8415101RA SMD

REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
A
Update to reflect latest changes in format and requirements. Editorial changes
throughout. --les
05-01-18
Raymond Monnin
B
Update drawing to current MIL-PRF-38535 requirements. -jt
14-10-20
C.SAFFLE
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.
CURRENT CAGE CODE 67268
REV
SHEET
REV
SHEET
REV STATUS
REV
B
B
B
B
B
B
B
B
B
OF SHEETS
SHEET
1
2
3
4
5
6
7
8
9
PMIC N/A
PREPARED BY
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
David W. Queenan
STANDARD
MICROCIRCUIT
DRAWING
CHECKED BY
D. A. DiCenzo
APPROVED BY
N. A. Hauck
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DRAWING APPROVAL DATE
85-07-08
REVISION LEVEL
B
MICROCIRCUITS, DIGITAL, LOW POWER
SCHOTTKY TTL, MAGNITUDE COMPARATOR,
MONOLITHIC SILICON
SIZE
CAGE CODE
A
67268
SHEET
DSCC FORM 2233
APR 97
84151
1 OF 9
5962-E020-15
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
84151
01
R
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type. The device type identify the circuit function as follows:
Device type
Generic number
01
Circuit function
54LS682
8-bit magnitude comparator
1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
R
S
2
Descriptive designator
GDIP1-T20 or CDIP2-T20
GDFP2-F20 or CDFP3-F20
CQCC1-N20
Terminals
Package style
20
20
20
dual-in-line
flat
square chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Supply voltage range .......................................................
Input voltage range .......................................................
Storage temperature range .............................................
Maximum power dissipation (PD) 1/ ..............................
Lead temperature (soldering, 10 seconds) .....................
Thermal resistance, junction-to-case (θJC) .....................
Junction temperature (TJ) ................................................
-0.5 V dc to +7.0 V dc
-1.5 V dc at -18 mA to +7.0 V dc
-65°C to +150°C
385 mW
+300°C
See MIL-STD-1835
+175°C
1.4 Recommended operating conditions.
Supply voltage (VCC) ......................................................................
Minimum high level input voltage (VIH) .........................................
Maximum low level input voltage (VIL) ..........................................
Case operating temperature range (TC) ……………………………..
-4.5 V dc minimum to 5.5 V dc maximum
2.0 V dc
0.7 V dc
-55°C to +125°C
_________
1/ Maximum power dissipation is defined as VCC x ICC, and must withstand the added PD due to short-circuit test; e.g., IOS.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
84151
A
REVISION LEVEL
B
SHEET
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at http://quicksearch.dla.mil or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094).
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for nonJAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MILPRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MILPRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table. The truth table shall be as specified on figure 2.
3.2.4 Logic diagrams. The logic diagrams shall be as specified on figure 3.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
84151
A
REVISION LEVEL
B
SHEET
3
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN
listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD
PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used. For product built in accordance with A.3.2.2 of
MIL-PRF-38535, or as modified in the manufacturer’s QM plan, the “QD” certification mark shall be used in place of the "Q" or
"QML" certification mark.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and
Maritime -VA prior to listing as an approved source of supply shall affirm that the manufacturer's product meets the
requirements of MIL-PRF-38535, appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DLA Land and Maritime -VA shall be required for any change that
affects this drawing.
