TDA8939 Zero dead time Class-D 7.5 A power comparator Rev. 01 — 22 April 2004 Objective data sheet 1. General description Zero dead time Class-D 7.5 A power comparator The TDA8939 is a power comparator designed for use in a high efficiency class-D audio power amplifier system. It contains power switches, drive logic, protection circuitry, bias circuitry and a fully differential input stage (comparator). This device is optimized for applications in fully digital open-loop class-D audio systems (in combination with a digital PWM controller). The TDA8939 power comparator operates with high efficiency and low dissipation. The system operates over a wide supply voltage range from ±10 V up to ±30 V. 2. Features ■ ■ ■ ■ ■ ■ ■ ■ ■ Zero dead time switching Maximum output current 7.5 A Standby mode High efficiency Operating voltage from ±10 V to ±30 V (symmetrical) or 20 V to 60 V (asymmetrical) Low quiescent current High output power Diagnostic output Thermal protection, current protection and voltage protection. 3. Applications ■ ■ ■ ■ ■ Television sets Home-sound sets Multimedia systems All mains fed audio systems Car audio (boosters). TDA8939 Philips Semiconductors Zero dead time Class-D 7.5 A power comparator 4. Quick reference data Table 1: Quick reference data VP = ±25 V; fcarrier = 384 kHz. Symbol Parameter Conditions supply voltage VP symmetrical supply voltage asymmetrical supply voltage [1] Min Typ Max Unit ±10 ±25 ±30 V 20 50 60 V Iq(tot) total quiescent current no load connected; no filters; no snubbers connected - 50 70 mA η efficiency - 90 - % [1] Prated When the supply voltage is below ±12.5 V the PWM outputs will not be able to switch to the high side at the first PWM cycle. 5. Ordering information Table 2: Ordering information Type number Package TDA8939TH HSOP24 plastic, heatsink small outline package; 24 leads; low stand-off height Name Description 9397 750 13023 Objective data sheet Version SOT566-3 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 22 April 2004 2 of 21 TDA8939 Philips Semiconductors Zero dead time Class-D 7.5 A power comparator 6. Block diagram 22 23 TDA8939TH VDDA1 IN1P IN1N VSSA1 POWERUP 3 DRIVER HIGH 4 21 ZERO DEAD TIME CONTROL 2 1 5 ENABLE CGND VDDA2 IN2P IN2N VSSA2 7 VDDP1 OUT1 DRIVER LOW 19 STAB 12 V 20 DIAGN BOOT1 Q PROTECTION LATCH S ≥ R OTP OCP OVP UVP 15 8 14 DRIVER HIGH 9 ZERO DEAD TIME CONTROL 11 12 VSSP1 temperature sensor current protection overvoltage protection undervoltage protection 6 10 STAB1 16 BOOT2 VDDP2 OUT2 DRIVER LOW STAB 12 V 18 17 24 sub STAB2 VSSP2 13 001aaa624 VSSD heatsink n.c. Fig 1. Block diagram. 9397 750 13023 Objective data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 22 April 2004 3 of 21 TDA8939 Philips Semiconductors Zero dead time Class-D 7.5 A power comparator 7. Pinning information 7.1 Pinning VSSD 24 1 VDDP1 23 2 IN1N BOOT1 22 3 VDDA1 IN1P VSSA1 OUT1 21 4 VSSP1 20 5 POWERUP STAB1 19 6 ENABLE 7 DIAGN STAB2 18 TDA8939 VSSP2 17 8 CGND OUT2 16 9 IN2P BOOT2 15 10 VDDA2 VDDP2 14 11 IN2N 12 VSSA2 n.c. 13 001aaa625 Fig 2. Pin configuration. 7.2 Pin description Table 3: Pin description Symbol Pin Description VSSA1 1 negative analog supply voltage for channel 1 IN1N 2 inverting input channel 1 VDDA1 3 positive analog supply voltage for channel 1 IN1P 4 non-inverting input channel 1 POWERUP 5 enable input for switching on internal reference sources ENABLE 6 digital enable input DIAGN 7 digital open-drain diagnostic output for OTP, OCP, OVP and UVP (active LOW) CGND 8 common ground, reference ground for diagnostic, enable and power-up IN2P 9 non-inverting input channel 2 VDDA2 10 positive analog supply voltage for channel 2 IN2N 11 inverting input channel 2 VSSA2 12 negative analog supply voltage for channel 2 n.c. 13 not connected VDDP2 14 positive power supply voltage for channel 2 BOOT2 15 bootstrap capacitor 2 OUT2 16 PWM output channel 2 VSSP2 17 negative power supply voltage for channel 2 STAB2 18 decoupling internal stabilizer for logic supply channel 2 9397 750 