PHILIPS 74AHC164D

74AHC164; 74AHCT164
8-bit serial-in/parallel-out shift register
Rev. 03 — 24 April 2008
Product data sheet
1. General description
The 74AHC164; 74AHCT164 shift register is a high-speed Si-gate CMOS device and is
pin compatible with Low-power Schottky TTL (LSTTL). It is specified in compliance with
JEDEC standard No. 7A.
The 74AHC164; 74AHCT164 input signals are 8-bit serial through one of two inputs (DSA
or DSB); either input can be used as an active HIGH enable for data entry through the
other input. Both inputs must be connected together or an unused input must be tied
HIGH.
Data shifts one place to the right on each LOW-to-HIGH transition of the clock input (CP)
and enters into output Q0, which is a logical AND of the two data inputs (DSA and DSB)
that existed one set-up time prior to the rising clock edge.
A LOW-level on the master reset (MR) input overrides all other inputs and clears the
register asynchronously, forcing all outputs LOW.
2. Features
n
n
n
n
Balanced propagation delays
All inputs have Schmitt-trigger actions
Inputs accept voltages higher than VCC
Input levels:
u For 74AHC164: CMOS level
u For 74AHCT164: TTL level
n ESD protection:
u HBM EIA/JESD22-A114E exceeds 2000 V
u MM EIA/JESD22-A115-A exceeds 200 V
u CDM EIA/JESD22-C101C exceeds 1000 V
n Multiple package options
n Specified from −40 °C to +85 °C and from −40 °C to +125 °C
74AHC164; 74AHCT164
NXP Semiconductors
8-bit serial-in/parallel-out shift register
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
Description
Version
74AHC164D
−40 °C to +125 °C
SO14
plastic small outline package; 14 leads;
body width 3.9 mm
SOT108-1
74AHC164PW
−40 °C to +125 °C
TSSOP14
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
SOT402-1
74AHC164BQ
−40 °C to +125 °C
DHVQFN14
plastic dual in-line compatible thermal enhanced very SOT762-1
thin quad flat package; no leads; 14 terminals; body
2.5 × 3 × 0.85 mm
74AHCT164D
−40 °C to +125 °C
SO14
plastic small outline package; 14 leads;
body width 3.9 mm
SOT108-1
74AHCT164PW
−40 °C to +125 °C
TSSOP14
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
SOT402-1
74AHCT164BQ
−40 °C to +125 °C
DHVQFN14
plastic dual in-line compatible thermal enhanced very SOT762-1
thin quad flat package; no leads; 14 terminals; body
2.5 × 3 × 0.85 mm
74AHC164
74AHCT164
4. Functional diagram
DSA
DSB
CP
MR
1
2
8
8-BIT SERIAL−IN/PARALLEL−OUT
SHIFT REGISTER
9
3
4
5
6
10
11
12
13
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
001aac425
Fig 1.
Functional diagram
74AHC_AHCT164_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 April 2008
2 of 18
74AHC164; 74AHCT164
NXP Semiconductors
8-bit serial-in/parallel-out shift register
SRG8
8
C1/
9
R
1
2
&
3
1D
4
DSA
DSB
1
2
8
CP
9
MR
5
3
Q0
4
Q1
6
5
Q2
10
6
Q3
10
Q4
11
Q5
12
Q6
13
Q7
11
12
13
001aac424
001aac423
Fig 2.
Logic symbol
Fig 3.
IEC logic symbol
DSA
D
Q
D
CP
FF1
RD
DSB
Q
D
CP
FF2
RD
Q
D
CP
FF3
RD
Q
D
CP
FF4
RD
Q
D
CP
FF5
RD
Q
D
CP
FF6
RD
Q
D
CP
FF7
RD
Q
CP
FF8
RD
CP
MR
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
001aac616
Fig 4.
