TPS819 TOSHIBA Photo IC Silicon Epitaxial Planar TPS819 Mobile Phones, PHS, Pagers Notebook PCs, PDAs Cameras Other Equipment Requiring Luminosity Adjustment Unit: mm The TPS819 is a linear-output photo-IC which incorporates a photodiode and a current amp circuit in a single chip. This photo-IC also incorporates a luminous-efficiency correction filter, so output value is close to luminosity characteristics. · High sensitivity : IL = 50~100 µA @EV = 100 lx λp = 522 nm LED · Luminous efficiency correction filter mounted on detector : λp = 550 nm (typ.) · Open-emitter output · Compact and light surface-mount package ― TOSHIBA Maximum Ratings (Ta = 25°C) Weight: 0.017 g (typ.) Characteristics Supply voltage Output voltage Light current Symbol Rating Unit VCC -0.5~7 V VOUT < = VCC V IL 10 mA Permissible power dissipation P 70 mW Operating temperature range Topr -25~85 °C Storage temperature range Tstg -40~100 °C Tsol 260 °C Soldering temperature range (Note 1) Note 1: The reflow time and the recommended temperature profile are shown in the section entitled Handling Precautions. 1 2002-02-28 TPS819 Recommended Operating Conditions Characteristics Symbol Min Typ. Max Unit Supply voltage VCC 2.2 ¾ 5.5 V Lead resistance RL 510 ¾ ¾ W Electrical and Optical Characteristics (Ta = 25°C) Characteristics Symbol Test Condition Min Typ. Max Unit ICC VCC = 3 V, EV = 1000 lx, RL = 1 kW (Note 2) ¾ 2 ¾ mA Light current (1) IL (1) VCC = 3 V, EV = 10 lx (Note 2, 5) ¾ 20 ¾ Light current (2) IL (2) VCC = 3 V, EV = 100 lx (Note 2, 5) ¾ 200 ¾ Light current (3) IL (3) VCC = 3 V, lp = 522 nm, EV = 100 lx (Note 3, 5) 50 ¾ 100 ¾ 0.03 0.10 VCC = 3.3 V, EV = 0 ¾ ¾ 0.5 mA Supply current mA IL (IR) IL (3) Light current ratio (Note 4, 5) Dark current ILEAK Saturation output voltage Vo VCC = 3 V, RL = 75 kW, EV = 100 lx (Note 3) 2.2 2.35 ¾ V Peak sensitivity wavelength lp ¾ ¾ 550 ¾ nm ¾ 0.2 ¾ ¾ 1 ¾ ¾ 0.3 ¾ ¾ 0.02 ¾ tr tf Switching time td VCC = 3 V, RL = 5 kW, lp = 522 nm (Note 6) ts ms Note 2: CIE standard A light source is used (color temperature = 2856K) Note 3: Green LED (lp = 522 nm) is used as light source and set an illuminance meter for 100 lx. Light current classification: A Rank: 50~83.5 mA, B Rank: 60~100 mA Note 4: Infrared LED (lp = 870 nm) is used as light source for IL (IR) and light current is set to obtain VCC = 3 V and 2 E = 0.01 mW/cm . Note 5: Light current measurement circuit IF VCC IL LED TPS819 OUT A IF Note 6: Rise time/fall time measurement method Pulse drive td VCC ts 1.5 V lp = 522 nm LED 90% OUT TPS819 VOUT RL 10% GND 2 tr tf 2002-02-28 TPS819 Package Dimensions Weight: 0.017 g (typ.) Pin Connection 3 VCC Current amp 4 OUT 1 GND 2 GND 3 2002-02-28 TPS819 Handling Precautions At power-on in darkness the internal circuit takes about 50 ms to stabilize. During this period the output signal is unstable and may change. Please take this into account. Moisture-proof Packing (1) To avoid moisture absorption by the resin, the product is packed in an aluminum envelope with silica gel. (2) The optical characteristics of the devices may be affected by exposure to moisture in the air before soldering and they should therefore be stored after opening the moisture proof bag under the following conditions: Temperature: 5°C~30°C, Humidity: 60% (max), Storage time: 168 h (max) Please perform baking when the storage time is expired. Expiration date for an unopened moisture proof bag is six month and 168 h for an opened moisture proof bag. This device is a tape packed product; hence, do not bake the product at high temperature: Recommended baking condition: Baking Temperature = 60°C, Baking Hours = 12 h or longer (3) Mounting Precautions (1) Do not apply stress to the resin at high temperature. (2) The resin part is easily scratched, so avoid friction with hard materials. (3) When installing the assembly board in equipment, ensure that this product does not come into contact with other components. Mounting Methods (1) Reflow soldering · Package surface temperature: 260°C (max) · Please perform reflow soldering using the following reference temperature profile. Perform reflow soldering no more than twice. Temperature (°C) ® · 260°C max 230°C 190°C 180°C Preheat 60~120 s 30~50 s Time (s) ® · Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of