CY62256VN 256-Kbit (32 K × 8) Static RAM 256-Kbit (32 K × 8) Static RAM Features Functional Description ■ Temperature ranges ❐ Commercial: 0 °C to +70 °C ❐ Industrial: –40 °C to +85 °C ❐ Automotive-A: –40 °C to +85 °C ❐ Automotive-E: –40 °C to +125 °C The CY62256VN family is composed of two high performance CMOS static RAM’s organized as 32K words by 8 bits. Easy memory expansion is provided by an active LOW chip enable (CE) and active LOW output enable (OE) and tristate drivers. These devices have an automatic power-down feature, reducing the power consumption by over 99% when deselected. ■ Speed: 70 ns ■ Low voltage range: 2.7 V to 3.6 V ■ Low active power and standby power ■ Easy memory expansion with CE and OE features ■ TTL compatible inputs and outputs ■ Automatic power-down when deselected ■ CMOS for optimum speed and power An active LOW write enable signal (WE) controls the writing/reading operation of the memory. When CE and WE inputs are both LOW, data on the eight data input/output pins (I/O0 through I/O7) is written into the memory location addressed by the address present on the address pins (A0 through A14). Reading the device is accomplished by selecting the device and enabling the outputs, CE and OE active LOW, while WE remains inactive or HIGH. Under these conditions, the contents of the location addressed by the information on address pins are present on the eight data input/output pins. ■ Available in standard Pb-free and non Pb-free 28-pin (300-mil) narrow SOIC, 28-pin TSOP-I, and 28-pin reverse TSOP-I packages The input/output pins remain in a high impedance state unless the chip is selected, outputs are enabled, and write enable (WE) is HIGH. For a complete list of related documentation, click here. Logic Block Diagram I/O0 INPUTBUFFER I/O1 32K x 8 ARRAY I/O2 SENSE AMPS ROW DECODER A10 A9 A8 A7 A6 A5 A4 A3 A2 I/O3 I/O4 I/O5 CE WE COLUMN DECODER I/O6 POWER DOWN I/O7 Cypress Semiconductor Corporation Document Number: 001-06512 Rev. *H • A12 A11 A1 A0 A13 A14 OE 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600 Revised January 16, 2015 CY62256VN Contents Product Portfolio .............................................................. 3 Pin Configurations ........................................................... 3 Pin Definitions .................................................................. 3 Maximum Ratings ............................................................. 4 Operating Range ............................................................... 4 Electrical Characteristics ................................................. 4 Capacitance ...................................................................... 5 Thermal Resistance .......................................................... 5 AC Test Loads and Waveforms ....................................... 5 Data Retention Characteristics ....................................... 6 Data Retention Waveform ................................................ 6 Switching Characteristics ................................................ 7 Switching Waveforms ...................................................... 8 Typical DC and AC Characteristics .............................. 10 Truth Table ...................................................................... 