N-channel silicon junction field-effect transistors

3
SO
T2
BF545A; BF545B; BF545C
N-channel silicon junction field-effect transistors
Rev. 4 — 15 September 2011
Product data sheet
1. Product profile
1.1 General description
N-channel symmetrical silicon junction field-effect transistors in a SOT23 package.
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
1.2 Features and benefits
 Low leakage level (typ. 500 fA)
 High gain
 Low cut-off voltage (max. 2.2 V for BF545A).
1.3 Applications
 Impedance converters in e.g. electret microphones and infra-red detectors
 VHF amplifiers in oscillators and mixers.
1.4 Quick reference data
Table 1.
Quick reference data
Symbol Parameter
Conditions
Min
Typ
Max
Unit
-
-
30
V
0.4
-
7.8
V
BF545A
2
-
6.5
mA
BF545B
6
-
15
mA
BF545C
VDS
drain-source voltage
VGSoff
gate-source cut-off
voltage
ID = 1 A; VDS = 15 V
IDSS
drain current
VGS = 0 V; VDS = 15 V
12
-
25
mA
Ptot
total power dissipation
Tamb  25 C
-
-
250
mW
yfs
forward transfer
admittance
VGS = 0 V; VDS = 15 V
3
-
6.5
mS
BF545A; BF545B; BF545C
NXP Semiconductors
N-channel silicon junction field-effect transistors)
2. Pinning information
Table 2.
Pinning
Pin
Description
1
source (s)
2
drain (d)
3
gate (g)
Simplified outline
Symbol
3
g
d
s
sym054
1
2
3. Ordering information
Table 3.
Ordering information
Type number
Package
BF545A
Name
Description
Version
-
plastic surface mounted package; 3 leads
SOT23
BF545B
BF545C
4. Marking
Table 4.
Marking
Type number
Marking code[1]
BF545A
20*
BF545B
21*
BF545C
22*
[1]
* = p: made in Hong Kong.
* = t: made in Malaysia.
* = W: made in China.
BF545A_BF545B_BF545C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 15 September 2011
© NXP B.V. 2011. All rights reserved.
2 of 16
BF545A; BF545B; BF545C
NXP Semiconductors
N-channel silicon junction field-effect transistors)
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
VDS
drain-source voltage (DC)
VGSO
gate-source voltage
open drain
-
30
V
VGDO
gate-drain voltage (DC)
open source
-
30
V
IG
forward gate current (DC)
-
10
mA
-
250
mW
Tamb  25 C
[1]
Min
Max
Unit
-
30
V
Ptot
total power dissipation
Tstg
storage temperature
65
+150
C
Tj
junction temperature
-
150
C
[1]
Device mounted on an FR4 printed-circuit board, maximum lead length 4 mm; mounting pad for the drain
lead 10 mm2.
mbb688
400
Ptot
(mW)
300
200
100
0
0
Fig 1.
50
100
150
200
Tamb (°C)
Power derating curve.
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Rth(j-a)
[1]
BF545A_BF545B_BF545C
Product data sheet
Conditions
thermal resistance from junction to
ambient
[1]
Typ
Unit
500
K/W
Device mounted on an FR4 printed-circuit board, maximum lead length 4 mm; mounting pad for the drain
lead 10 mm2.
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 15 September 2011
© NXP B.V. 2011. All rights reserved.
3 of 16
BF545A; BF545B; BF545C
NXP Semiconductors
N-channel silicon junction field-effect transistors)
7. Static characteristics
Table 7.
Static characteristics
Tj = 25 C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
V(BR)GSS
gate-source breakdown voltage
IG = 1 A; VDS = 0 V
30
-
-
V
VGSoff
gate-source cut-off voltage
ID = 200 A; VDS = 15 V
BF545A
0.4
-
2.2
V
BF545B
1.6
-
3.8
V
BF545C
3.2
-
7.8
V
0.4
-
7.5
V
BF545A
2
-
6.5
mA
BF545B
6
-
15
mA
ID = 1 A; VDS = 15 V
IDSS
drain current
VGS = 0 V; VDS = 15 V
BF545C
IGSS
gate-source leakage current
12
-
25
mA
VGS = 20 V; VDS = 0 V
-
0.5
1000
pA
VGS = 20 V; VDS = 0 V;
Tj = 125 C
-
-
100
nA
yfs
forward transfer admittance
VGS = 0 V; VDS = 15 V
3
-
6.5
mS
yos
common source output
admittance
VGS = 0 V; VDS = 15 V
-
40
-
S
BF545A_BF545B_BF545C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 15 September 2011
© NXP B.V. 2011. All rights reserved.
