PHILIPS KMI15

DISCRETE SEMICONDUCTORS
DATA SHEET
handbook, halfpage
M3D283
KMI15/4
Rotational speed sensor
Product specification
Supersedes data of 2000 Jun 26
2000 Sep 05
Philips Semiconductors
Product specification
Rotational speed sensor
KMI15/4
FEATURES
PINNING
• Digital current output signal
PIN
DESCRIPTION
• Zero speed capability
1
• Wide air gap
VCC
2
V−
• Wide temperature range
• Vibration insensitive
• EMC resistant.
DESCRIPTION
handbook, halfpage
The KMI15/4 sensor detects rotational speed of ferrous
gear wheels and reference marks(1).
The sensor consists of a magnetoresistive sensor
element, a signal conditioning integrated circuit in bipolar
technology and a ferrite magnet. The frequency of the
digital current output signal is proportional to the rotational
speed of a gear wheel.
CAUTION
Do not press two or more products together against their
magnetic forces.
1
2
MBH782
(1) The sensor contains a customized integrated circuit. Usage in
hydraulic brake systems and in systems with active brake
control is forbidden. For all other applications, higher
temperature versions of up to 150 °C are available on
request.
Fig.1 Simplified outline (SOT453C).
QUICK REFERENCE DATA
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
VCC
DC supply voltage
−
12
−
V
Tamb
ambient operating temperature
−40
−
+85
°C
ICC (low)
current output signal low
−
7
−
mA
ICC (high)
current output signal high
−
14
−
mA
ft
operating tooth frequency
0
−
25000
Hz
d
sensing distance
0 to 2.0
0 to 2.3
−
mm
2000 Sep 05
2
Philips Semiconductors
Product specification
Rotational speed sensor
KMI15/4
LIMITING VALUES
In accordance with Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
Tamb = −40 to +85 °C; RL = 115 Ω
VCC
DC supply voltage
Tstg
storage temperature
Tamb
operating ambient temperature
Tsld
soldering temperature
t ≤ 10 s
output short-circuit duration to GND
MAX.
UNIT
−0.5
+16
V
−40
+150
°C
−40
+85
°C
−
260
°C
continuous
CHARACTERISTICS
Tamb = 25 °C; VCC = 12 V; d = 1.5 mm; ft = 2 kHz; test circuit: see Fig.7; RL = 115 Ω; sensor positioning: see Fig.15;
gear wheel: module 2 mm; material 1.0715; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
ICC (low)
current output signal low
ICC (high)
current output signal high
see Figs 6 and 8
11.2
14
16.8
mA
tr
output signal rise time
CL = 100 pF; see Fig.9;
10 to 90% value
−
0.5
−
µs
tf
output signal fall time
CL = 100 pF; see Fig.9;
10 to 90% value
−
0.7
−
µs
td
switching delay time
between stimulation pulse (generated by −
a coil) and output signal
1
−
µs
ft
operating tooth frequency for both rotation directions
0
−
25000
Hz
d
sensing distance
see Fig.15 and note 1
0 to 2.0 0 to 2.3 −
mm
δ
duty cycle
see Fig.6
20
%
see Figs 6 and 8
5.6
7
50
8.4
80
Note
1. High rotational speeds of wheels reduce the sensing distance due to eddy current effects (see Fig.17).
2000 Sep 05
3
mA
Philips Semiconductors
Product specification
Rotational speed sensor
KMI15/4
FUNCTIONAL DESCRIPTION
The KMI15/4 sensor is sensitive to the motion of ferrous
gear wheels or reference marks. The functional principle is
shown in Fig.3. Due to the effect of flux bending, the
different directions of magnetic field lines in the
magnetoresistive sensor element will cause an electrical
signal. Because of the chosen sensor orientation and the
direction of ferrite magnetization, the KMI15/4 is sensitive
to movement in the ‘y’ direction in front of the sensor only
(see Fig.2).
handbook, halfpage
x
x
magnet with
direction of
magnetization
y
The magnetoresistive sensor element signal is amplified,
temperature compensated and passed to a Schmitt-trigger
in the conditioning integrated circuit (Figs 4 and 5).
The digital output signal level (see Fig.6) is at a fixed level
independent of the sensing distance. A (2-wire) output
current enables safe sensor signal transport to the
detecting circuit (see Fig.7). The integrated circuit housing
is separated from the sensor element housing to optimize
the sensor behaviour at high temperatures.
z
sensor
IC
The strength of the magnetic field caused by the
Ferroxdure 100 magnet in the different sensor directions,
measured at the centre of the magnetoresistive bridge, is
typically: Hx = 7 kA/m (auxiliary field) and Hz = 17 kA/m
(perpendicular to the sensor surface). Hy is zero due to the
trimming process.