13023 Objective data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 22 April 2004 4 of 21 TDA8939 Philips Semiconductors Zero dead time Class-D 7.5 A power comparator Table 3: Pin description …continued Symbol Pin Description STAB1 19 decoupling internal stabilizer for logic supply channel 1 VSSP1 20 negative power supply voltage for channel 1 OUT1 21 PWM output channel 1 BOOT1 22 bootstrap capacitor 1 VDDP1 23 positive power supply voltage for channel 1 VSSD 24 negative digital supply voltage SUB - heat spreader of package; internally connected to VSSD 8. Functional description 8.1 General The TDA8939 class-D power comparator is designed for use in fully digital open-loop class-D audio applications. Excellent timing accuracy with respect to delay times and rise and fall times is achieved and one of the most important sources of distortion in a full digital open-loop audio amplifier is eliminated; the zero dead time switching concept is included. The TDA8939 contains two independent class-D output stages with high power D-MOS switches, drivers, timing and control logic. For protection a temperature sensor, a maximum current detection and overvoltage detection circuit are integrated. An internal protection latch keeps the power comparator in shut-down mode after a fault condition has been detected. External reset of the latch is required via the enable input. 8.2 Protections Overtemperature, overcurrent and overvoltage sensors are included in the TDA8939 power comparator. In the event that the maximum temperature, maximum current or maximum supply voltage is exceeded the diagnostic output is activated (open-drain output pulled-down via external pull-up resistor). The diagnostic output pin is activated (active LOW) in case of: 1. Overtemperature (OTP): the junction temperature (Tj) exceeds a threshold level. 2. Overcurrent (OCP): the output current exceeds the maximum output current threshold level (e.g. when the loudspeaker terminals are short-circuited it will be detected by the current protection). 3. Overvoltage (OVP): the supply voltage applied to the power comparator exceeds the maximum supply voltage threshold level. The TDA8939 is self-protecting. If a fault condition (OTP, OCP or OVP) is detected it will pull-down the diagnostic output (pin 7), while at the same time shutting down the power stage. In case of a fault condition in one of the half-bridges or output channel the other half-bridge and output channel will also shut down. All protections trigger a latch which ensures that the power stage remains deactivated until the latch is reset again. The latch is reset by switching the enable voltage of the power stage to LOW level. Both set (S) and reset (R) inputs of the protection latch trigger on a negative falling slope. 9397 750 13023 Objective data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 22 April 2004 5 of 21 TDA8939 Philips Semiconductors Zero dead time Class-D 7.5 A power comparator The block diagram of diagnostic output including OTP, OCP and OVP is illustrated in Figure 3. The diagnostic output (pin 7) is an open-drain output; a pull-up resistor connected to +Vpull-up has to be applied externally. TDA8939 +Vint disable power stage OTP +Vpull-up R1 S OCP R2 R OVP Rpu LATCH C1 open-drain Q DIAGN enable CGND 001aaa623 Fig 3. OCP, OTP and OVP protection: S/R latch. 8.3 Interfacing between controller and the TDA8939 For interfacing with a digital PWM controller IC or microcontroller in the final system application the following inputs and outputs are available see Table 4 and 5. 