3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritime's agent, and the acquiring activity retain the
option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
84151
A
REVISION LEVEL
B
SHEET
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions
-55°C ≤ TC ≤ +125°C
unless otherwise specified
Group A
subgroups
Device
type
Limits
Min
Unit
Max
High level output voltage
VOH
VCC = 4.5 V, IOH = -0.4 mA
1, 2, 3
All
Low level output voltage
VOL
VCC = 4.5 V, IOL = 12 mA
1, 2, 3
All
0.4
V
Input clamp voltage
VI C
VCC = 4.5 V, IIN = -18 mA
1
All
-1.5
V
High level input current
IIH1
VCC = 5.5 V, VIN = 2.7 V
1, 2, 3
All
20
µA
IIH2
VCC = 5.5 V, VIN = 5.5 V
1, 2, 3
All
100
µA
Low level input current
IIL
VCC = 5.5 V, VIN = 0.4 V
1, 2, 3
All
-400
µA
Short circuit output current
IOS
VCC = 5.5 V, VOUT = 0.0 V
1/
1, 2, 3
All
-130
mA
Supply current
ICC
VCC = 5.5 V, inputs grounded,
outputs open
1, 2, 3
All
70
mA
High level output current
IOH
1, 2, 3
All
-400
µA
Low level output current
IOL
1, 2, 3
All
12
mA
Propagation delay time,
tPLH1
9
All
25
ns
VCC = 5.0 V,
CL = 50 pF ±10%,
P to P = Q
tPHL1
10, 11
RL = 667 Ω ±5%
9
tPLH2
9
All
tPHL2
9
All
tPLH3
9
All
tPHL3
9
tPLH4
9
All
tPHL4
9
All
ns
30
ns
30
ns
30
ns
42
All
10, 11
1/
25
42
10, 11
Q to P > Q
ns
42
10, 11
Propagation delay time,
25
35
All
10, 11
P to P > Q
ns
35
10, 11
Propagation delay time,
25
35
10, 11
Q to P = Q
-20
V
35
10, 11
Propagation delay time,
2.5
30
ns
42
Not more than one output should be shorted at a time and the duration of the short circuit condition should not exceed
one second.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
84151
A
REVISION LEVEL
B
SHEET
5
Device type
Case outlines
Terminal number
1
01
R and S
Terminal symbol
2
Terminal symbol
P>Q
P0
Q0
P1
Q1
P2
Q2
P3
Q3
GND
P4
Q4
P5
Q5
P6
Q6
P7
Q7
P>Q
P0
Q0
P1
Q1
P2
Q2
P3
Q3
GND
P4
Q4
P5
Q5
P6
Q6
P7
Q7
P=Q
VCC
P=Q
VCC
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
FIGURE 1. Terminal connections.
INPUTS
DATA
PQ
P=Q
P>Q
P<Q
X
OUTPUTS
P=Q
L
H
H
H
P>Q
H
L
H
H
H = high level
L = low level
X = irrelevant
FIGURE 2. Truth table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
84151
A
REVISION LEVEL
B
SHEET
6
FIGURE 3. Logic diagram.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
84151
A
REVISION LEVEL
B
SHEET
7
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535,
appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method
1015 of MIL-STD-883.
(2) TA = +125°C, minimum.
b.
Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
TABLE II. Electrical test requirements.
MIL-STD-883 test requirements
Interim electrical parameters
(method 5004)
Final electrical test parameters
(method 5004)
Group A test requirements
(method 5005)
Groups C and D end-point
electrical parameters
(method 5005)
Additional electrical subgroups
for group C periodic inspections
Subgroups
(in accordance with
MIL-STD-883, method 5005,
table I)
--1*, 2, 3, 9
1, 2, 3, 7, 9
1, 2, 3
10, 11 **
* PDA applies to subgroup 1.
** Subgroups 10 and 11, if not tested, shall be
guaranteed to the specified limits in table I.
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD883 including groups A, B, C, and D inspections. The following additional criteria shall apply.
4.3.1 Group A inspection.
a.
Tests shall be as specified in table II herein.
b.
Subgroups 4, 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted.
c.
Subgroup 7 shall include verification of the truth table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
84151
A
REVISION LEVEL
B
SHEET
8
4.3.2 Groups C and D inspections.
a.
End-point electrical parameters shall be as specified in table II herein.
b.
Steady-state life test conditions, method 1005 of MIL-STD-883.
(1)
Test condition A, B, C or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1005 of MIL-STD-883.
(2)
TA = +125°C, minimum.
(3)
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.4 Record of users. Military and industrial users shall inform DLA Land and Maritime when a system application requires
configuration control and the applicable SMD to that system. DLA Land and Maritime will maintain a record of users and this
list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics
devices (FSC 5962) should contact DLA Land and Maritime-VA, telephone (614) 692-8108.
6.5 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990,
or telephone (614) 692-0540.
6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103 and QML-38535. The vendors
listed in MIL-HDBK-103 and QML-38535 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been
submitted to and accepted by DLA Land and Maritime-VA.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
84151
A
REVISION LEVEL
B
SHEET
9
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 14-10-20
Approved sources of supply for SMD 84151 are listed below for immediate acquisition information only and shall be
added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to
include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of
compliance has been submitted to and accepted by DLA Land and Maritime-VA. This information bulletin is
superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime maintains an
online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/.
Standard
microcircuit drawing
PIN 1/
8415101RA
8415101SA
84151012A
Vendor
CAGE
number
01295
01295
01295
Vendor
similar
PIN 2/
SNJ54LS682J
SNJ54LS682W
SNJ54LS682FK
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
Vendor CAGE
number
01295
Vendor name
and address
Texas Instruments, Inc.
Semiconductor Group
8505 Forest Ln.
PO Box 660199
Dallas, TX 75243
POC U.S. Highway 75 South
P.O. Box 84, M/S 853
Sherman, TX 75090-9493
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
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