PHILIPS BUJ103AD

BUJ103AD
Silicon diffused power transistor
Rev. 01 — 14 December 2004
Product data sheet
1. Product profile
1.1 General description
High-voltage, high-speed planar-passivated NPN power switching transistor in a SOT428
(D-PAK) surface mounted package.
1.2 Features
■ Low thermal resistance
■ Fast switching
1.3 Applications
■ Electronic lighting ballasts
■ Inverters
■ DC-to-DC converters
■ Motor control systems
1.4 Quick reference data
■ VCESM ≤ 700 V
■ Ptot ≤ 80 W
■ IC ≤ 4 A
■ hFEsat = 12.5 (typ)
2. Pinning information
Table 1:
Pinning
Pin
Description
1
base
2
collector
3
emitter
mb
mounting base; connected to collector
Simplified outline
Symbol
mb
2
[1]
1
3
2
1
sym056
3
SOT428 (D-PAK)
[1]
It is not possible to make a connection to pin 2 of the SOT428 (D-PAK) package.
BUJ103AD
Philips Semiconductors
Silicon diffused power transistor
3. Ordering information
Table 2:
Ordering information
Type number
BUJ103AD
Package
Name
Description
Version
D-PAK
plastic single-ended surface mounted package; 3 leads (one lead cropped) SOT428
4. Limiting values
Table 3:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VCESM
peak collector-emitter voltage
VBE = 0 V
-
700
V
VCBO
collector-base voltage
open emitter
-
700
V
VCEO
collector-emitter voltage
open base
-
400
V
IC
collector current (DC)
-
4
A
ICM
peak collector current
-
8
A
IB
base current (DC)
-
2
A
IBM
peak base current
-
4
A
Tmb ≤ 25 °C; see Figure 1
Ptot
total power dissipation
-
80
W
Tstg
storage temperature
−65
+150
°C
Tj
junction temperature
-
150
°C
001aab993
120
Pder
(%)
80
40
0
0
40
80
120
160
Tmb (°C)
P tot
P der ( % ) = ------------------------- × 100%
P tot ( 25 °C )
Fig 1. Normalized total power dissipation as a function of mounting base temperature
9397 750 14195
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 14 December 2004
2 of 12
BUJ103AD
Philips Semiconductors
Silicon diffused power transistor
5. Thermal characteristics
Table 4:
Thermal characteristics
Symbol
Parameter
Conditions
Rth(j-mb)
thermal resistance from junction to mounting base
see Figure 2
thermal resistance from junction to ambient
Rth(j-a)
[1]
[1]
Min
Typ
Max
Unit
-
-
1.56
K/W
-
75
-
K/W
Device mounted on a printed-circuit board; minimum footprint.
001aab998
10
Zth(j-mb)
(K/W)
1
δ = 0.5
0.2
0.1
10−1
0.05
0.02
δ=
Ptot
tp
T
0.01
t
tp
T
10−2
10−5
10−4
10−3
10−2
10−1
1
10
tp (s)
Fig 2. Transient thermal impedance from junction to mounting base as a function of pulse duration
6. Characteristics
Table 5:
Characteristics
Tmb = 25 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Static characteristics
ICES
ICBO
collector-emitter cut-off
current
VBE = 0 V; VCE = VCESMmax
[1]
-
-
1.0
mA
VBE = 0 V; VCE = VCESMmax; Tj = 125 °C
[1]
-
-
2.0
mA
collector-base cut-off current
VBE = 0 V; VCE = VCESMmax
[1]
-
-
1.0
mA
VCEO = VCEOMmax = 400 V
[1]
-
-
0.1
mA
ICEO
collector-emitter cut-off
current
IEBO
emitter-base cut-off current
VEB = 7 V; IC = 0 A
-
-
0.1
mA
VCEOsus
