INTEGRATED CIRCUITS DATA SHEET TDA3858 Quasi-split sound processor for all standards Product specification File under Integrated Circuits, IC02 June 1994 Philips Semiconductors Product specification Quasi-split sound processor for all standards TDA3858 FEATURES GENERAL DESCRIPTION • Quasi-split sound processor for all standards e. g. B/G (FM sound) and L (AM sound) Separate symmetrical IF inputs for FM or AM sound. Gain controlled wideband IF amplifier, input select switch. AGC generation due to peak sync for FM or mean signal level for AM. Reference amplifier for the regeneration of the vision carrier. Optimized limiting amplifier for AM suppression in the regenerated vision carrier signal and 90° phase shifter. • Reducing of spurious video signals by tracking function and AFC for the vision carrier reference circuit; (recommended for NICAM) • Automatic muting of the AF2 signal (at B/G) by the input level • AM signal processing for L standard and switching over the audio signal Intercarrier mixer for FM sound, output with low-pass filter. Separate signal processing for 5.5 and 5.74 MHz intercarriers. Wide supply voltage range, only 300 mW power dissipation at 5 V. • Stereo matrix correction • Layout-compatible with TDA3856 (24 pins) and TDA3857 (20 pins). QUICK REFERENCE DATA SYMBOL PARAMETER MIN. TYP. MAX. UNIT VP1 supply voltage (pin 27) 4.5 5 8.8 V VP2 alternative supply voltage (pin 28) 10.8 12 13.2 V Data at VP1 = 5 V IP supply current (pin 27) − 60 72 mA Vi IF IF input sensitivity (−3 dB) − 70 100 µV VO (RMS) audio output signal for FM (B/G) − 1 − V VO (RMS) audio output signal for AM (L) − 0.6 − V THD total harmonic distortion for FM − 0.5 − % for AM − 1 − % for FM − 68 − dB for AM − 56 − dB S/N (W) weighted signal-to-noise ratio ORDERING INFORMATION PACKAGE EXTENDED TYPE NUMBER PINS PIN POSITION MATERIAL CODE TDA3858 32 shrink DIL plastic SOT232(1) Note 1. SOT 232-1; 1996 November 21. June 1994 2 Philips Semiconductors Product specification Quasi-split sound processor for all standards Fig.1 Block diagram (B/G and L). June 1994 3 TDA3858 Philips Semiconductors Product specification Quasi-split sound processor for all standards TDA3858 PINNING SYMBOL PIN DESCRIPTION AMIF1 1 AM IF difference input 1 for L standard (32.4 MHz) AMIF2 2 AM IF difference input 2 for L standard (32.4 MHz) n.c. 3 not connected CAGC 4 charge capacitor for AGC (FM and AM) CAM 5 charge capacitor for AM AGC MODE 6 3-state input for standard select MATR 7 input for stereo matrix correction FM2R1 8 reference circuit for FM2 (5.74 MHz) FM2R2 9 reference circuit for FM2 (5.74 MHz) AF2 10 AF2 output (AF out of 5.74 MHz) AF1 11 AF1 output (AF out of 5.5 MHz or AM) FM1R1 12 reference circuit for FM1 (5.5 MHz) FM1R2 13 reference circuit for FM1 (5.5 MHz) n.c. 14 not connected n.c. 15 not connected VC-R1 16 reference circuit for the vision carrier (38.9 MHz) VC-R2 17 reference circuit for the vision carrier (38.9 MHz) n.c. 18 not connected TRACK 19 DC output level for tracking CAFAM 20 DC decoupling capacitor for AM demodulator (AF-AM) FM1l 21 intercarrier input for FM1 (5.5. MHz) CAF1 22 DC decoupling capacitor for FM1 demodulator (AF1) ICO 23 intercarrier output signal (5.5/5.74 MHz) CAF2 24 DC decoupling capacitor for FM2 demodulator (AF2) FM2I 25 intercarrier input for FM2 (5.74 MHz) GND 26 ground (0 V) VP1 27 +5 to +8 V supply voltage (pin 28 not connected) VP2 28 + 12 V supply voltage (pin 27 not connected) CREF 29 charge capacitor for reference voltage n.c. 30 not connected FMIF1 31 IF difference input 1 for B/G standard (38.9 MHz) FMIF2 32 IF difference input 2 for B/G standard (38.9 MHz) June 1994 4 Fig.2 Pin