8.3.1 Inputs Table 4: Inputs Pin name Pin number Description IN1P and IN1N 4 and 2 full differential input for output channel 1; referenced with respect to each other; common mode referenced to VSSD IN2P and IN2N 9 and 11 full differential input for output channel 2; referenced with respect to each other; common mode referenced to VSSD POWERUP 5 standby switch; reference to CGND; at a LOW level the device is in standby mode and consumes a very low standby current. At HIGH level the device is DC-biased (switch-on of internal reference voltages and currents). The device can only be switched to full operating mode by the enable input, if the power-up input is at HIGH level. ENABLE 6 mode switch; reference to CGND; at a LOW level the power D-MOS switches are open and the PWM output is floating; all internal logic circuits are in reset condition. At a HIGH level the power comparator is fully operational if the power-up input is also at a HIGH level. In this condition the power comparator outputs are controlled by the input pins (IN1P, IN1N, IN2P and IN2N); see also Figure 6. The enable input signal is also used to reset the protection latch. 9397 750 13023 Objective data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 22 April 2004 6 of 21 TDA8939 Philips Semiconductors Zero dead time Class-D 7.5 A power comparator 8.3.2 Outputs Table 5: Outputs Pin name Pin number Description DIAGN 7 Digital open-drain output; referenced to CGND; output indicates the following fault conditions: OTP, OCP, OVP and UVP. In the event of a fault condition the output is pulled to the CGND voltage (active LOW). If the diagnostic output functionality is used in the application, an external pull-up resistor is required. 8.3.3 Reference voltages Table 6: 8.4 Reference voltages Pin name Pin number Description CGND 8 common ground; reference ground for diagnostic output, enable input and power-up input VSSD 24 negative digital supply; reference ground digital circuits. The VSSD pin should be connected to VSS voltage in the application. Internally the VSSD pin is connected to the VSSAx and VSSPx (e.g. VSSA1 and VSSP1) via an ESD protection diode. Start-up timing Power comparator mode selection: • Standby mode: when pin POWERUP is LOW, the power comparator is in standby mode, independent of the signal on the enable input • Reset mode: when pin POWERUP is HIGH, the status of the power comparator is controlled by pin ENABLE; if pin ENABLE is LOW, the status of the power stage is reset and the outputs are floating • Operating mode: when pin ENABLE is HIGH, the power stage is in operating mode. To ensure correct start-up of the power stage, the enable input should never be HIGH when the power-up input is LOW. Before switching to operating mode, the amplifier should first be switched to reset mode. Remark: It is possible to directly connect the power-up input to the positive supply line (e.g. VDDA1). As soon as the supply voltage is applied the device will be DC-biased (reset mode). Table 7: Mode selection Pin Mode POWERUP ENABLE LOW X standby HIGH LOW reset HIGH HIGH operating 9397 750 13023 Objective data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 22 April 2004 7 of 21 TDA8939 Philips Semiconductors Zero dead time Class-D 7.5 A power comparator ENABLE POWERUP status standby reset operating reset start-up sequence standby switch-off sequence 001aaa062 Fig 4. Mode selection timing diagram. 9. Limiting values Table 8: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Vp supply voltage - 60 V IORM repetitive peak current on output pins - 7.5 A Tstg storage temperature −55 +150 °C Tamb ambient temperature −40 +85 °C Tvj virtual junction temperature - 150 °C Value Unit 10. Thermal characteristics Table 9: Thermal characteristics Symbol Parameter Conditions Rth(j-a) thermal resistance from junction to ambient in free air 40 K/W Rth(j-c) thermal resistance from junction to case 1.3 K/W 9397 750 13023 Objective data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 22 April 2004 8 of 21 TDA8939 Philips Semiconductors Zero dead time Class-D 7.5 A power comparator 11. Static characteristics Table 10: Static characteristics VP = ±25 V; fcarrier = 384 kHz; Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions supply voltage symmetrical supply voltage Min Typ Max Unit Supplies VP ±10 ±25 ±30 V asymmetrical supply voltage 20 50 60 V - 50 70 mA [1] Iq quiescent current no load; no filters; no