4 of 16
BF545A; BF545B; BF545C
NXP Semiconductors
N-channel silicon junction field-effect transistors)
8. Dynamic characteristics
Table 8.
Dynamic characteristics
Tamb = 25 C unless otherwise specified.
Symbol
Parameter
Conditions
Ciss
input capacitance
VDS = 15 V; f = 1 MHz
reverse transfer capacitance
Crss
common source input
conductance
gis
Unit
VGS = 10 V
-
1.7
-
pF
VGS = 0 V
-
3
-
pF
VGS = 10 V
-
0.8
-
pF
VGS = 0 V
-
0.9
-
pF
f = 100 MHz
-
15
-
S
f = 450 MHz
-
300
-
S
f = 100 MHz
-
2
-
mS
f = 450 MHz
-
1.8
-
mS
f = 100 MHz
-
6
-
S
f = 450 MHz
-
40
-
S
f = 100 MHz
-
30
-
S
f = 450 MHz
-
60
-
S
VDS = 15 V; f = 1 MHz
VDS = 10 V; ID = 1 mA
common source output
conductance
gos
Max
VDS = 10 V; ID = 1 mA
common source reverse
conductance
grs
Typ
VDS = 10 V; ID = 1 mA
common source transfer
conductance
gfs
Min
VDS = 10 V; ID = 1 mA
mbb467
30
mbb466
6
Yfs
(mS)
IDSS
(mA)
5.5
20
5
10
4.5
0
0
−2
−4
−6
VGSoff (V)
4
−8
0
VDS = 15 V; Tj = 25 C.
Fig 2.
Product data sheet
−4
−6
VGSoff (V)
−8
VDS = 15 V; VGS = 0 V; Tj = 25 C.
Drain current as a function of gate-source
cut-off voltage; typical values.
BF545A_BF545B_BF545C
−2
Fig 3.
Forward transfer admittance as a function of
gate-source cut-off voltage; typical values.
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 15 September 2011
© NXP B.V. 2011. All rights reserved.
5 of 16
BF545A; BF545B; BF545C
NXP Semiconductors
N-channel silicon junction field-effect transistors)
mbb465
80
Yos
(μS)
mbb464
300
RDSon
(Ω)
60
200
40
100
20
0
0
−2
−4
−6
VGSoff (V)
0
−8
0
VDS = 15 V; VGS = 0 V; Tj = 25 C.
Fig 4.
−4
−6
VGSoff (V)
−8
VDS = 100 mV; VGS = 0 V; Tj = 25 C.
Common-source output admittance as a
function of gate-source cut-off voltage; typical
values.
Fig 5.
mbb462
6
ID
(mA)
−2
Drain-source on-resistance as a function of
gate-source cut-off voltage; typical values.
mbb463
6
ID
(mA)
(1)
4
4
(2)
2
2
(3)
0
0
0
4
8
12
16
VDS (V)
−3
−2
BF545A
BF545A
Tj = 25 C.
VDS = 15 V; Tj = 25 C.
−1
0
VGS (V)
(1) VGS = 0 V.
(2) VGS = 0.5 V.
(3) VGS = 1.0 V.
Fig 6.
Typical output characteristics.
BF545A_BF545B_BF545C
Product data sheet
Fig 7.
Typical input characteristics.
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 15 September 2011
© NXP B.V. 2011. All rights reserved.
6 of 16
BF545A; BF545B; BF545C
NXP Semiconductors
N-channel silicon junction field-effect transistors)
mbb460
16
ID
(mA)
mbb459
16
ID
(mA)
(1)
12
12
(2)
(3)
8
8
(4)
(5)
4
4
(6)
0
0
0
4
8
12
16
VDS (V)
−6
−4
BF545B
BF545B
Tj = 25 C.