11 Document Number: 001-06512 Rev. *H Ordering Information ...................................................... 12 Ordering Code Definitions ......................................... 12 Package Diagrams .......................................................... 13 Acronyms ........................................................................ 15 Document Conventions ................................................. 15 Units of Measure ....................................................... 15 Document History Page ................................................. 16 Sales, Solutions, and Legal Information ...................... 17 Worldwide Sales and Design Support ....................... 17 Products .................................................................... 17 PSoC® Solutions ...................................................... 17 Cypress Developer Community ................................. 17 Technical Support ..................................................... 17 Page 2 of 17 CY62256VN Product Portfolio Product Power Dissipation VCC Range (V) Range Operating, ICC (mA) Standby, ISB2 (A) Min Typ[1] Max Typ[1] Max Typ[1] Max CY62256VNLL Commercial 2.7 3.0 3.6 11 30 0.1 5 CY62256VNLL Industrial 2.7 3.0 3.6 11 30 0.1 10 CY62256VNLL Automotive-A 2.7 3.0 3.6 11 30 0.1 10 CY62256VNLL Automotive-E 2.7 3.0 3.6 11 30 0.1 130 Pin Configurations Figure 1. 28-pin SOIC and 28-pin TSOP I pinouts Narrow SOIC Top View A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 I/O0 I/O1 I/O2 GND VCC WE A4 A3 A2 A1 OE A0 CE I/O7 I/O6 I/O5 I/O4 I/O3 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 2 3 4 5 6 7 8 9 10 11 12 13 14 OE A1 A2 A3 A4 WE VCC A5 A6 A7 A8 A9 A10 A11 21 22 23 24 25 26 27 28 1 2 3 4 5 6 7 TSOP I Top View (not to scale) 20 19 18 17 16 15 14 13 12 11 10 9 8 A0 CE I/O7 I/O6 I/O5 I/O4 I/O3 GND I/O2 I/O1 I/O0 A14 A13 A12 A11 A10 A9 A8 A7 A6 A5 VCC WE A4 A3 A2 A1 OE 7 6 8 9 5 4 3 2 10 11 12 13 14 15 16 17 18 1 28 27 26 25 24 23 22 TSOP I Reverse Pinout Top View (not to scale) 19 20 21 A12 A13 A14 I/O0 I/O1 I/O2 GND I/O3 I/O4 I/O5 I/O6 I/O7 CE A0 Pin Definitions Pin Number Type Description 1–10, 21, 23–26 Input A0–A14. Address inputs 11–13, 15–19 Input/Output I/O0–I/O7. Data lines. Used as input or output lines depending on operation. 27 Input/Control WE. When selected LOW, a WRITE is conducted. When selected HIGH, a READ is conducted. 20 Input/Control CE. When LOW, selects the chip. When HIGH, deselects the chip. 22 Input/Control OE. Output Enable. Controls the direction of the I/O pins. When LOW, the I/O pins behave as outputs. When deasserted HIGH, I/O pins are tristated, and act as input data pins. 14 Ground GND. Ground for the device 28 Power Supply VCC. Power supply for the device Note 1. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC Typ, TA = 25 °C, and tAA = 70 ns. Document Number: 001-06512 Rev. *H Page 3 of 17 CY62256VN Maximum Ratings Static discharge voltage (per MIL-STD-883, method 3015) ......................... > 2001 V Exceeding maximum ratings may shorten the useful life of the device. User guidelines are not tested. Latch-up current ................................................... > 200 mA Storage temperature ................................ –65 °C to +150 °C Operating Range Ambient temperature with power applied .......................................... –55 °C to +125 °C Supply voltage to ground potential (pin 28 to pin 14) [2] .....................................