collector-emitter sustaining
voltage
IB = 0 A; IC = 10 mA; L = 25 mH;
see Figure 3 and 4
400
-
-
V
VCEsat
collector-emitter saturation
voltage
IC = 3.0 A; IB = 0.6 A; see Figure 10
-
0.25
1.0
V
VBEsat
base-emitter saturation
voltage
IC = 3.0 A; IB = 0.6 A; see Figure 11
-
0.97
1.5
V
hFE
DC current gain
IC = 1 mA; VCE = 5 V; see Figure 9
10
17
32
IC = 500 mA; VCE = 5 V
13
22
32
9397 750 14195
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 14 December 2004
3 of 12
BUJ103AD
Philips Semiconductors
Silicon diffused power transistor
Table 5:
Characteristics …continued
Tmb = 25 °C; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
hFEsat
DC saturation current gain
IC = 2.0 A; VCE = 5 V
11
16
22
IC = 3.0 A; VCE = 5 V
-
12.5
-
-
0.52
0.6
µs
-
2.7
3.3
µs
-
0.3
0.35
µs
-
1.2
1.4
µs
-
30
60
ns
-
-
1.8
µs
-
-
120
ns
Dynamic characteristics
Switching times (resistive load); see Figure 5 and 6
ton
turn-on time
tstg
storage time
tf
fall time
ICon = 2.5 A; IBon = −IBoff = 0.5 A;
RL = 75 Ω
Switching times (inductive load); see Figure 7 and 8
tstg
storage time
tf
fall time
ICon = 2 A; IBon = 0.4 A; LB = 1 µH;
VBB = −5 V
Switching times (inductive load); see Figure 7 and 8
tstg
storage time
tf
fall time
[1]
ICon = 2 A; IBon = 0.4 A; LB = 1 µH;
VBB = −5 V; Tj = 100 °C
Measured with half sine-wave voltage (curve tracer).
IC
(mA)
50 V
100 Ω to 200 Ω
250
horizontal
oscilloscope
vertical
100
6V
300 Ω
1Ω
30 Hz to 60 Hz
001aab987
10
0
min
VCE (V)
VCEOsus
001aab988
Fig 3. Test circuit for collector-emitter sustaining
voltage
Fig 4. Oscilloscope display for collector-emitter
sustaining voltage test waveform
9397 750 14195
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 14 December 2004
4 of 12
BUJ103AD
Philips Semiconductors
Silicon diffused power transistor
IC
ICon
90 %
90 %
VCC
RL
VIM
0
10 %
RB
DUT
t
tf
tp
tstg
IB
ton
T
toff
001aab989
IBon
10 %
VIM = −6 V to +8 V; VCC = 250 V; tp = 20 µs;
δ = tp/T = 0.01.
t
tr ≤ 30 ns
RB and RL calculated from ICon and IBon
requirements.
−IBoff
Fig 5. Test circuit for resistive load switching
001aab990
Fig 6. Switching times waveforms for resistive load
IC
ICon
90 %
VCC
LC
10 %
IBon
VBB
LB
DUT
001aab991
tf
IB
t
tstg
toff
IBon
t
−IBoff
VCC = 300 V; VBB = −5 V; LC = 200 µH; LB = 1 µH.
Fig 7. Test circuit for inductive load switching
001aab992
Fig 8. Switching times waveforms for inductive load
9397 750 14195
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 14 December 2004
5 of 12
BUJ103AD
Philips Semiconductors
Silicon diffused power transistor
001aab994
102
Tj = 25 °C
001aab995
2.0
VCEsat
(V)
IC = 1 A
2A 3A
4A
1.6
hFE
VCE = 5 V
1.2
10
1V
0.8
0.4
1
10−2
10−1
1
10
0
10−2
10−1
1
IC (A)
10
IB (A)
Tj = 25 °C.
Fig 9. DC current gain as a function of collector
current; typical values
Fig 10. Collector-emitter saturation voltage as a
function of base current; typical values
001aab996
1.4
VBEsat
(V)
1.2
001aab997
VCEsat
(V) 0.5
0.4
1.0
0.8
0.3
0.6
0.2
0.4
0.1
0.2
0
10−1
1
10
0
10−1
IC/IB = 4.
10
IC/IB = 4.