snubbers connected reset mode - 10 20 mA Istb standby current standby mode - 120 170 µA 11 12 15 V V Internal stabilizer logic supplies VSTAB1, VSTAB2 stabilizer output voltage Comparator full differential input stage: pins IN1P, IN1N, IN2P and IN2N Vi(diff) differential input voltage range 1 3.3 12 Vi(com) common mode input voltage VSSA1 - VDDA1 − 7.5 V Ii(bias) input bias current - - 10 µA - 0 - V 0 - 1 V Common ground: pin CGND VCGND common ground reference voltage asymmetrical supply Diagnostic output: pin DIAGN [2] VOL LOW-level output voltage referenced to CGND; IDIAGN = 1 mA Vpu(max) maximum pull-up voltage referenced to CGND - - 12 V IL leakage current no error condition - - 50 µA Enable input: pin ENABLE VIL LOW-level input voltage referenced to CGND 0 - 1 V VIH HIGH-level input voltage referenced to CGND 3 - 12 V II input current VENABLE = 12 V - 70 140 µA Power-up input: pin POWERUP VIL LOW-level input voltage referenced to CGND 0 - 0.5 V VIH HIGH-level input voltage referenced to CGND 3 - VDDA V Vhys hysteresis voltage - 0.3 - V II input current VPOWERUP = 12 V - 70 140 µA 9397 750 13023 Objective data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 22 April 2004 9 of 21 TDA8939 Philips Semiconductors Zero dead time Class-D 7.5 A power comparator Table 10: Static characteristics …continued VP = ±25 V; fcarrier = 384 kHz; Tamb = 25 °C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit VDIAGN = VOL 150 - - °C diagnostic and protection trigger VDIAGN = VOL current 7.5 - - A ±30 ±33 - V Temperature protection Tdiag diagnostic trigger temperature Overcurrent protection Iprot Overvoltage protection VDD(max) diagnostic and protection trigger VDIAGN = VOL maximum supply voltage [1] When the supply voltage is below ±12.5 V the PWM outputs will not be able to switch to the high side at the first PWM cycle. [2] OTP, OCP and/or OVP protection activated. 12. Dynamic characteristics Table 11: Dynamic characteristics VP = ±25 V; Tamb = 25 °C; fcarrier = 384 kHz; see also Figure 8 for definitions. Symbol Parameter Conditions Min Typ Max Unit PWM output tr rise time output voltage - 20 - ns tf fall time output voltage - 20 - ns tdead dead time - 0 - ns tr(LH) large signal response time LOW-to-HIGH transition at output input amplitude = 3.3 V - 90 - ns tr(HL) large signal response time HIGH-to-LOW transition at output input amplitude = 3.3 V - 90 - ns tW(min) minimal pulse width - 150 - ns RDS_ON RDS_ON output transistors η efficiency [1] Po = Prated [1] - 0.2 0.3 Ω - - 90 - Output power measured across the loudspeaker load. Power measurement based on indirect measurement by measuring the RDS_ON. 9397 750 13023 Objective data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 22 April 2004 10 of 21 TDA8939 Philips Semiconductors Zero dead time Class-D 7.5 A power comparator input Vi(dif) 3.3 V Vcom tr(LH) tr(HL) tW(min) VDD output Vo 0V VSS tr tf 1/fc time 001aaa063 Vcommon = VSSA1 to (VDDA1 − 7.5 V). tdead cannot be represented in the figure. Response times depend on input signal amplitude. The second input pulse is not reproduced with same pulse width by the output due to minimum pulse width limitation. Fig 5. Timing diagram PWM output. 9397 750 13023 Objective data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 22 April 2004 11 of 21 TDA8939 Philips Semiconductors Zero dead time Class-D 7.5 A power comparator 13. Output power estimation The maximum achievable output power is not only determined by the power comparator characteristics, but by the total system application. The following application blocks determine the maximum achievable output power: Power comparator: • Minimum pulse width • Series resistances: RDS_ON, bond wires, printed-circuit board tracks, series resistance of the coil, etc. System application: • Power supply voltage • Load impedance • Controller characteristics: maximum modulation depth and carrier frequency. In Figure 6 an estimate is given for the output power in full-bridge application as function of the (symmetrical) supply voltage for different values of the load-impedance. The following variables are taken into account: • Minimum pulse width: 150 ns • Total series resistance: 0.4 Ω • Carrier frequency: 384 kHz. 001aaa626 200 Pout (W) 001aaa627 250 Pout (W) 160 200 120 150 (1) (1) (2) (2) 80 100 (3) (3) 40 50 0 0 10 14 18 22 26 30 10 VP (V) 18 22 26 30 VP (V) (1) ZL = 4 Ω. (1) ZL = 4 Ω. (2) ZL = 6 Ω. (2) ZL = 6 Ω. (3) ZL = 8 Ω. (3) ZL = 8 Ω. Fig 6. Output power estimation as a function of (symmetrical) supply voltage for THD = 1 %. Fig 7. Output power estimation as a function of (symmetrical) supply voltage for THD = 10 %. 9397 750 13023 Objective data sheet 14 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 22 April 2004 12 of 21 xxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx x xxxxxxxxxxxxxx xxxxxxxxxx xxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxx x x 2 VDD +50 V V+ V+ V+ C2 1000 µF (63 V) C1 100 nF R1 10 kΩ R2 1 kΩ OUTpos C5 C6 C7 100 nF 100 nF 100 nF 100 nF IN1neg 47 Ω R7 IN1pos 47 Ω VDDA2 3 VDDP1 10 23 14 2 21 47 Ω R10 overload ENABLE 4 5 47 Ω CGND R11 IN2neg 47 Ω R13 47 Ω IN2pos BOOT1 STAB1 R8 22 Ω (1 W) C12 220 nF C13 CON3 OUTPUT 100 nF 6 OUTpos TDA8939TH DIAGN L2 (1) OUT1 18 STAB2 7 C14 OUTneg 1 2 100 nF 15 BOOT2 8 C15 100 nF 11 16 13 OUT2 n.c. L3 (1) C18(1) 9 12 VSSA1 VSSA2 24 VSSD 20 17 VSSP1 VSSP2 R14 10 Ω (0.25 W) C16 220 pF C17 220 pF V+ (1) For 8 Ω BTL and fcorner = 40.2 kHz: L2 = L3 = 27 µH; C11 = C18 = 470 nF. For 8 Ω BTL and fcorner = 44.5 kHz: L2 = L3 = 22 µH; C11 = C18 = 470 nF. For 4 Ω BTL and fcorner = 47.7 kHz: L2 = L3 = 10 µH; C11 = C18 = 1 µF. Fig 8. Typical application diagram using a single (asymmetrical) supply voltage. C19 220 nF 001aaa628 TDA8939 13 of 21 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. 1 R12 22 Ω (1 W) Zero dead time Class-D 7.5 A power comparator Rev. 01 — 22 April 2004 R9 R6 10 Ω (0.25 W) C11(1) C10 100 nF 19 power stage on/off C9 220 pF VDDP2 22 POWERUP DIGITAL PWM CONTROLLER C8 220 pF C4 VDDA1 R5 OUTneg R4 10 Ω R3 10 Ω VCC C3 470 µF (63 V) Philips Semiconductors 1 L1 BEAD 14. Application information 9397 750 13023 Objective data sheet CON1 SUPPLY TDA8939 Philips Semiconductors Zero dead time Class-D 7.5 A power comparator 15. Test information 15.1 Quality information The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable. 9397 750 13023 Objective data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 22 April 2004 14 of 21 TDA8939 Philips Semiconductors Zero dead time Class-D 7.5 A power comparator 16. Package outline HSOP24: plastic, heatsink small outline package; 24 leads; low stand-off height SOT566-3 E D A x X c E2 y HE v M A D1 D2 12 1 pin 1 index Q A A2 E1 (A3) A4 θ Lp detail X 24 13 Z w M bp e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A A2 max. 3.5 3.5 3.2 A3 0.35 A4(1) D1 D2 E(2) E1 E2 e HE Lp Q +0.08 0.53 0.32 16.0 13.0 −0.04 0.40 0.23 15.8 12.6 1.1 0.9 11.1 10.9 6.2 5.8 2.9 2.5 1 14.5 13.9 1.1 0.8 1.7 1.5 bp c D(2) v w x y 0.25 0.25 0.03 0.07 Z θ 2.7 2.2 8° 0° Notes 1. Limits per individual lead. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 03-02-18 03-07-23 SOT566-3 Fig 9. Package outline. 9397 750 13023 Objective data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 22 April 2004 15 of 21 TDA8939 Philips Semiconductors Zero dead time Class-D 7.5 A power comparator 17. Soldering 17.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 17.2 Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: • below 225 °C (SnPb process) or below 245 °C (Pb-free process) – for all BGA, HTSSON..T and SSOP..T packages – for packages with a thickness ≥ 2.5 mm – for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called thick/large packages. • below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. 17.3 Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. • For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; 9397 750 13023 Objective data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 22 April 2004 16 of 21 TDA8939 Philips Semiconductors Zero dead time Class-D 7.5 A power comparator – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 17.4 Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. 