–0.5 V to +4.6 V Device Range CY62256VN Commercial DC voltage applied to outputs in high Z State [2] ................................ –0.5 V to VCC + 0.5 V DC input voltage [2] ............................. –0.5 V to VCC + 0.5 V Ambient Temperature (TA) [3] VCC 0 °C to +70 °C 2.7 V to 3.6 V Industrial –40 °C to +85 °C Automotive-A –40 °C to +85 °C Automotive-E –40 °C to +125 °C Output current into outputs (LOW) ............................. 20 mA Electrical Characteristics Over the Operating Range Parameter Description Test Conditions -70 Min Typ [4] Max Unit VOH Output HIGH voltage IOH = 1.0 mA VCC = 2.7 V 2.4 – – V VOL Output LOW voltage IOL = 2.1 mA VCC = 2.7 V – – 0.4 V VIH Input HIGH voltage 2.2 – VCC + 0.3 V VIL Input LOW voltage IIX Input leakage current GND VIN VCC –0.5 – 0.8 V Commercial/ Industrial/ Automotive-A –1 – +1 A Automotive-E –10 – +10 A – +1 A IOZ Output leakage current GND VIN VCC, Output Disabled Commercial/ Industrial/ Automotive-A –1 Automotive-E –10 – +10 A ICC VCC operating supply current VCC = 3.6 V, IOUT = 0 mA, f = fMAX = 1/tRC All ranges – 11 30 mA ISB1 Automatic CE power-down current - TTL inputs VCC = 3.6 V, CE VIH, VIN VIH or VIN VIL, f = fMAX All ranges – 100 300 A ISB2 Automatic CE power-down current - CMOS inputs VCC = 3.6 V, Commercial CE VCC – 0.3 V, Industrial/ VIN VCC – 0.3 V or Automotive-A VIN 0.3 V, f = 0 Automotive-E – 0.1 5 A – 10 – 130 Notes 2. VIL (min) = –2.0 V for pulse durations of less than 20 ns. 3. TA is the “Instant-On” case temperature. 4. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC Typ, TA = 25 °C, and tAA = 70 ns. Document Number: 001-06512 Rev. *H Page 4 of 17 CY62256VN Capacitance Parameter [5] Description CIN Input capacitance COUT Output capacitance Test Conditions TA = 25 °C, f = 1 MHz, VCC = 3.0 V Max Unit 6 pF 8 pF Thermal Resistance Parameter [5] Description JA Thermal resistance (junction to ambient) JC Thermal resistance (junction to case) Test Conditions Still air, soldered on a 3 × 4.5 inch, two-layer printed circuit board SOIC TSOPI RTSOPI Unit 68.45 87.62 87.62 C/W 26.94 23.73 23.73 C/W AC Test Loads and Waveforms Figure 2. AC Test Loads and Waveforms R1 VCC ALL INPUT PULSES OUTPUT VCC 50 pF INCLUDING JIG AND SCOPE 10% R2 90% GND 5 ns 5 ns Equivalent to: 90% 10% THÉVENIN EQUIVALENT Rth OUTPUT Vth Parameter Value Units R1 1100 Ohms R2 1500 Ohms RTH 645 Ohms VTH 1.750 Volts Note 5. Tested initially and after any design or process changes that may affect these parameters. Document Number: 001-06512 Rev. *H Page 5 of 17 CY62256VN Data Retention Characteristics Over the Operating Range Parameter Conditions[6] Description VDR VCC for data retention ICCDR Data retention current VCC = 1.4 V, Commercial CE VCC – 0.3 V, Industrial/ VIN VCC – 0.3 V Automotive-A or VIN 0.3 V Automotive-E Min Typ [7] Max Unit 1.4 – – V – 0.1 3 A – 6 – 50 tCDR[6] Chip deselect to data retention time 0 – – ns tR[8] Operation recovery time 70 – – ns Data Retention Waveform Figure 3. Data Retention Waveform DATA RETENTION MODE 1.8 V VCC tCDR VDR 1.4 V 1.8 V tR CE Notes 6. No input may exceed VCC + 0.3 V. 7. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC Typ, TA = 25 °C, and tAA = 70 ns. 8. Tested initially and after any design or process changes that may affect these parameters. Document Number: 001-06512 Rev. *H Page 6 of 17 CY62256VN Switching Characteristics Over the Operating Range Parameter [9] Description CY62256VN-70 Min Max Unit Read Cycle tRC Read cycle time 70 – ns tAA Address to data valid – 70 ns tOHA Data hold from address change 10 – ns tACE CE LOW to data valid – 70 ns tDOE OE LOW to data valid – 35 ns [10] 5 – ns Z[10, 11] – 25 ns tLZOE tHZOE OE LOW to low Z OE HIGH to high Z[10] tLZCE CE LOW to low 10 – ns tHZCE CE HIGH to high Z[10, 11] – 25 ns tPU CE LOW to power-up 0 – ns CE HIGH to power-down – 70 ns tPD Write Cycle [12, 13] tWC Write cycle time 70 – ns tSCE CE LOW to write end 60 – ns tAW Address setup to write end 60 – ns tHA Address hold from write end 0 – ns tSA Address setup to write start 0 – ns tPWE WE pulse width 50 – ns tSD Data setup to write end 30 – ns tHD Data hold from write end 0 – ns tHZWE WE LOW to high Z[10, 11] – 25 ns 10 – ns tLZWE [10] WE HIGH to low Z Notes 9. Test conditions assume signal transition time of 5 ns or less timing reference levels of VCC/2, input pulse levels of 0 to VCC, and output loading of the specified IOL/IOH and 100-pF load capacitance. 10. At any temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any device. 11. tHZOE, tHZCE, and tHZWE are specified with CL = 5 pF as in (b) of AC Test Loads. Transition is measured ± 200 mV from steady-state voltage. 12. The internal write time of the memory is defined by the overlap of CE LOW and WE LOW. Both signals must be LOW to initiate a write and either signal can terminate a write by going HIGH. The data input set-up and hold timing should be referenced to the rising edge of the signal that terminates the write. 13. The minimum write cycle time for Write Cycle No. 3 (WE Controlled, OE LOW) is the sum of tHZWE and tSD. Document Number: 001-06512 Rev. *H Page 7 of 17 CY62256VN Switching Waveforms Figure 4. Read Cycle No. 1 [14, 15] tRC ADDRESS tAA tOHA DATA OUT PREVIOUS DATA VALID DATA VALID Figure 5. Read Cycle No. 2 [15, 16] t RC CE tACE OE DATA OUT t HZOE tHZCE tDOE t LZOE HIGH IMPEDANCE HIGH IMPEDANCE DATA VALID tLZCE VCC SUPPLY CURRENT t PD t PU ICC 50% 50% ISB Figure 6. Write Cycle No. 1 (WE Controlled) [17, 18, 19] tWC ADDRESS CE tAW tSA WE tHA t PWE OE tSD DATA I/O NOTE 20 tHD DATAINVALID t HZOE Notes 14. Device is continuously selected. OE, CE = VIL. 15. WE is HIGH for read cycle. 16. Address valid prior to or coincident with CE transition LOW. 17. The internal write time of the memory is defined by the overlap of CE LOW and WE LOW. Both signals must be LOW to initiate a write and either signal can terminate a write by going HIGH. The data input set-up and hold timing should be referenced to the rising edge of the signal that terminates the write. 18. Data I/O is high impedance if OE = VIH. 19. If CE goes HIGH simultaneously with WE HIGH, the output remains in a high impedance state. 20. During this period, the I/Os are in output state and input signals should not be applied. Document Number: 001-06512 Rev. *H Page 8 of 17 CY62256VN Switching Waveforms (continued) Figure 7. Write Cycle No. 2 (CE Controlled) [21, 22, 23] tWC ADDRESS tSCE CE tSA tAW tHA WE tSD DATA I/O t HD DATAINVALID Figure 8. Write Cycle No. 3 (WE Controlled, OE LOW) [23, 24] tWC ADDRESS CE tAW t HA tSA WE tSD DATA I/O NOTE 25 t HZWE t HD DATA INVALID tLZWE Notes 21. The internal write time of the memory is defined by the overlap of CE LOW and WE LOW. Both signals must be LOW to initiate a write and either signal can terminate a write by going HIGH. The data input set-up and hold timing should be referenced to the rising edge of the signal that terminates the write. 