods
Package[1]
Soldering method
Wave
Reflow[2]
BGA, HTSSON..T[3], LBGA, LFBGA, SQFP,
SSOP..T[3], TFBGA, VFBGA, XSON
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
not suitable[4]
suitable
PLCC[5], SO, SOJ
suitable
suitable
not
recommended[5][6]
suitable
SSOP, TSSOP, VSO, VSSOP
not
recommended[7]
suitable
CWQCCN..L[8],
not suitable
LQFP, QFP, TQFP
PMFP[9],
WQCCN..L[8]
[1]
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026);
order a copy from your Philips Semiconductors sales office.
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods.
GTL2008_GTL2107_2
Product data sheet
not suitable
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Rev. 02 — 26 September 2006
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GTL2008; GTL2107
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GTL translator with power good control and high-impedance outputs
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
16. Abbreviations
Table 17.
Abbreviations
Acronym
Description
CDM
Charged Device Model
CMOS
Complementary Metal Oxide Semiconductor
CPU
Central Processing Unit
DUT
Device Under Test
ESD
ElectroStatic Discharge
GTL
Gunning Transceiver Logic
HBM
Human Body Model
LVTTL
Low Voltage Transistor-Transistor Logic
MM
Machine Model
PRR
Pulse Rate Repetition
TTL
Transistor-Transistor Logic
VRD
Voltage Regulator Down
17. Revision history
Table 18.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
GTL2008_GTL2107_2
20060926
Product data sheet
-
GTL2008_1
Modifications:
GTL2008_1
•
•
•
Added type number GTL2017
•
Table 10 “Limiting values”: removed (old) Table note 1 (information is now in Section 18
“Legal information”)
•
added “DUT” to Table 17 “Abbreviations”
Section 1 “General description”: added new 7th paragraph
Section 4 “Ordering information”: added type number GTL2107PW to Table 2 “Ordering
information” and following paragraph
20060502
Product data sheet
GTL2008_GTL2107_2
Product data sheet
-
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GTL translator with power good control and high-impedance outputs
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.semiconductors.philips.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Philips Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local Philips Semiconductors
sales office. In case of any inconsistency or conflict with the short data sheet,
the full data sheet shall prevail.
18.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, Philips Semiconductors does not give any representations
or warranties, expressed or implied, as to the accuracy or completeness of
such information and shall have no liability for the consequences of use of
such information.
Right to make changes — Philips Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — Philips Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a Philips Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. Philips Semiconductors accepts no liability for inclusion and/or use
of Philips Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is for the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Philips Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — Philips Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.semiconductors.philips.com/profile/terms, including those
pertaining to warranty, intellectual property rights infringement and limitation
of liability, unless explicitly otherwise agreed to in writing by Philips
Semiconductors. In case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: [email protected]
GTL2008_GTL2107_2
Product data sheet
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Rev. 02 — 26 September 2006
19 of 20
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GTL translator with power good control and high-impedance outputs
20. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
8
9
10
11
12
12.1
13
14
15
15.1
15.2
15.3
15.4
15.5
16
17
18
18.1
18.2
18.3
18.4
19
20
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Function tables . . . . . . . . . . . . . . . . . . . . . . . . . 5
Application design-in information . . . . . . . . . . 7
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8
Recommended operating conditions. . . . . . . . 8
Static characteristics. . . . . . . . . . . . . . . . . . . . . 9
Dynamic characteristics . . . . . . . . . . . . . . . . . 10
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Test information . . . . . . . . . . . . . . . . . . . . . . . . 14
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 16
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 16
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 17
Package related soldering information . . . . . . 17
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18
Legal information. . . . . . . . . . . . . . . . . . . . . . . 19
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Contact information. . . . . . . . . . . . . . . . . . . . . 19
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© Koninklijke Philips Electronics N.V. 2006.
All rights reserved.
For more information, please visit: http://www.semiconductors.philips.com.
For sales office addresses, email to: [email protected]
Date of release: 26 September 2006
Document identifier: GTL2008_GTL2107_2