Logic diagram
74AHC_AHCT164_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 April 2008
3 of 18
74AHC164; 74AHCT164
NXP Semiconductors
8-bit serial-in/parallel-out shift register
5. Pinning information
14 VCC
DSB
2
13 Q7
Q0
3
Q1
4
164
terminal 1
index area
14 VCC
1
1
DSA
DSA
5.1 Pinning
DSB
2
13 Q7
12 Q6
Q0
3
12 Q6
11 Q5
Q1
4
164
11 Q5
Q2
5
GND(1)
10 Q4
Q3
6
5
Q3
6
9
MR
7
8
GND
7
8
CP
GND
CP
10 Q4
Q2
9
MR
001aac828
Transparent top view
001aac422
(1) The die substrate is attached to this pad using
conductive die attach material. It can not be used as a
supply pin or input.
Fig 5.
Pin configuration SO14 and TSSOP14
Fig 6.
Pin configuration DHVQFN14
5.2 Pin description
Table 2.
Pin description
Symbol
Pin
Description
DSA
1
serial data input A
DSB
2
serial data input B
Q0
3
output 0
Q1
4
output 1
Q2
5
output 2
Q3
6
output 3
GND
7
ground (0 V)
CP
8
clock input (LOW-to-HIGH edge-triggered)
MR
9
master reset input (active LOW)
Q4
10
output 4
Q5
11
output 5
Q6
12
output 6
Q7
13
output 7
VCC
14
supply voltage
74AHC_AHCT164_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 April 2008
4 of 18
74AHC164; 74AHCT164
NXP Semiconductors
8-bit serial-in/parallel-out shift register
6. Functional description
Table 3.
Function table[1]
Operating mode
Control
Input
Output
MR
CP
DSA
DSB
Q0
Q1 to Q7
Reset (clear)
L
X
X
X
L
L to L
Shift
H
↑
l
l
L
q0 to q6
l
h
L
q0 to q6
h
l
L
q0 to q6
h
h
H
q0 to q6
[1]
H = HIGH voltage level;
h = HIGH voltage level one set-up time prior to the LOW-to-HIGH clock transition;
L = LOW voltage level;
l = LOW voltage level one set-up time prior to the LOW-to-HIGH clock transition;
↑ = LOW-to-HIGH transition;
X = don’t care;
q = lower case letter indicates the state of the referenced input one set-up time prior to the LOW-to-HIGH transition.
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
VI
input voltage
Conditions
input clamping current
VI < −0.5 V
[1]
IOK
output clamping current
VO < −0.5 V or VO > VCC + 0.5 V
[1]
IO
output current
VO = −0.5 V to (VCC + 0.5 V)
ICC
IIK
Min
Max
Unit
−0.5
+7.0
V
−0.5
+7.0
V
−20
-
mA
−20
+20
mA
−25
+25
mA
supply current
-
+75
mA
IGND
ground current
−75
-
mA
Tstg
storage temperature
−65
+150
°C
Ptot
total power dissipation
-
500
mW
Tamb = −40 °C to +125 °C
[2]
[1]
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2]
For SO14 packages: above 70 °C the value of Ptot derates linearly at 8 mW/K.
For TSSOP14 packages: above 60 °C the value of Ptot derates linearly at 5.5 mW/K.
For DHVQFN14 packages: above 60 °C the value of Ptot derates linearly at 4.5 mW/K.
74AHC_AHCT164_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 April 2008
5 of 18
74AHC164; 74AHCT164
NXP Semiconductors
8-bit serial-in/parallel-out shift register
8. Recommended operating conditions
Table 5.