VDS = 15 V; Tj = 25 C.
−2
0
VGS (V)
(1) VGS = 0 V.
(2) VGS = 0.5 V.
(3) VGS = 1.0 V.
(4) VGS = 1.5 V.
(5) VGS = 2.0 V.
(6) VGS = 2.5 V.
Fig 8.
Typical output characteristics.
BF545A_BF545B_BF545C
Product data sheet
Fig 9.
Typical input characteristics.
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 15 September 2011
© NXP B.V. 2011. All rights reserved.
7 of 16
BF545A; BF545B; BF545C
NXP Semiconductors
N-channel silicon junction field-effect transistors)
mbb457
30
ID
(mA)
mbb456
30
ID
(mA)
(1)
20
20
(2)
(3)
10
10
(4)
(5)
(6)
0
0
0
4
8
12
16
VDS (V)
−8
−6
−4
BF545C
BF545C
Tj = 25 C.
VDS = 15 V; Tj = 25 C.
−2
0
VGS (V)
(1) VGS = 0 V.
(2) VGS = 1.0 V.
(3) VGS = 2.0 V.
(4) VGS = 3.0 V.
(5) VGS = 4.0 V.
(6) VGS = 5.0 V.
Fig 10. Typical output characteristics.
BF545A_BF545B_BF545C
Product data sheet
Fig 11. Typical input characteristics.
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 15 September 2011
© NXP B.V. 2011. All rights reserved.
8 of 16
BF545A; BF545B; BF545C
NXP Semiconductors
N-channel silicon junction field-effect transistors)
mbb461
103
ID
(μA)
102
10
10
1
1
10−1
10−1
10−2
10−2
10−3
−3
−2
−1
mbb458
103
ID
(μA)
102
10−3
0
VGS (V)
−6
−4
−2
BF545A
BF545B
VDS = 15 V; Tj = 25 C.
VDS = 15 V; Tj = 25 C.
Fig 12. Drain current as a function of gate-source
voltage; typical values.
mbb455
103
ID
(μA)
102
0
VGS (V)
Fig 13. Drain current as a function of gate-source
voltage; typical values.
mbb454
−102
IG
(pA)
(1)
−10
10
−1
1
(2)
(4)
10−1
(3)
−10−1
10−2
10−3
−8
−6
−4
−2
0
−10−2
0
4
VGS (V)
8
12
16
20
VDG (V)
ID = 10 mA only for BF545B and BF545C; Tj = 25 C.
BF545C
VDS = 15 V; Tj = 25 C.
(1) ID = 10 mA.
(2) ID = 1 mA.
(3) ID = 0.1 mA.
(4) IGSS.
Fig 14. Drain current as a function of gate-source
voltage; typical values.
BF545A_BF545B_BF545C
Product data sheet
Fig 15. Gate current as a function of drain-gate
voltage; typical values.
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 15 September 2011
© NXP B.V. 2011. All rights reserved.
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BF545A; BF545B; BF545C
NXP Semiconductors
N-channel silicon junction field-effect transistors)
mbb453
−103
mbb452
1
Crss
(pF)
0.8
IGSS
(pA)
−102
0.6
−10
0.4
−1
0.2
10−1
−50
0
50
100
0
−10
150
Tj (°C)
VDS = 0 V; VGS = 20 V.
−8
−6
−4
−2
0
VGS (V)
VDS = 15 V; Tj = 25 C.
Fig 16. Gate current as a function of junction
temperature; typical values.
mbb451
3
Fig 17. Reverse transfer capacitance as a function of
gate-source voltage; typical values.
mbb468
102
yis
(mS)
Ciss
(pF)
10
2
(1)
1
1
(2)
10−1
0
−10
−8
−6
−4
VDS = 15 V; Tj = 25 C.
−2
0
VGS (V)
10−2
10
102
103
f (MHz)
VDS = 10 V; ID = 1 mA; Tamb = 25 C.