Fig 11. Base-emitter saturation voltage as a function of
collector current; typical values
Fig 12. Collector-emitter saturation voltage as a
function of collector current; typical values
9397 750 14195
Product data sheet
1
IC (A)
IC (A)
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 14 December 2004
6 of 12
BUJ103AD
Philips Semiconductors
Silicon diffused power transistor
001aac000
10
IC
(A)
8
VCC
6
LC
IBon
VBB
VCEclamp
probe point
4
LB
DUT
001aab999
2
0
0
VCEclamp ≤ 1000 V; VCC = 150 V; VBB = −5 V;
LB = 1 µH; LC = 200 µH.
200
400
600
800
1000
VCEclamp (V)
Tj ≤ Tj(max).
Fig 13. Test circuit for reverse bias safe operating area
Fig 14. Reverse bias safe operating area
001aac001
102
IC
(A)
duty cycle = 0.01
10
ICMmax
ICmax
II(3)
(1)
tp = 20 µs
50 µs
100 µs
200 µs
500 µs
DC
1
(2)
10−1
I(3)
10−2
III(3)
10−3
1
102
10
103
VCEclamp (V)
Tmb ≤ 25 °C; Mounted with heatsink compound and 30 ± 5 Newton force on the center of the envelope.
(1) Ptot maximum and Ptot peak maximum lines.
(2) Second breakdown limits.
(3) I = Region of permissible DC operation.
II = Extension for repetitive pulse operation.
III = Extension during turn-on in single transistor converters provided that RBE ≤ 100 Ω and tp ≤ 0.6 µs.
Fig 15. Forward bias safe operating area
7. Package information
Epoxy meets requirements of UL94 V-0 at 1⁄8 inch.
9397 750 14195
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 14 December 2004
7 of 12
BUJ103AD
Philips Semiconductors
Silicon diffused power transistor
8. Package outline
Plastic single-ended surface mounted package (D-PAK); 3 leads (one lead cropped)
SOT428
y
E
A
A
A1
b2
E1
mounting
base
D2
D1
HD
2
L
L2
1
L1
3
b1
b
w
M
c
A
e
e1
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
b
b1
b2
c
D1
D2
min
E
E1
min
e
e1
HD
L
L1
min
L2
w
y
max
mm
2.38
2.22
0.93
0.73
0.89
0.71
1.1
0.9
5.46
5.00
0.56
0.20
6.22
5.98
4.0
6.73
6.47
4.45
2.285
4.57
10.4
9.6
2.95
2.55
0.5
0.9
0.5
0.2
0.2
OUTLINE
VERSION
SOT428
REFERENCES
IEC
JEDEC
JEITA
TO-252
SC-63
EUROPEAN
PROJECTION
ISSUE DATE
01-12-11
04-10-14
Fig 16. Package outline SOT428 (SC-63)
9397 750 14195
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 14 December 2004
8 of 12
BUJ103AD
Philips Semiconductors
Silicon diffused power transistor
9. Mounting
7.0
7.0
1.5
2.15
2.5
4.57
001aab021
Dimensions in mm.
Fig 17. SOT428 soldering pattern for surface mounting
9397 750 14195
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 14 December 2004
9 of 12
BUJ103AD
Philips Semiconductors
Silicon diffused power transistor
10. Revision history
Table 6:
Revision history
Document ID
Release date
Data sheet status
Change notice
Doc. number
Supersedes
BUJ103AD_1
20041214
Product data sheet
-
9397 750 14195
-
9397 750 14195
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 14 December 2004
10 of 12
BUJ103AD
Philips Semiconductors
Silicon diffused power transistor
11. Data sheet status
Level
Data sheet status [1]
Product status [2] [3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
12. Definitions
13. Disclaimers
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
14. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: [email protected]
9397 750 14195
Product data sheet
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Rev. 01 — 14 December 2004
11 of 12
BUJ103AD
Philips Semiconductors
Silicon diffused power transistor
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
13
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Package information . . . . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information . . . . . . . . . . . . . . . . . . . . 11
© Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 14 December 2004
Document number: 9397 750 14195
Published in The Netherlands