Operating conditions
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
74AHC164
VCC
supply voltage
2.0
5.0
5.5
V
VI
input voltage
0
-
5.5
V
VO
output voltage
0
-
VCC
V
Tamb
ambient temperature
−40
+25
+125
°C
∆t/∆V
input transition rise and fall rate
VCC = 3.0 V to 3.6 V
-
-
100
ns/V
VCC = 4.5 V to 5.5 V
-
-
20
ns/V
74AHCT164
VCC
supply voltage
4.5
5.0
5.5
V
VI
input voltage
0
-
5.5
V
VO
output voltage
0
-
VCC
V
Tamb
ambient temperature
−40
+25
+125
°C
∆t/∆V
input transition rise and fall rate
-
-
20
ns/V
VCC = 4.5 V to 5.5 V
9. Static characteristics
Table 6.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
25 °C
Conditions
−40 °C to +85 °C −40 °C to +125 °C Unit
Min
Typ
Max
Min
Max
Min
Max
74AHC164
VIH
VIL
VOH
VOL
HIGH-level
input voltage
VCC = 2.0 V
1.5
-
-
1.5
-
1.5
-
V
VCC = 3.0 V
2.1
-
-
2.1
-
2.1
-
V
VCC = 5.5 V
3.85
-
-
3.85
-
3.85
-
V
LOW-level
input voltage
VCC = 2.0 V
-
-
0.5
-
0.5
-
0.5
V
VCC = 3.0 V
-
-
0.9
-
0.9
-
0.9
V
VCC = 5.5 V
-
-
1.65
-
1.65
-
1.65
V
HIGH-level
VI = VIH or VIL
output voltage
IO = −50 µA; VCC = 2.0 V
1.9
2.0
-
1.9
-
1.9
-
V
IO = −50 µA; VCC = 3.0 V
2.9
3.0
-
2.9
-
2.9
-
V
IO = −50 µA; VCC = 4.5 V
4.4
4.5
-
4.4
-
4.4
-
V
IO = −4.0 mA; VCC = 3.0 V
2.58
-
-
2.48
-
2.40
-
V
IO = −8.0 mA; VCC = 4.5 V
3.94
-
-
3.80
-
3.70
-
V
LOW-level
VI = VIH or VIL
output voltage
IO = 50 µA; VCC = 2.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 50 µA; VCC = 3.0 V
-
0
0.1
-
0.1
-
0.1
V
IO = 50 µA; VCC = 4.5 V
-
0
0.1
-
0.1
-
0.1
V
IO = 4.0 mA; VCC = 3.0 V
-
-
0.36
-
0.44
-
0.55
V
IO = 8.0 mA; VCC = 4.5 V
-
-
0.36
-
0.44
-
0.55
V
74AHC_AHCT164_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 April 2008
6 of 18
74AHC164; 74AHCT164
NXP Semiconductors
8-bit serial-in/parallel-out shift register
Table 6.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
25 °C
Conditions
VI = 5.5 V or GND;
VCC = 0 V to 5.5 V
−40 °C to +85 °C −40 °C to +125 °C Unit
Min
Typ
Max
Min
Max
Min
Max
-
-
0.1
-
1.0
-
2.0
µA
II
input leakage
current
ICC
supply current VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
4.0
-
40
-
80
µA
CI
input
capacitance
-
3
10
-
-
-
-
pF
74AHCT164
VIH
HIGH-level
input voltage
VCC = 4.5 V to 5.5 V
2.0
-
-
2.0
-
2.0
-
V
VIL
LOW-level
input voltage
VCC = 4.5 V to 5.5 V
-
-
0.8
-
0.8
-
0.8
V
VOH
HIGH-level
VI = VIH or VIL; VCC = 4.5 V
output voltage
IO = −50 µA
4.4
4.5
-
4.4
-
4.4
-
V
3.94
-
-
3.80
-
3.70
-
V
-
0
0.1
-
0.1
-
0.1
V
-
-
0.36
-
0.44
-
0.55
V
-
-
0.1
-
1.0
-
2.0
µA
IO = −8.0 mA
VOL
LOW-level
VI = VIH or VIL; VCC = 4.5 V
output voltage
IO = 50 µA
IO = 8.0 mA
II
input leakage
current
VI = 5.5 V or GND;
VCC = 0 V to 5.5 V
ICC
supply current VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
4.0
-
40
-
80
µA
∆ICC
additional
per input pin;
supply current VI = VCC − 2.1 V; IO = 0 A;
other pins at VCC or GND;
VCC = 4.5 V to 5.5 V
-
-
1.35
-
1.5
-
1.5
mA
CI
input
capacitance
-
3
10
-
-
-
-
pF
74AHC_AHCT164_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 April 2008
7 of 18
74AHC164; 74AHCT164
NXP Semiconductors
8-bit serial-in/parallel-out shift register
10. Dynamic characteristics
Table 7.