22. Data I/O is high impedance if OE = VIH. 23. If CE goes HIGH simultaneously with WE HIGH, the output remains in a high impedance state. 24. The minimum write cycle time for write cycle No. 3 (WE Controlled, OE LOW) is the sum of tHZWE and tSD. 25. During this period, the I/Os are in output state and input signals should not be applied. Document Number: 001-06512 Rev. *H Page 9 of 17 CY62256VN Typical DC and AC Characteristics 1.4 1.6 1.4 1.2 2.5 1.0 2.0 TA= 25C 0.4 0.2 0.0 25 125 1.6 2.0 1.4 NORMALIZED tAA VCC = 3.0V TA = 25C 0.0 1.65 1.2 1.0 0.8 0.5 2.1 2.6 3.1 3.6 0.6 55 25 125 OUTPUT SOURCE CURRENT (mA) 3. 3V 105 OUTPUT SINK CURRENT 14 vs. OUTPUT VOLTAGE 12 10 8 6 4 TA = 25°C 2 0 0.0 1.0 2.0 3.0 OUTPUT VOLTAGE (V) AMBIENT TEMPERATURE (C) SUPPLY VOLTAGE (V) 25 AMBIENT TEMPERATURE (C) NORMALIZED ACCESS TIME vs. AMBIENT TEMPERATURE 2.5 ISB –0.5 55 AMBIENT TEMPERATURE (C) SUPPLY VOLTAGE (V) 1.0 1.0 0.5 NORMALIZED ACCESS TIME vs. SUPPLY VOLTAGE 1.5 1.5 0.4 0.0 55 3.6 3.2 2.8 2.4 2.0 1.8 1.6 0.6 OUTPUT SINK CURRENT (mA) 0.6 0.8 = 0.8 cc 1.0 V 1.2 3.0 VCC = 3.0V ISB2 A NORMALIZED ICC NORMALIZED ICC 1.8 0.2 NORMALIZED tAA STANDBY CURRENT vs. AMBIENT TEMPERATURE NORMALIZED SUPPLY CURRENT vs. AMBIENT TEMPERATURE NORMALIZED SUPPLY CURRENT vs. SUPPLY VOLTAGE OUTPUT SOURCE CURRENT vs. OUTPUT VOLTAGE –14 –12 –10 –8 –6 TA = 25°C –4 0 0.0 0.5 1.0 1.5 2 2.5 OUTPUT VOLTAGE (V) Document Number: 001-06512 Rev. *H Page 10 of 17 CY62256VN Typical DC and AC Characteristics (continued) TYPICAL ACCESS TIME CHANGE vs. OUTPUT LOADING NORMALIZED ICC vs. CYCLE TIME 1.25 NORMALIZED ICC DELTA tAA (ns) 30.0 25.0 T = 25C A VCC = 3V 20.0 15.0 10.0 VCC = 3.0V 1.00 TA = 25C VIN = 0.5V 0.75 5.0 0.0 0 200 400 600 0.50 1 800 1000 10 20 30 CYCLE FREQUENCY (MHz) CAPACITANCE (pF) Truth Table CE WE OE Inputs/Outputs H X X High Z Deselect/power-down Standby (ISB) L H L Data out Read Active (ICC) L L X Data in Write Active (ICC) L H H High Z Deselect, output disabled Active (ICC) Document Number: 001-06512 Rev. *H Mode Power Page 11 of 17 CY62256VN Ordering Information Speed (ns) 70 Ordering Code Package Diagram CY62256VNLL-70ZXC 51-85071 28-pin TSOP I (Pb-free) CY62256VNLL-70SNXI 51-85092 28-pin SNC (300 Mils) Narrow Body (Pb-free) CY62256VNLL-70ZXI 51-85071 28-pin TSOP I (Pb-free) CY62256VNLL-70ZRXI 51-85074 28-pin Reverse TSOP I (Pb-free) CY62256VNLL-70SNXE 51-85092 28-pin SNC (300 Mils) Narrow Body (Pb-free) CY62256VNLL-70ZXE 51-85071 28-pin TSOP I (Pb-free) Package Type Operating Range Commercial Industrial Automotive-E Ordering Code Definitions CY 62 256 V N LL - 70 XXX X Temperature Grade: X = C or I or E C = Commercial = 0 °C to +70 °C; I = Industrial = –40 °C to +85 °C; E = Automotive-E = –40 °C to +125 °C Package Type: XXX = ZX or SNX or ZRX ZX = 28-pin TSOP I (Pb-free) SNX = 28-pin SNC (Pb-free) ZRX = 28-pin Reverse TSOP I (Pb-free) Speed Grade: 70 ns Low Power Nitride Seal Mask fix Voltage Range (3 V Typical) Density: 256 kbit Family Code: MoBL SRAM family Company ID: CY = Cypress Document Number: 001-06512 Rev. *H Page 12 of 17 CY62256VN Package Diagrams Figure 9. 