opening the package. · Second reflow soldering In case of second reflow soldering should be performed within 168 h of the first reflow under the above conditions. Storage conditions before the second reflow soldering: 30°C, 60% RH max · Do not perform flow soldering. · Make any necessary soldering corrections manually. (only once at each soldering point) Temperature: 350°C or less Time: within 5 s 4 2002-02-28 TPS819 (2) Recommended soldering pattern 1.3 1.6 Unit: mm 0.95 0.6 0.95 1.6 (3) Cleaning conditions When cleaning is required after soldering Chemicals: AK225 alcohol Temperature and time: 50°C ´ 30 s or : 30°C ´ 3 min Ultrasonic cleaning: 300 W or less Packing Display (1) (2) Packing quantity Reel (minimum packing quantity) 3000 pcs Carton 5 reels (15000 pcs) Packing form To avoid moisture absorption by the resin, the devices are sealed in an aluminum package with silica gel. Buffer materials are enclosed with carton. · Carton appearance Label position Carton dimensions (W) 81 mm ´ (L) 280 mm (H) 280 mm 5 2002-02-28 TPS819 Tape Packing Specifications (1) Reel dimensions 11.4 ± 1 +0 f180 - 4 9 ± 0.3 f21 ± 0.3 f13 ± 0.5 f60 2 ± 0.5 Label Tape dimensions A’ max 6° max 6° Device Orientation 3.6 ± 0.1 B’ 0.2 ± 0.05 8.0 ± 0.2 B 4.0 ± 0.1 A 2.0 ± 0.05 3.5 ± 0.1 + 0.1 f1.5 0 1.75 ± 0.1 4.0 ± 0.1 (2.75) (2) 2.8 ± 0.1 Feed direction max 6° 1.3 ± 0.1 A-A’ max 6° B-B’ 6 2002-02-28 TPS819 ILEAK – Ta P – Ta 80 (typ.) 10 Please refer to Figure 2 (mA) 60 Dark current ILEAK Power dissipation P (mW) 70 50 40 30 20 1 0.1 0.01 VCC = 3 V 10 VCC = 5 V 0 0 20 40 60 80 0.001 20 100 40 Ambient temperature Ta (°C) IL – EV 60 80 100 Ambient temperature Ta (°C) IL – Ta (typ.) 10000 (typ.) 1.4 VCC = 3 V Ta = 25°C Please refer to Figure 1 Using the A light source 100 1.2 Relative light current IL (mA) Light current Please refer to Figure 1 1000 A light source VCC = 3 V 10 1.0 0.8 Fluorescent light VCC = 3 V E = 10 lx (A light source) A light source VCC = 5 V E = 100 lx (Fluorescent light) Fluorescent light VCC = 5 V 1 1 10 100 1000 Illuminance EV 10000 E = 100 lx (A light source) 0.6 -40 100000 (lx) 0 20 40 60 80 100 Ambient temperature Ta (°C) IL – VCC (typ.) (typ.) Vo – EV 1.6 10 Ta = 25°C (V) Please refer to Figure 1 Output voltage Vo 1.2 Relative light current -20 0.8 0.4 VCC = 3 V Ta = 25°C Please refer to Figure 4 1 0.1 Fluorescent light 7.5 kW 0.01 Fluorescent light 1 kW A light source 7.5 kW A light source 1 kW 0 2 3 4 6 5 Supply voltage VCC 0.001 1 7 (V) 10 100 1000 Illuminance EV 7 10000 100000 (lx) 2002-02-28 TPS819 ICC – EV (typ.) Consumption current ICC (mA) 10000 VCC = 3 V Ta = 25°C Using the A light source 1000 RL = 1 kW Please refer to Figure 3 100 10 1 1 10 100 Illuminance EV 1000 (lx) Switching characteristics (Non-saturating operation) Switching characteristics (Saturating operation) (typ.) 10000 (typ.) 10000 Ta = 25°C Ta = 25°C VCC = 3 V VOUT = 1.5 V VCC = 3 V VOUT > = 2V lp = 522 nm lp = 522 nm Please refer to Figure 5 Please refer to Figure 5 1000 1000 tf (ms) td Switching time Switching time (ms) tf 100 tr ts 100 td 10 10 ts tr 1 0.1 1 Load resistance RL 1 0.1 10 (kW) 1 Load resistance RL 8 10 (kW) 2002-02-28 TPS819 Spectral response Radiation pattern (typ.) (typ.) 1.0 Ta = 25°C Ta = 25°C Relative sensitivity 0.8 Luminosity angle 0.6 20° 10° 0° 10° 30° 20° 30° 40° 40° 50° 0.4 50° 60° 60° 70° 0.2 70° 80° 0 200 400 600 1000 800 Wavelength l 80° 90° 1200 0 0.2 0.4 0.6 0.8 90° 1.0 Relative sensitivity (nm) Measurement Circuits VCC VCC ILEAK IL Light OUT TPS819 OUT TPS819 A A Figure 1 Light current measurement circuit Figure 2 Dark current measurement circuit Icc VCC VCC A Light Light OUT TPS819 TPS819 RL RL lp = 522 nm LED Vo Figure 4 Output voltage measurement circuit Figure 3 Consumption current measurement circuit Pulse drive V VCC OUT TPS819 RL Figure 5 Switching measurement circuit 9 2002-02-28 TPS819 RESTRICTIONS ON PRODUCT USE 000707EBA · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. · The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. · The products described in this document are subject to the foreign exchange and foreign trade laws. · The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. · The information contained herein is subject to change without notice. 10 2002-02-28