MBH779
Fig.2 Component detail of the KMI15/4.
gear wheel
handbook, full pagewidth
magnet
z
direction
of
motion
magnetic
field lines
y
sensor
MRA957
(a)
(b)
(c)
Fig.3 Functional principle.
2000 Sep 05
4
(d)
Philips Semiconductors
Product specification
Rotational speed sensor
KMI15/4
handbook, full pagewidth
CONSTANT
CURRENT
SOURCE
VOLTAGE CONTROL
SENSOR
SCHMITT
TRIGGER
AMPLIFIER
V CC
SWITCHABLE
CURRENT
SOURCE
V
MRA958
Fig.4 Block diagram.
VCC
handbook, full pagewidth
constant
current source
switchable
current source
power supply
sensor
Vref
EMC
FILTER
preamplifier
GAP
Schmitttrigger
V
MRA959
Fig.5 Simplified circuit diagram.
2000 Sep 05
5
Philips Semiconductors
Product specification
Rotational speed sensor
KMI15/4
MRA960
handbook, halfpage
I CC
T
14 mA
V
CC
SENSOR
V
7 mA
I CC
tp
CL
RL
GND
t
MRA961
tp
δ = ---- × 100%
T
Fig.6 Output signal as a function of time.
Fig.7 Test and application circuit.
APPLICATION INFORMATION
MRA967
16
MRA968
1
handbook,
halfpage
I
handbook, halfpage
CC
(mA)
14
VCC = 20 V
t
( µ s)
VCC = 12 V
0.8
I CC(high)
tf
VCC = 8 V
12
0.6
tr
10
0.4
VCC = 20 V
8
0.2
I CC(low)
6
ICC
VCC = 12 V
VCC = 8 V
tr
tf
t
4
50
Fig.8
0
50
100
0
150
200
Tamb (oC)
Output current levels as functions of
ambient temperature; typical values.
2000 Sep 05
Fig.9
6
50
0
50
100
150
200
Tamb ( oC)
Output current switching times as functions
of ambient temperature; typical values.
Philips Semiconductors
Product specification
Rotational speed sensor
KMI15/4
Mounting conditions
Gear Wheel Dimensions
The recommended sensor position in front of a gear wheel
is shown in Fig.15. Distance ‘d’ is measured between the
sensor front and the tip of a gear wheel tooth. The KMI15/4
senses ferrous indicators like gear wheels in the ± y
direction only (no rotational symmetry of the sensor); see
Fig.2. The effect of incorrect mounting positions on
sensing distance is shown in Figs 11, 12 and 13.
The symmetrical reference axis of the sensor corresponds
to the axis of the ferrite magnet.
SYMBOL
DESCRIPTION
UNIT
German DIN
z
number of teeth
d
diameter
mm
m
module m = d/z
mm
p
pitch p = π × m
mm
PD
pitch diameter (d in inch)
inch
DP
diametric pitch DP = z/PD
inch−1
CP
circular pitch CP = π/DP
inch
ASA; note1
Environmental conditions
Due to eddy current effects the sensing distance depends
on the tooth frequency (see Fig.17). The influence of gear
wheel module on the sensing distance is shown in Fig.16.
Note
1. For conversion from ASA to DIN: m = 25.4 mm/DP;
p = 25.4 mm × CP.
MBD840
4
handbook, halfpage
y
d
(mm)
pitch
d
ft
3
handbook, halfpage
2
pitch
diameter
MRA964
1
0
0
pitch diameter
module = -----------------------------------------number of teeth
1
2
3
y (mm)
4
VCC = 12 V; ft = 2 kHz; module = 2 mm; pitch diameter = 100 mm.
pitch = module × π
Fig.11 Sensing distance as a function of positional
tolerance in the y-axis; typical values.
Fig.10 Gear wheel dimensions.
2000 Sep 05
7
Philips Semiconductors
Product specification
Rotational speed sensor
KMI15/4
MBD841
4
handbook, halfpage
d
(mm)
d
MBD842
3
Θ
handbook, halfpage
d
(mm)
ft
3
2
–
+
2
x
d
1
1
10 mm
0
0
0
1
2
3
θ (deg)
–6
4
–4
–2
0
2
4
6
x (mm)
VCC = 12 V; ft = 2 kHz; module = 2 mm.
VCC = 12 V; ft = 2 kHz; module = 2 mm.
Fig.12 Sensing distance as a function of positional
tolerance; typical values.
Fig.13 Sensing distance as a function of positional
tolerance in the x-axis; typical values.
MBD839
4
handbook, halfpage
d
(mm)
3
handbook, halfpage
d
sensor
d
2
d
1
gear wheel
MRA963
0
-50
0
50
100
150
200
Tamb ( o C)
Fig.14 Typical sensing distance as a function of
ambient temperature; typical values.
2000 Sep 05
Fig.15 Sensor positioning.