28-pin SNC (300 Mils) SN28.3 (Narrow Body) Package Outline, 51-85092 51-85092 *E Figure 10. 28-pin TSOP 1 (8 × 13.4 × 1.2 mm) Z28 (Standard) Package Outline, 51-85071 51-85071 *J Document Number: 001-06512 Rev. *H Page 13 of 17 CY62256VN Package Diagrams Figure 11. 28-pin TSOP I (8 × 13.4 mm) Package Outline - Reverse, 51-85074 51-85074 *H Document Number: 001-06512 Rev. *H Page 14 of 17 CY62256VN Acronyms Acronym Document Conventions Description Units of Measure CMOS Complementary Metal Oxide Semiconductor I/O Input/Output °C degree Celsius SRAM Static Random Access Memory A microampere TSOP Thin Small Outline Package mA milliampere VFBGA Very Fine-Pitch Ball Grid Array MHz megahertz ns nanosecond ohm pF picofarad V volt W watt Document Number: 001-06512 Rev. *H Symbol Unit of Measure Page 15 of 17 CY62256VN Document History Page Document Title: CY62256VN, 256-Kbit (32 K × 8) Static RAM Document Number: 001-06512 Revision ECN Orig. of Change Submission Date ** 426504 NXR See ECN New data sheet *A 488954 NXR See ECN Added Automotive product Updated ordering Information table Corrected VIL description in the Electrical Characteristics table Description of Change *B 2769239 VKN / AESA 09/25/09 *C 2901521 AJU 03/30/2010 Removed inactive parts from Ordering Information. Updated Package Diagram. *D 3119519 AJU 01/04/2011 Updated Ordering Information. Added Ordering Code Definitions. *E 3329873 RAME 07/27/11 *F 4122787 VINI 09/13/2013 Updated Package Diagrams: spec 51-85092 – Changed revision from *C to *E. Updated in new template. Completing Sunset Review. *G 4525875 VINI 10/06/2014 Updated Maximum Ratings: Referred Note 2 in “Supply voltage to ground potential (pin 28 to pin 14)”. Updated Package Diagrams: spec 51-85071 – Changed revision from *I to *J. spec 51-85074 – Changed revision from *G to *H. Completing Sunset Review. *H 4576406 VINI 01/16/2015 Added related documentation hyperlink in page 1. Added Note 13 in Switching Characteristics. Added note reference 13 in the Switching Characteristics table. Document Number: 001-06512 Rev. *H Updated template and styles according to current Cypress standards. Added acronyms and units. Removed reference to AN1064 SRAM system guidelines. Updated operation recovery time parameter under Data Retention Characteristics on page 6. Page 16 of 17 CY62256VN Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. PSoC® Solutions Products Automotive Clocks & Buffers Interface Lighting & Power Control Memory PSoC Touch Sensing USB Controllers Wireless/RF cypress.com/go/automotive cypress.com/go/clocks cypress.com/go/interface cypress.com/go/powerpsoc psoc.cypress.com/solutions PSoC 1 | PSoC 3 | PSoC 4 | PSoC 5LP Cypress Developer Community Community | Forums | Blogs | Video | Training cypress.com/go/memory cypress.com/go/psoc cypress.com/go/touch Technical Support cypress.com/go/support cypress.com/go/USB cypress.com/go/wireless © Cypress Semiconductor Corporation, 2006-2015. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. Document Number: 001-06512 Rev. *H Revised January 16, 2015 All products and company names mentioned in this document may be the trademarks of their respective holders. Page 17 of 17