17.5 Package related soldering information Table 12: Suitability of surface mount IC packages for wave and reflow soldering methods Package [1] Soldering method Wave Reflow [2] BGA, HTSSON..T [3], LBGA, LFBGA, SQFP, SSOP..T [3], TFBGA, USON, VFBGA not suitable suitable DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS not suitable [4] suitable PLCC [5], SO, SOJ suitable suitable not recommended [5] [6] suitable SSOP, TSSOP, VSO, VSSOP not recommended [7] suitable CWQCCN..L [8], PMFP [9], WQCCN..L [8] not suitable LQFP, QFP, TQFP [1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. [2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. [3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 9397 750 13023 Objective data sheet not suitable © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 22 April 2004 17 of 21 TDA8939 Philips Semiconductors Zero dead time Class-D 7.5 A power comparator [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. [5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. [6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. [7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. [8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. [9] Hot bar soldering or manual soldering is suitable for PMFP packages. 9397 750 13023 Objective data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 22 April 2004 18 of 21 TDA8939 Philips Semiconductors Zero dead time Class-D 7.5 A power comparator 18. Revision history Table 13: Revision history Document ID Release date Data sheet status Change notice Order number Supersedes TDA8939_1 20040422 Objective data sheet - 9397 750 13023 - 9397 750 13023 Objective data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 22 April 2004 19 of 21 TDA8939 Philips Semiconductors Zero dead time Class-D 7.5 A power comparator 19. Data sheet status Level Data sheet status [1] Product status [2] [3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 20. Definitions 21. Disclaimers Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 22. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: [email protected] 9397 750 13023 Objective data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 22 April 2004 20 of 21 TDA8939 Philips Semiconductors Zero dead time Class-D 7.5 A power comparator 23. Contents 1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.3 8.3.1 8.3.2 8.3.3 8.4 9 10 11 12 13 14 15 15.1 16 17 17.1 17.2 17.3 17.4 17.5 18 19 20 21 22 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Interfacing between controller and the TDA8939 . 6 Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Reference voltages . . . . . . . . . . . . . . . . . . . . . . 7 Start-up timing . . . . . . . . . . . . . . . . . . . . . . . . . 7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8 Thermal characteristics. . . . . . . . . . . . . . . . . . . 8 Static characteristics. . . . . . . . . . . . . . . . . . . . . 9 Dynamic characteristics . . . . . . . . . . . . . . . . . 10 Output power estimation. . . . . . . . . . . . . . . . . 12 Application information. . . . . . . . . . . . . . . . . . 13 Test information . . . . . . . . . . . . . . . . . . . . . . . . 14 Quality information . . . . . . . . . . . . . . . . . . . . . 14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 16 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 16 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 17 Package related soldering information . . . . . . 17 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 20 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Contact information . . . . . . . . . . . . . . . . . . . . 20 © Koninklijke Philips Electronics N.V. 2004 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 22 April 2004 Document order number: 9397 750 13023 Published in The Netherlands