configuration. Philips Semiconductors Product specification Quasi-split sound processor for all standards FUNCTIONAL DESCRIPTION L standard (AM mode) The quasi-split sound processor is suitable for all standards. Dependent on the voltage at pin 6 either FM mode (B/G) or AM mode (L) is selected. Pins 1 and 2 are active, AGC detector uses mean signal level. The audio signal from the AM demodulator is output on AF1, with AF2 output muted. B/G standard (FM mode) Sound carrier notch filter for an improved intercarrier buzz Pins 31 and 32 are active, AGC detector uses peak sync level. Sound carrier SC1 (5.5 MHz) provides AF1, sound carrier SC2 (5.74 MHz) provides AF2. Muting With no sound carrier SC2 at pin 25, AF2 output is muted (in mid-position of the standard select switch FM mode without muting of AF2 is selected). The mute circuit prevents false signal recognition in the stereo decoder at high IF signal levels when no second sound carrier exists (mono) and an AF signal is present in the identification signal frequency range. With 1 mV at pin 25, under measurement conditions, AF2 is switched on (see limiting amplifier). Weak input signals at pins 31 and 32 generate noise at pin 25, which is present in the intercarrier signal and passes through the 5.74 MHz filter. Noise at pin 25 inhibits muting. No misinterpretation due to white noise occurs in the stereo decoder, when non-correlated noise masks the identification signal frequencies, which may be present in sustained tone signals. The stereo decoder remains switched to mono. June 1994 The series capacitor Cs in the 38.9 MHz resonant circuit provides a notch at the sound carrier frequency in order to provide more attenuation for the sound carrier in the vision carrier reference channel. The ratio of parallel/series capacitor depends on the ratio of VC/SC frequency and has to be adapted to other TV transmission standards if necessary, according to the formula CS = CP (fVC/fSC)2 − CP. The result is an improved intercarrier buzz (up to 10 dB improvement in sound channel 2 with 250 kHz video modulation for B/G stereo) or suppression of 350 kHz video modulated beat frequency in the digitally-modulated NICAM subcarrier. TDA3858 Intercarrier buzz fine tuning with 250 kHz square wave video modulation The picture carrier for quadrature demodulation in the intercarrier mixer is not exactly 90 degrees due to the shift variation in the integrated phase shift network. The tuning of the LC reference circuit to provide optimal video suppression at the intercarrier output is not the same as that to provide optimal intercarrier buzz suppression. In order to optimize the AF signal performance, a fine tuning for the optimal S/N at the sound channel 2 (from 5.74 MHz) may be performed with a 250 kHz square wave video modulation. Measurements at the demodulators For all signal-to-noise measurements the generator must meet the following specifications: phase modulation errors < 0.5° for B/W-jumps intercarrier signal-to-noise ratio as measured with ‘TV-demodulator AMF2’ (weighted S/N) must be > 60 dB at 6 kHz sine wave modulation of the B/W-signal. Signal-to-noise ratios are measured with ∆f = ±50 kHz deviation and fmod = 1 kHz; with a deviation of ±30 kHz the S/N ratio is deteriorated by 4.5 dB. . 5 Philips Semiconductors Product specification Quasi-split sound processor for all standards TDA3858 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL PARAMETER MIN. MAX. UNIT VP1 supply voltage (pin 27) − 8.8 V VP2 supply voltage (pin 28) − 13.2 V VI voltage (pins 1, 2, 6, 10, 11, 21, 23, 25, 31and 32) 0 VP V VI(12 V) voltage at 12 V supply (pin 6) 0 5.5 V Ptot total power dissipation 0 950 mW Tstg storage temperature −25 +150 °C Tamb operating ambient temperature 0 +70 °C VESD electrostatic handling (note 1) all pins except pins 1, 2, 31 and 32 ±500 − V pins 1, 2, 31 and 32 +400 − V −500 − V Note to the Limiting Values 1. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor. June 1994 6 Philips Semiconductors Product specification Quasi-split sound processor for all standards TDA3858 CHARACTERISTICS VP = 5 V (pin 27) and Tamb = +25 °C; measurements taken in Fig.3 with fVC = 38.9 MHz, fSC1 = 33.4 MHz and fSC2 = 33.158 MHz. Vision carrier (VC) modulated with different video signals, modulation depth 100% (proportional to 10% residual carrier). Vision carrier amplitude (RMS value) Vi VC = 10 mV; vision to sound carrier ratios are VC/SC1 = 13 dB and VC/SC2 = 20 dB. Sound carriers (SC1, SC2) modulated with f = 1 kHz and deviation ∆f = 50 kHz, unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT VP1 supply voltage (pin 27) pin 28 not connected 4.5 5 8.8 V VP2 supply voltage (pin 28) pin 27 not connected 10.8 12 13.2 V IP1 supply current (pin 27) VP1 = 5 V 48 60 72 mA IF source control (pin 6) V6 input voltage in order to obtain standards pin 6 connected 2.8 − VP1 V pin 6 open-circuit − 2.8 − V pin 6 connected or alternative measure: 22 kΩ to GND 1.3 − 2.3 V L(AM sound) pin 6 connected 0 − 0.8 V I6 input current V6 = VP1 − − 100 µA V6(12 V) maximum input voltage (pin 6) B/G (FM) with automatic muting B/G (FM) without muting V6 = 0 V − − −300 µA supply at pin 28 − − 5.5 V IF input not activated (pins 1-2 or 31-32) RI input resistance − − 100 Ω VI DC input voltage (pins 1, 2 or 31, 32) LOW set internally − − 0.1 V α16-17 crosstalk attenuation of IF input switch 50 56 − dB note 1 IF amplifier (pins 1-2 or 31-32) RI input resistance 1.8 2.2 − kΩ CI input capacitance − 2.0 2.6 pF VI DC potential, voltage (pins 1, 2, 31, 32) − 1.75 − V Vi IF (RMS) maximum input signal (RMS value) Vo = +1 dB 70 100 − mV input signal sensitivity B/G standard (RMS value, pins 31-32) −3 dB intercarrier signal reduction at pin 23 − 70 100 µV input signal sensitivity L standard (RMS value, pin 1-2) −3 dB intercarrier signal reduction at pin 11 − 70 100 µV June 1994 7 Philips Semiconductors Product specification Quasi-split sound processor for all standards SYMBOL PARAMETER V4 voltage for gain control (pin 4) ∆Gv IF gain control B IF bandwidth TDA3858 CONDITIONS MIN. 1.7 TYP. MAX. UNIT − 2.6 V 60 63 − dB −3 dB 50 70 − MHz fo = 38.9 MHz − 270 − mV − 4 − kΩ − 0.247 − µH − 68 − pF − 40 − − VP1− 1 − V output signal for 5.5 MHz (RMS value) 71 95 125 mV output signal for 5.74 MHz (RMS value) 32 43 56 mV −1 dB 6 8.5 − MHz −3 dB 7 10 − MHz Resonance amplifier (pins 16-17) Vo (p-p) vision carrier amplitude (peak-to-peak value) R16-17 operating resistance L inductance C capacitance QL Q-factor of resonant circuit V16, 17 DC voltage (pins 16 and 17) Figs 3 and 5 Qo = 90 Intercarrier mixer output (pin 23) Vo(RMS) B IF bandwidth VVID/V23 residual video AM on intercarrier note 2 − 3 10 % VVC (RMS) residual vision carrier (RMS value) 1st/2nd harmonic (38.9/77.8 MHz) − 0.5 1 mV R23 output resistance (emitter follower) 1 mA emitter current − 30 − Ω Io allowable AC output current (pin 23) − − ±0.7 mA I23 allowable DC output current V23 DC voltage − − −2 mA LC-circuit at pin 16, 17 adjusted to minimum video content at pin 23 1.5 1.75 2.0 V −3 dB AF signal Limiting amplifiers (pins 21 and 25) − 300 450 µV maximum input signal (RMS value) 200 − − mV R21, 25 input resistance 450 560 700 Ω V21, 25 DC voltage − 0 − V Vi(RMS) level detector threshold for no muting only 5.74 MHz (RMS value, pin 25) channel 0.8 1.2 1.7 mV ∆Vi