8
Philips Semiconductors
Product specification
Rotational speed sensor
KMI15/4
MRA966
1.5
MBD843
4
handbook, halfpage
handbook, halfpage
d
d0
d
(mm)
3
1
2
d
0.5
ft
1
0
0
1
2
3
0
0
4
5
module m (mm)
1
2
3
f t (kHz)
4
d0 = sensing distance for gear wheel with module = 2 mm.
VCC = 12 V; module = 2 mm.
Fig.16 Normalized maximum sensing distance as
a function of a gear wheel module; typical
values.
2000 Sep 05
Fig.17 Sensing distance as a function of tooth
frequency; typical values.
9
Philips Semiconductors
Product specification
Rotational speed sensor
KMI15/4
EMC
The board net often contains a central load dump
protection that makes such a device in the protection
circuit of the sensor module unnecessary.
Figure 18 shows a recommended application circuit for
automotive applications (wheel sensing ft < 5 kHz).
It provides a protection interface to meet Electromagnetic
Compatibility (EMC) standards and safeguard against
voltage spikes Table 1 lists the tests which are applicable
to this circuit and the achieved class of functional status.
Protection against ‘load dump’ (test pulse 5 according to
“DIN 40839”) means a very high demand on the protection
circuit and requires a suitable suppressor diode with
sufficient energy absorption capability.
Table 1
Tests for electrostatic discharge (ESD) were conducted in
line with “IEC 801-2” to demonstrate the KMI15/4’s
handling capabilities. The “IEC 801-2” test conditions
were: C = 150 pF, R = 150 Ω, V = 2 kV.
Electromagnetic disturbances with fields up to 150 V/m
and f = 1 GHz (ref. “DIN 40839”) have no influence on
performance.
EMC test results
EMC REF. DIN 40839
SYMBOL
MIN. (V)
MAX. (V)
REMARKS
CLASS
Test pulse 1
VLD
−100
−
td = 2 ms
C
Test pulse 2
VLD
−
100
td = 0.2 ms
A
Test pulse 3a
VLD
−150
−
td = 0.1 µs
A
Test pulse 3b
VLD
−
100
td = 0.1 µs
A
Test pulse 4
VLD
−7
−
td = 130 ms
B
Test pulse 5
VLD
−
120
td = 400 ms
B
D1
handbook, halfpage
+V
VCC
1N4001/3
BZTO3G36
−V
D2
C1
100
nF
RL
115
Ω
SENSOR
CL
100
nF
MGD805
GND
Fig.18 Test/application circuit for the KMI15/4.
2000 Sep 05
10
Philips Semiconductors
Product specification
Rotational speed sensor
KMI15/4
PACKAGE OUTLINE
Plastic single-ended multi-chip package;
magnetized ferrite magnet (5.5 x 5.5 x 3 mm); 4 interconnections; 2 in-line leads
M1
SOT453C
v M A B
HE1
K
B
A
Q
E
A
L1
M2
bp1
D
D2
L
L3
v M A B
M3
E1
HE
SENSOR DIE POSITION
centre of reading point
*
D1
L2
1
2
bp
c
0
e
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A(1)
bp
bp1
c
1.7
1.4
0.8
0.7
1.57
1.47
0.3
0.24
mm
D(2) D1(2) D2(2) E(2) E1(2)
4.1
3.9
5.7
5.5
3.15
2.95
4.5
4.3
5.7
5.5
e
HE
HE1
K
max.
L
L1
L2
L3
4.6
4.4
18.2
17.8
5.6
5.5
3.87
7.55
7.25
1.2
0.9
3.9
3.5
6.55
6.35
M1
M2
M3(1)
Q
5.65 5.65 3.15 0.75
0.25
5.35 5.35 2.85 0.65
Notes
1. Glue thickness not included.
2. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
2000 Sep 05
EUROPEAN
PROJECTION
ISSUE DATE
99-09-23
00-08-31
SOT453C
11
v
Philips Semiconductors
Product specification
Rotational speed sensor
KMI15/4
DATA SHEET STATUS
DATA SHEET STATUS
PRODUCT
STATUS
DEFINITIONS (1)
Objective specification
Development
This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.
Preliminary specification
Qualification
This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification
Production
This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
DEFINITIONS
DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2000 Sep 05
12
Philips Semiconductors
Product specification
Rotational speed sensor
KMI15/4
NOTES
2000 Sep 05
13
Philips Semiconductors
Product specification
Rotational speed sensor
KMI15/4
NOTES
2000 Sep 05
14
Philips Semiconductors
Product specification
Rotational speed sensor
KMI15/4
NOTES
2000 Sep 05
15
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SCA 70
© Philips Electronics N.V. 2000
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Printed in The Netherlands
613520/04/pp16
Date of release: 2000
Sep 05
Document order number:
9397 750 07471