Dynamic characteristics
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 10.
Symbol Parameter
25 °C
Conditions
−40 °C to +85 °C −40 °C to +125 °C Unit
Min
Typ[1]
Max
Min
Max
Min
Max
CL = 15 pF
-
6.5
12.8
1.0
15.0
1.0
16.0
ns
CL = 50 pF
-
9.3
16.3
1.0
18.5
1.0
20.5
ns
-
4.5
9.0
1.0
10.5
1.0
11.5
ns
-
6.4
11.0
1.0
12.5
1.0
14.0
ns
CL = 15 pF
-
5.3
12.8
1.0
15.0
1.0
16.0
ns
CL = 50 pF
-
7.6
16.3
1.0
18.5
1.0
20.5
ns
CL = 15 pF
-
4.0
8.6
1.0
10.0
1.0
11.0
ns
CL = 50 pF
-
5.8
10.6
1.0
12.0
1.0
13.5
ns
CL = 15 pF
80
125
-
65
-
50
-
MHz
CL = 50 pF
50
75
-
45
-
35
-
MHz
74AHC164
tpd
propagation CP to Qn; see Figure 7
delay
VCC = 3.0 V to 3.6 V
[2]
VCC = 4.5 V to 5.5 V
CL = 15 pF
CL = 50 pF
MR to Qn; see Figure 8
[3]
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
fmax
maximum
frequency
see Figure 7
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
tW
tWL
tsu
th
pulse width
CL = 15 pF
125
175
-
105
-
85
-
MHz
CL = 50 pF
85
115
-
75
-
65
-
MHz
VCC = 3.0 V to 3.6 V
5.0
-
-
5.0
-
5.0
-
ns
VCC = 4.5 V to 5.5 V
5.0
-
-
5.0
-
5.0
-
ns
VCC = 3.0 V to 3.6 V
5.0
-
-
5.0
-
5.0
-
ns
VCC = 4.5 V to 5.5 V
5.0
-
-
5.0
-
5.0
-
ns
VCC = 3.0 V to 3.6 V
5.0
-
-
6.0
-
6.0
-
ns
VCC = 4.5 V to 5.5 V
4.5
-
-
4.5
-
4.5
-
ns
VCC = 3.0 V to 3.6 V
1.5
-
-
1.5
-
1.5
-
ns
VCC = 4.5 V to 5.5 V
2.0
-
-
2.0
-
2.0
-
ns
CP HIGH or LOW;
see Figure 7
pulse width
LOW
MR; see Figure 8
set-up time
DSA, DSB to CP;
see Figure 9
hold time
DSA, DSB to CP;
see Figure 9
74AHC_AHCT164_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 April 2008
8 of 18
74AHC164; 74AHCT164
NXP Semiconductors
8-bit serial-in/parallel-out shift register
Table 7.
Dynamic characteristics …continued
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 10.
