TPS851 TOSHIBA Photo IC Silicon Epitaxial Planar TPS851 Mobile Phones, PHS Notebook PCs, PDAs Video cameras, Digital Still Cameras Other Equipment Requiring Luminosity Adjustment The TPS851 is an ultra-compact surface-mount photo-IC for illuminance sensors which incorporates a photodiode and current amp circuit in a single chip. The sensitivity is superior to that of a phototransistor, and exhibits little variation. It has spectral sensitivity closer to luminous efficiency and excellent output linearity. With its ultra-compact surface-mount package, this photo-IC can be used as the power-saving control for domestic appliances or for backlighting for displays in cellular phones, this device enables low power consumption to be achieved. · Ultra-compact and light surface-mount package suitable for lead-free soldering and reflow soldering: 2.0 × 2.1 × 0.7 mm JEDEC ― JEITA ― ― · Excellent output linearity of illuminance · Little fluctuation in light current and high level of sensitivity TOSHIBA : IL = 37 µA to 74 µA @EV = 100 lx using fluorescent light Weight: 0.0054 g (typ.) : Light current variation width: ×1.67 (when light current classification is specified.) : Little temperature fluctuation · Built-in luminous-efficiency correction function, reduced sensitivity variations due to various light sources : IL (using incandescent light)/IL (using fluorescent light) = 1.2 (typ.) · Low supply voltage, making device suitable for battery-powered equipment: VCC = 2.7 V to 5.5 V Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit VCC -0.5 to 7 V VOUT < = VCC V Light current IL 5 mA Permissible power dissipation P 35 mW Operating temperature range Topr -30 to 85 °C Storage temperature range Tstg -40 to 100 °C Tsol 260 °C Supply voltage Output voltage Soldering temperature range (Note 1) Note 1: The reflow time and the recommended temperature profile are shown in the section entitled Handling Precautions. 1 2002-04-17 TPS851 Recommended Operating Conditions Characteristics Symbol Min Typ. Max Unit VCC 2.2 ¾ 5.5 V Supply voltage Electrical and Optical Characteristics (Ta = 25°C) Characteristics Supply current Symbol ICC Light current (1) IL (1) Light current (2) IL (2) Light current (3) IL (3) Light current ratio IL (1) IL (3) Dark current ILEAK Test Condition VCC = 3 V, EV = 1000 lx RL = 1 kW VCC = 3 V, EV = 100 lx (Note 2), (Note 4) VCC = 3 V, EV = 10 lx (Note 3), (Note 4) VCC = 3 V, EV = 100 lx (Note 3), (Note 4) ¾ VCC = 3.3 V, EV = 0 VCC = 3 V, RL = 150 kW, EV = 100 lx Saturation output voltage VO Peak sensitivity wavelength lp ¾ tr VCC = 3 V, RL = 5 kW Switching time Rise time Fall time (Note 2) (Note 3) (Note 5) tf Min Typ. Max Unit ¾ 620 ¾ mA ¾ 62 ¾ mA 3.7 ¾ 7.4 mA 37 ¾ 74 mA ¾ 1.2 1.7 ¾ ¾ 0.17 mA 2.2 2.35 ¾ V ¾ 600 ¾ nm ¾ 0.07 1 ¾ 0.4 2 ms Note 2: CIE standard A light source is used (color temperature = 2856K, approximated incandescence light). Note 3: Fluorescence light is used as light source. However, white LED is substituted in a mass-production process. IL classification IL (3) ® A: 37 mA to 62 mA, B: 44 mA to 74 mA Note 4: Light current measurement circuit Light source VCC IL TPS851 OUT A Note 5: Rise time/fall time time measurement method Pulse drive IF VCC White LED TPS851 1.5 V OUT 90% RL VOUT GND 2 10% tr tf 2002-04-17 TPS851 Package Dimensions Unit: mm Tolerance: ±0.1 ( ): Reference value : Light-receiving area Size of light-receiving area: (□0.35 mm) Center of sensitive area Pin connection 1. VCC 2. GND 3. NC 4. NC 5. OUT Weight: 0.0054 g (typ.) Block Diagram 1. VCC Current amp 5. OUT 2. GND 3. NC 4. NC 3 2002-04-17 TPS851 Handling Precautions At power-on in darkness, the internal circuit takes about 100 ms to stabilize. During this period the output signal is unstable and may change. Please take this into account. Moisture-Proof Packing (1) (2) (3) To avoid moisture absorption by the resin, the product is packed in an aluminum envelope with silica gel. Since the optical characteristics of the device can be affected during soldering by vaporization resulting from prior absorption of moisture and they should therefore be stored under the following conditions: Temperature: 5°C to 30°C, Relative humidity: 60% (max), Time: 168 h (max) Baking is required if the devices have been store unopened for more than six months or if the aluminum envelope has been opened for more than 168 h. These devices are packed on tapes; hence, please avoid baking at high temperature. Recommended baking conditions: 60°C for 12 h or longer Mounting Precautions (1) (2) (3) Do not apply stress to the resin at high temperature. The resin part is easily scratched, so avoid friction with hard materials. When installing the assembly board in equipment, ensure that this product does not come into contact with other components. Mounting Methods Reflow soldering · Package surface temperature: 260°C (max) · Please perform reflow soldering using the following reference temperature profile. Perform reflow soldering no more than twice. Temperature (°C) ® (1) 260°C max 230°C 190°C 180°C Preheating part 60 s to 120 s 30 s to 50 s Heating part Time (s) ® · Please perform the first reflow soldering within 168 h after opening the package with reference to the above temperature profile. · Second reflow soldering In case of second reflow soldering, it should be performed within 168 h after first reflow under the above conditions. Storage conditions before second reflow soldering: 30°C, 60% RH or lower · Do not perform flow soldering. · Make any necessary soldering correction manually. (do not do this more than once for any given pin.) Temperature: no more than 350°C (25 W for soldering iron) Time: within 5 s 4 2002-04-17 TPS851 (2) Recommended soldering pattern 0.65 Unit: mm 0.8 1.9 0.65 0.4 (3) Cleaning conditions When cleaning is required after soldering Chemicals: AK225 alcohol Temperature and time: 50°C ´ 30 s or 30°C ´ 3 mins Ultrasonic cleaning: 300 W or less Packing Specification (1) (2) Packing quantity Reel (minimum packing quantity) 3,000 devices Carton 5 reels (15,000 devices) Packing format An aluminum envelope containing silica gel and reels is deaerated and sealed. Pack shock-absorbent materials around the aluminum envelopes in the cartons to cushion them. · Carton specification Label Carton dimensions (W) 81 mm ´ (L) 280 mm ´ (H) 280 mm 5 2002-04-17 TPS851 Tape Packing Specifications Reel dimensions Reel material: Plastic Unit: mm 11.4 9.0 f180 5.0 f60 (1) Enlarged view of reel center 5.0 f21 ± 0.8 2 ± 0.5 120° f13 ± 0.2 6 2002-04-17 TPS851 (2) f1.5 Tape dimensions Tape material: Plastic (anti-electrostatic) 4.0 ± 0.1 + 0.1 -0 0.18 2.0 ± 0.1 Unit: mm Tolerance: ±0.2 B A’ 4.0 2.3 ± 0.05 A 3.5 ± 0.1 8.0 1.75 (feed hole) B’ f1.1 (pocket hole) 0.85 ± 0.05 Cross-section between B and B’ 2.2 ± 0.05 Cross-section between A and A’ 7 2002-04-17 TPS851 Reel Label The label markings may include product number, tape type and quantity. Sensor hole P/N TYPE ADDC TPS851 Q’TY 3,000 pcs. NOTE Position of label Leader and Trailer Sections of Tape Empty trailer section: at least 10 empty device slots Empty leader section: at least 100 mm of carrier tape Cover tape: 300 mm (min) 8 2002-04-17 TPS851 ILEAK – Ta P – Ta (typ.) 1 40 VCC = 3 V (mA) 30 Dark current ILEAK Power dissipation P (mW) 35 25 20 15 10 0.1 0.01 0.001 5 0 0 20 40 60 80 0.0001 20 100 40 80 100 Ambient temperature Ta (°C) Ambient temperature Ta (°C) IL – EV 60 (typ.) Relative IL – Ta (typ.) 1.40 10000 VCC = 3 V EV = 100 lx using fluorescent light 1.20 Relative light current 100 Light current IL (mA) 1000 1.00 0.80 10 0.60 -40 1 10 100 Luminance 1000 EV 0 20 40 60 80 100 Ambient temperature Ta (°C) Ta = 25°C VCC = 3 V A light source Fluorescent light 0.1 1 -20 VO – EV 10000 (typ.) 10 (lx) Relative IL – VCC 1 (typ.) Output voltage VO (V) 1.6 Relative light current 1.2 0.8 0.1 0.01 Ta = 25°C VCC = 3 V Fluorescent light Fluorescent light A light source A light source 0.001 0.4 Ta = 25°C 0 2 3 4 5 Supply voltage VCC 6 0.0001 1 7 (V) 10 100 Luminance 9 RL = 1 kW RL = 7.5 kW RL = 1 kW RL = 7.5 kW 1000 EV 10000 (lx) 2002-04-17 TPS851 ICC – EV (typ.) Relative ICC – Ta 10000 Relative consumption current 1.40 Consumption current ICC (mA) 1000 100 10 0.1 1 10 100 Luminance 1000 EV VCC = 3 V EV = 100 lx using fluorescent light RL = 1 kW 1.00 0.80 0.60 -40 Ta = 25°C VCC = 3 V Using the A light source RL = 250 W RL = 1000 W RL = 5000 W 1 1.20 (typ.) -20 0 20 40 60 80 100 Ambient temperature Ta (°C) 10000 (lx) Switching Characteristics (non-saturating operation) Switching Characteristics (saturating operation) (typ.) (typ.) 1000 1000 Ta = 25°C VCC = 3 V VOUT > =2V Using white LED Ta = 25°C VCC = 3 V VOUT = 1.5 V Using white LED 300 100 100 30 30 (ms) tf td Switching time Switching time (ms) 300 10 tr tf 10 ts 3 3 td tr ts 1 0.1 0.3 1 3 1 10 Load resistance RL (kW) 0.3 0.1 0.1 0.3 1 3 10 Load resistance RL (kW) 10 2002-04-17 TPS851 Switching Time Measurement Circuit and Waveforms Pulse drive IF VCC td 1.5 V White LED TPS851 OUT ts 90% RL VOUT GND Spectral Response 10% tr tf Radiation Pattern (typ.) 100 Ta = 25°C Luminosity angle 30° 80 20° 10° 0° 10° (typ.) Ta = 25°C 20° 30° Relative sensitivity 40° 40° 50° 60 50° 60° 60° 70° 40 80° 90° 20 0 200 70° 400 600 800 Wavelength l 1000 80° 0 0.2 0.4 0.6 0.8 90° 1.0 1200 (nm) 11 2002-04-17 TPS851 RESTRICTIONS ON PRODUCT USE 000707EBA · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. · The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. · The products described in this document are subject to the foreign exchange and foreign trade laws. · The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. · The information contained herein is subject to change without notice. 12 2002-04-17