hysteresis of level detector 4 7 12 dB vi(RMS) June 1994 minimum input signal (RMS value) 8 Philips Semiconductors Product specification Quasi-split sound processor for all standards SYMBOL PARAMETER TDA3858 CONDITIONS MIN. TYP. MAX. UNIT Tracking Automatic Frequency Control (AFC) of the vision carrier reference circuit VP1 − 3.3 − VP1 − 1 black picture − 9 − white test picture − 4 − 50% grey picture − 6 − black picture − −8 − mV/kHz white test picture − −3 − mV/kHz 50% grey picture − −5.5 − mV/kHz V0 19 tracking output voltage (pin 19) FTR tracking reducing factor for S note 3 V AFC steepness (open loop) for FM1 and FM2 demodulators Measurements with FM IF input signals of 5.5 MHz and 5.74 MHz with Vi IF (RMS) = 10 mV (fmod = 1 kHz, deviation ∆f = ±50 kHz) at pins 21 and 25 without ceramic filters, RS = 50 Ω. De-emphasis 50 µs and V6 = VP1 (B/G standard). QL-factor = 11 for resonant circuits at pins 8-9 and 12-13 (including IC). VIC(RMS) intercarrier signals (RMS values, pins 8-9 and 12-13) − 100 − mV V DC voltage (pins 8, 9, 12 and 13) − 1.8 − V Vo(RMS) AF output signals (RMS values, pins 10 and 11) 0.84 0.95 1.07 V ∆Vo difference of AF signals between channels (pins 10 and 11) − − 1 dB R10, 11 output resistance 75 100 130 Ω V10, 11 DC voltage 1.8 2.1 2.4 V I10, 11 (M) allowed AC current of emitter output (peak value) − − ±1.5 mA note 4 note 5 I10, 11 maximum allowed DC output current − − −2 mA THD total harmonic distortion − 0.5 1.0 % Vo(RMS) AF output signal (RMS value) 1.25 − − V THD = 1.5% αAM AM suppression 1 kHz; m = 0.3 48 54 − dB S/N(W) weighted signal-to-noise ratio CCIR468-3 64 68 − dB B AF bandwidth (−3 dB) lower limit − − 20 Hz upper limit 100 − − kHz 60 70 − dB minimum output signal − 0 − V maximum output signal − 5 − V αCR crosstalk attenuation (pins 10-11) V7 adjustment voltage for AF2 June 1994 note 6 9 Philips Semiconductors Product specification Quasi-split sound processor for all standards SYMBOL PARAMETER TDA3858 CONDITIONS ∆GAF2min gain for minimum Vout V7 = 0 V ∆GAF2max gain for maximum Vout V7 = 5 V V22, 24 DC voltage (pins 22 and 24) MIN. −1.5 TYP. −2.5 MAX. − UNIT dB 1.0 1.5 − dB − 1.8 − V AM demodulator V6 = 0 V (AM mode) input signal at pins 1-2: SC = 32.4 MHz; fmod = 1 kHz; m = 0.8; Vi AM (RMS) = 10 mV Vo(RMS) AF output signal at pin 11 (RMS value) 530 600 675 mV R11 output resistance (pin 11) 75 100 130 Ω Io (M) maximum AC output current (peak value) − − ±1.5 mA I11 maximum DC output current − − −2 mA V11 DC voltage 1.8 2.1 2.4 V note 5 THD total harmonic distortion Fig.4 − 1 2 % S/N(W) weighted signal-to-noise ratio CCIR468-3 50 56 − dB B AF bandwidth (−3 dB) lower limit − − 20 Hz upper limit 100 − − kHz − 2 − V 70 − − dB V20 DC voltage (pin 20) AF signal switches input signals: AM carrier into pin 1, 2 FM intercarrier into pin 21 see part AM demodulator see part FM demodulator no signal in pin 25 (AF2) the output signals are related to the signals described in the demodulator parts. Vo/Vomute AF2 mute attenuation (pin 10) VoAM/VoFm AF1 AM signal (pin 11) attenuation of L mode; V6 = 0; unwanted FM signal FM: modulated; AM: unmodulated 70 − − dB VoFM/VoAM AF1 FM signal (pin 11) attenuation of unwanted AM signal B/G mode; V6 = VP; FM: unmodulated; AM: modulated 70 − − dB dV10, 11 DC jump at the AF outputs switching to FM or AM sound or Mute − 5 25 mV June 1994 B/G mode; V6 = VP 10 Philips Semiconductors Product specification Quasi-split sound processor for all standards SYMBOL PARAMETER TDA3858 CONDITIONS MIN. TYP. MAX. UNIT AF performance for FM operation (standard B/G) input signals: B/G IF input signal (pin 31, 32) unmodulated sound carriers different video modulation (100%) the output signals are related to the signals described in the demodulator parts. (S+N)/N(W) weighted signal-to-noise ratio CCIR468-3; de-emphasis 50 µs black picture fi = 5.5 MHz 59 63 − dB 2T/20T pulses with white bar fi = 5.5 MHz 57 61 − dB 6 kHz sine wave, B/W-modulated fi = 5.5 MHz 52 56 − dB 250 kHz square wave, B/W-modulated fi = 5.5 MHz 50 54 − dB black picture fi = 5.742 MHz 57 61 − dB 2T/20T pulses with white bar fi = 5.742 MHz 55 59 − dB 6 kHz sine wave, B/W-modulated fi = 5.742 MHz 50 54 − dB 250 kHz square wave, B/W-modulated fi = 5.742 MHz 48 52 − dB 30 40 − dB Ripple rejection of the AF outputs (B/G and L standard) RR ripple rejection Vripple on VP / Vripple on Vout VR(p-p) = 200 mV; fR = 70 Hz Notes to the characteristics 1. Crosstalk attenuation of IF input switch, measured at R16-17 = 470 Ω (instead of LC circuit); input signal Vi (RMS) = 20 mV (pins 31-32). AGC voltage V4 set to a value to achieve Vo(RMS) = 20 mV (pins 16-17). After switching (V6 = 0 V) measure attenuation. IF coupling with OFWG3203 and OFWL9350 (Siemens). 2. Spurious intercarrier AM: m = (A − B)/A (A = signal at sync; B = signal with 100% picture modulation). 3. Automatic Frequency Control (AFC) of the vision carrier reference circuit (pins 16 and 17) for reducing spurious video signals in the stereo/dual sound modes. The factor of reducing FTR at a deviation ∆fVC specifies the ratio of spurious signals with/without tracking function. 4. AF signal can be adjusted by V7. 5. For larger current: RL > 2.2 kΩ (pin 10 or 11 to GND) in order to increase the bias current of the output emitter follower. 6. If not used, pin 7 should not be connected. June 1994 11 Philips Semiconductors Product specification Quasi-split sound processor for all standards TDA3858 (1) CP = 47 pF with the optional use of tracking (because of C0 of the varicaps). Fig.3 Test and application circuit for standards B/G and L (for application SAW-filters must be used). For 12 V supply at pin 28, the capacitors shown at pin 27 must be connected to pin 28. June 1994 12 Philips Semiconductors Product specification Quasi-split sound processor for all standards TDA3858 Fig.4 Total harmonic distortion (THD) as a function of audio frequency at AM standard (V6 = 0). (1) simple resonant circuit (2) resonant circuit with CP = 68 pF CS = CP (fVC/fSC)2 − CP CS = 27 pF (see Fig.3) Fig.5 Frequency response of the 38.9 MHz reference circuit. June 1994 13 Philips Semiconductors Product specification Quasi-split sound processor for all standards APPLICATION INFORMATION Fig.6 Internal circuits (continued in Fig.7). June 1994 14 TDA3858 Philips Semiconductors Product specification Quasi-split sound processor for all standards Fig.7 Internal circuits (continued from Fig.6). June 1994 15 TDA3858 Philips Semiconductors Product specification Quasi-split sound processor for all standards TDA3858 PACKAGE OUTLINE SDIP32: plastic shrink dual in-line package; 32 leads (400 mil) SOT232-1 ME seating plane D A2 A A1 L c e Z (e 1) w M b1 MH b 17 32 pin 1 index E 1 16 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 min. A2 max. b b1 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.7 0.51 3.8 1.3 0.8 0.53 0.40 0.32 0.23 29.4 28.5 9.1 8.7 1.778 10.16 3.2 2.8 10.7 10.2 12.2 10.5 0.18 1.6 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 92-11-17 95-02-04 SOT232-1 June 1994 EUROPEAN PROJECTION 16 Philips Semiconductors Product specification Quasi-split sound processor for all standards TDA3858 with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “IC Package Databook” (order code 9398 652 90011). Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. June 1994 17