Symbol Parameter
trec
CPD
recovery
time
25 °C
Conditions
−40 °C to +85 °C −40 °C to +125 °C Unit
Min
Typ[1]
Max
Min
Max
Min
Max
VCC = 3.0 V to 3.6 V
2.5
-
-
2.5
-
2.5
-
ns
VCC = 4.5 V to 5.5 V
2.5
-
-
2.5
-
2.5
-
ns
-
48
-
-
-
-
-
pF
-
3.4
9.0
1.0
10.5
1.0
11.5
ns
-
4.9
11.0
1.0
12.5
1.0
14.0
ns
CL = 15 pF
-
3.5
8.6
1.0
10.0
1.0
11.0
ns
CL = 50 pF
-
5.0
10.6
1.0
12.0
1.0
13.5
ns
CL = 15 pF
125
175
-
105
-
85
-
MHz
CL = 50 pF
85
115
-
75
-
65
-
MHz
MR to CP; see Figure 8
fi = 1 MHz; VI = GND to VCC
power
dissipation
capacitance
[4]
74AHCT164; VCC = 4.5 V to 5.5 V
tpd
[2]
propagation CP to Qn; see Figure 7
delay
CL = 15 pF
CL = 50 pF
[3]
MR to Qn; see Figure 8
fmax
maximum
frequency
see Figure 7
tW
pulse width
CP HIGH or LOW;
see Figure 7
5.0
-
-
5.0
-
5.0
-
ns
tWL
pulse width
LOW
MR; see Figure 8
5.0
-
-
5.0
-
5.0
-
ns
tsu
set-up time
DSA, DSB to CP;
see Figure 9
4.5
-
-
4.5
-
4.5
-
ns
th
hold time
DSA, DSB to CP;
see Figure 9
2.0
-
-
2.0
-
2.0
-
ns
trec
recovery
time
MR to CP; see Figure 8
2.5
-
-
2.5
-
2.5
-
ns
CPD
power
fi = 1 MHz; VI = GND to VCC
dissipation
capacitance
-
51
-
-
-
-
-
pF
[4]
[1]
Typical values are measured at nominal supply voltage (VCC = 3.3 V and VCC = 5.0 V).
[2]
tpd is the same as tPLH and tPHL.
[3]
tpd is the same as tPHL only.
[4]
CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
Σ(CL × VCC2 × fo) = sum of the outputs.
74AHC_AHCT164_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 April 2008
9 of 18
74AHC164; 74AHCT164
NXP Semiconductors
8-bit serial-in/parallel-out shift register
11. Waveforms
1/fmax
VI
CP input
VM
GND
tW
t PHL
t PLH
VOH
VM
Qn output
001aac426
VOL
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 7.
Clock pulse width, maximum frequency and input to output propagation delays
VI
VM
MR input
GND
t WL
t rec
VI
CP input
VM
GND
t PHL
VOH
VM
Qn output
VOL
001aac446
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 8.
Master reset pulse width, recovery time and propagation delays
74AHC_AHCT164_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 April 2008
10 of 18
74AHC164; 74AHCT164
NXP Semiconductors
8-bit serial-in/parallel-out shift register
VI
VM
CP input
GND
t su
t su
th
th
VI
VM
DSA, DSB input
GND
VOH
VM
Qn output
VOL
001aaf612
Measurement points are given in Table 8.
The shaded areas indicate when the input is permitted to change for predictable output performance.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 9.
Data set-up and hold times
Table 8.
Measurement points
Type
Input
Output
VM
VM
74AHC164
0.5 × VCC
0.5 × VCC
74AHCT164
1.5 V
0.5 × VCC
74AHC_AHCT164_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 April 2008
11 of 18
74AHC164; 74AHCT164
NXP Semiconductors
8-bit serial-in/parallel-out shift register
VI
negative
pulse
tW
90 %
VM
VM
10 %
GND
tr
tf
tr
VI
positive
pulse
GND
tf
90 %
VM
VM
10 %
tW
VCC
G
VI
VO
DUT
RT
CL
001aah768
Test data is given in Table 9.
Definitions test circuit:
RT = Termination resistance should be equal to output impedance Zo of the pulse generator
CL = Load capacitance including jig and probe capacitance
Fig 10. Load circuitry for measuring switching times
Table 9.