(1) bis.
(2) gis.
Fig 18. Typical input capacitance.
BF545A_BF545B_BF545C
Product data sheet
Fig 19. Common-source input admittance; typical
values.
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 15 September 2011
© NXP B.V. 2011. All rights reserved.
10 of 16
BF545A; BF545B; BF545C
NXP Semiconductors
N-channel silicon junction field-effect transistors)
mbb469
102
mbb470
10
yrs
(mS)
Yfs
(mS)
(1)
1
10
10−1
(1)
(2)
(2)
1
10−2
10−1
10
102
10−3
103
102
10
f (MHz)
103
f (MHz)
VDS = 10 V; ID = 1 mA; Tamb = 25 C.
VDS = 10 V; ID = 1 mA; Tamb = 25 C.
(1) gfs.
(1) brs.
(2) bfs.
(2) grs.
Fig 20. Common-source forward transfer admittance;
typical values.
Fig 21. Common-source reverse transfer admittance;
typical values.
mbb471
10
yos
(mS)
(1)
1
10−1
(2)
10−2
10
102
103
f (MHz)
VDS = 10 V; ID = 1 mA; Tamb = 25 C.
(1) bos.
(2) gos.
Fig 22. Common-source output admittance; typical values.
BF545A_BF545B_BF545C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 15 September 2011
© NXP B.V. 2011. All rights reserved.
11 of 16
BF545A; BF545B; BF545C
NXP Semiconductors
N-channel silicon junction field-effect transistors)
9. Package outline
Plastic surface-mounted package; 3 leads
SOT23
D
E
B
A
X
HE
v M A
3
Q
A
A1
1
2
e1
bp
c
w M B
Lp
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max.
bp
c
D
E
e
e1
HE
Lp
Q
v
w
mm
1.1
0.9
0.1
0.48
0.38
0.15
0.09
3.0
2.8
1.4
1.2
1.9
0.95
2.5
2.1
0.45
0.15
0.55
0.45
0.2
0.1
OUTLINE
VERSION
SOT23
REFERENCES
IEC
JEDEC
JEITA
TO-236AB
EUROPEAN
PROJECTION
ISSUE DATE
04-11-04
06-03-16
Fig 23. Package outline.
BF545A_BF545B_BF545C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 15 September 2011
© NXP B.V. 2011. All rights reserved.
12 of 16
BF545A; BF545B; BF545C
NXP Semiconductors
N-channel silicon junction field-effect transistors)
10. Revision history
Table 9.
Revision history
Document ID
Release date
BF545A_BF545B_BF545C v.4 20110915
Modifications:
Data sheet status
Change notice Supersedes
Product data sheet
-
BF545A_BF545B_BF545C v.3
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
Legal texts have been adapted to the new company name where appropriate.
Package outline drawings have been updated to the latest version.
BF545A_BF545B_BF545C v.3 20040805
(9397 750 13391)
Product data sheet
-
BF545A-B-C v.2
BF545A-B-C v.2
Product specification
-
-
BF545A_BF545B_BF545C
Product data sheet
19960729
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 15 September 2011
© NXP B.V. 2011. All rights reserved.
13 of 16
BF545A; BF545B; BF545C
NXP Semiconductors
N-channel silicon junction field-effect transistors)
11. Legal information
11.1
Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
11.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
11.3
Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
BF545A_BF545B_BF545C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 15 September 2011
© NXP B.V. 2011. All rights reserved.
14 of 16
BF545A; BF545B; BF545C
NXP Semiconductors
N-channel silicon junction field-effect transistors)
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
11.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
12. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BF545A_BF545B_BF545C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 15 September 2011
© NXP B.V. 2011. All rights reserved.
15 of 16
NXP Semiconductors
BF545A; BF545B; BF545C
N-channel silicon junction field-effect transistors)
13. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
11.1
11.2
11.3
11.4
12
13
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13
Legal information. . . . . . . . . . . . . . . . . . . . . . . 14
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Contact information. . . . . . . . . . . . . . . . . . . . . 15
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 15 September 2011
Document identifier: BF545A_BF545B_BF545C