Test data
Type
Input
Load
Test
VI
tr, tf
CL
74AHC164
VCC
≤ 3.0 ns
15 pF, 50 pF
tPLH, tPHL
74AHCT164
3.0 V
≤ 3.0 ns
15 pF, 50 pF
tPLH, tPHL
74AHC_AHCT164_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 April 2008
12 of 18
74AHC164; 74AHCT164
NXP Semiconductors
8-bit serial-in/parallel-out shift register
12. Package outline
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
c
y
HE
v M A
Z
8
14
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
7
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.010 0.057
inches 0.069
0.004 0.049
0.05
0.244
0.039
0.041
0.228
0.016
0.028
0.024
0.01
0.01
0.028
0.004
0.012
θ
o
8
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT108-1
076E06
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 11. Package outline SOT108-1 (SO14)
74AHC_AHCT164_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 April 2008
13 of 18
74AHC164; 74AHCT164
NXP Semiconductors
8-bit serial-in/parallel-out shift register
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
E
D
A
X
c
y
HE
v M A
Z
8
14
Q
(A 3)
A2
A
A1
pin 1 index
θ
Lp
L
1
7
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
1
0.75
0.50
0.4
0.3
0.2
0.13
0.1
0.72
0.38
8
o
0
o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT402-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-18
MO-153
Fig 12. Package outline SOT402-1 (TSSOP14)
74AHC_AHCT164_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 April 2008
14 of 18
74AHC164; 74AHCT164
NXP Semiconductors
8-bit serial-in/parallel-out shift register
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
SOT762-1
14 terminals; body 2.5 x 3 x 0.85 mm
A
B
D
A
A1
E
c
detail X
terminal 1
index area
terminal 1
index area
C
e1
e
2
6
y
y1 C
v M C A B
w M C
b
L
1
7
Eh
e
14
8
13
9
Dh
X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
max.
A1
b
1
0.05
0.00
0.30
0.18
mm
c
D (1)
Dh
E (1)
Eh
0.2
3.1
2.9
1.65
1.35
2.6
2.4
1.15
0.85
e
0.5
e1
L
v
w
y
y1
2
0.5
0.3
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT762-1
---
MO-241
---
EUROPEAN
PROJECTION
ISSUE DATE
02-10-17
03-01-27
Fig 13. Package outline SOT762-1 (DHVQFN14)
74AHC_AHCT164_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 April 2008
15 of 18
74AHC164; 74AHCT164
NXP Semiconductors
8-bit serial-in/parallel-out shift register
13. Abbreviations
Table 10.
Abbreviations
Acronym
Description
CDM
Charged Device Model
CMOS
Complementary Metal-Oxide Semiconductor
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
TTL
Transistor-Transistor Logic
14. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
74AHC_AHCT164_3
20080424
Product data sheet
-
74AHC_AHCT164_2
Modifications:
•
Table 6: the conditions for input leakage current have been changed.
74AHC_AHCT164_2
20061129
Product data sheet
-
74AHC_AHCT164_1
74AHC_AHCT164_1
(9397 750 07332)
20000815
Product specification
-
-
74AHC_AHCT164_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 April 2008
16 of 18
74AHC164; 74AHCT164
NXP Semiconductors
8-bit serial-in/parallel-out shift register
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
15.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
74AHC_AHCT164_3
Product data sheet
© NXP B.V. 2008. All rights reserved.
Rev. 03 — 24 April 2008
17 of 18
NXP Semiconductors
74AHC164; 74AHCT164
8-bit serial-in/parallel-out shift register
17. Contents
1
2
3
4
5
5.1
5.2
6
7
8
9
10
11
12
13
14
15
15.1
15.2
15.3
15.4
16
17
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Recommended operating conditions. . . . . . . . 6
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 17
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Contact information. . . . . . . . . . . . . . . . . . . . . 17
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 24 April 2008
Document identifier: 74AHC_AHCT164_3