DIODES DSS8110Y

DSS8110Y
100V LOW VCE(sat) NPN SURFACE MOUNT TRANSISTOR
Features
Mechanical Data
•
•
•
•
•
•
•
•
Epitaxial Planar Die Construction
Ideal for Low Power Amplification and Switching
Complementary PNP Type Available (DSS9110Y)
Ultra Small Surface Mount Package
“Lead Free”, RoHS Compliant (Note 1)
Halogen and Antimony Free, "Green Device" (Note 2)
•
•
•
Case: SOT-363
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish - Matte Tin annealed over Alloy 42 leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.006 grams (approximate)
C
SOT-363
C
C
E
C
C
B
B
E
Top View
Pin-Out Top
Device Symbol
Ordering Information (Note 3)
Product
DSS8110Y-7
Notes:
Marking
ZN5
Reel size (inches)
7
Tape width (mm)
8mm
Quantity per reel
3,000
1. No purposefully added lead.
2. Diode’s Inc.’s “Green” policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
ZN5
Date Code Key
Year
Code
Month
Code
2010
X
Jan
1
YM
Marking Information
2011
Y
Feb
2
DSS8110Y
Document number: DS31679 Rev. 2 - 2
Mar
3
ZN5 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: X = 2010)
M = Month (ex: 9 = September)
2012
Z
Apr
4
May
5
2013
A
Jun
6
1 of 5
www.diodes.com
Jul
7
2014
B
Aug
8
Sep
9
2015
C
Oct
O
Nov
N
Dec
D
October 2010
© Diodes Incorporated
DSS8110Y
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current - Continuous
Peak Pulse Collector Current
Base Current – Continuous
Symbol
VCBO
VCEO
VEBO
IC
ICM
IB
Value
120
100
5
1
3
0.3
Unit
V
V
V
A
A
A
Symbol
PD
RθJA
TJ, TSTG
Value
625
200
-55 to +150
Unit
mW
°C/W
°C
Thermal Characteristics
Characteristic
Power Dissipation (Note 4) @ TA = 25°C
Thermal Resistance, Junction to Ambient (Note 4) @ TA = 25°C
Operating and Storage Temperature Range
Notes:
4. Device mounted on FR-4 PCB, with minimum recommended pad layout.
0.7
10
Pw = 100µs
IC, COLLECTOR CURRENT (A)
PD, POWER DISSIPATION (W)
0.6
0.5
0.4
0.3
0.2
DC
Pw = 100ms
0.1
Pw = 10ms
Pw = 1ms
0.01
RθJA = 200°C/W
0.1
0
1
0.001
0.1
0
50
100
150
200
TA, AMBIENT TEMPERATURE (°C)
Fig. 1 Power Dissipation vs. Ambient Temperature
1,000
1
10
100
VCE, COLLECTOR-EMITTER VOLTAGE (V)
Fig. 2 Typical Collector Current
vs. Collector-Emitter Voltage
r(t), TRANSIENT THERMAL RESISTANCE
1
D = 0.7
D = 0.5
D = 0.3
0.1
D = 0.9
D = 0.1
RθJA(t) = r(t) * RθJA
RθJA = 180°C/W
D = 0.05
D = 0.02
0.01
P(pk)
D = 0.01
t1
t2
TJ - TA = P * RθJA(t)
Duty Cycle, D = t1/t2
D = 0.005
D = Single Pulse
0.001
0.00001
0.0001
DSS8110Y
Document number: DS31679 Rev. 2 - 2
0.001
0.01
0.1
1
t1, PULSE DURATION TIME (s)
Fig. 3 Transient Thermal Response
2 of 5
www.diodes.com
10
100
1,000
October 2010
© Diodes Incorporated
DSS8110Y
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
OFF CHARACTERISTICS (Note 5)
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage
Emitter-Base Breakdown Voltage
Symbol
Min
Typ
Max
Unit
BVCBO
BVCEO
BVEBO
120
100
5
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
100
50
100
100
V
V
V
nA
μA
nA
nA
150
150
100
80
⎯
⎯
⎯
⎯
⎯
500
⎯
⎯
V
⎯
⎯
⎯
⎯
⎯
⎯
40
120
200
mV
200
1.05
0.9
mΩ
V
V
VCE = 10V, IC = 1mA
VCE = 10V, IC = 250mA
VCE = 10V, IC = 500mA
VCE = 10V, IC = 1A
IC = 100mA, IB = 10mA
IC = 500mA, IB = 50mA
IC = 1A, IB = 100mA
IC = 1A, IB = 100mA
IC = 1A, IB = 100mA
VCE = 10V, IC = 1A
⎯
⎯
7.5
⎯
pF
MHz
VCB = 10V, f = 1.0MHz
VCE = 10V, IC = 50mA, f = 100MHz
Collector Cutoff Current
ICBO
Collector Cutoff Current
Emitter Cutoff Current
ON CHARACTERISTICS (Note 5)
ICES
IEBO
DC Current Gain
hFE
Collector-Emitter Saturation Voltage
VCE(sat)
Collector-Emitter Saturation Resistance
Base-Emitter Saturation Voltage
Base-Emitter Turn On Voltage
SMALL SIGNAL CHARACTERISTICS
Output Capacitance
Current Gain-Bandwidth Product
RCE(sat)
VBE(sat)
VBE(on)
⎯
⎯
⎯
⎯
⎯
⎯
Cobo
fT
⎯
100
Test Condition
IC = 100μA, IE = 0
IC = 10mA, IB = 0
IE = 100μA, IC = 0
VCB = 80V, IE = 0
VCB = 80V, IE = 0, TA = 150°C
VCE = 80V, VBE = 0
VEB = 4V, IC = 0
5. Measured under pulsed conditions. Pulse width = 300μs. Duty cycle ≤2%.
Notes:
500
1.0
400
IB = 5mA
hFE, DC CURRENT GAIN
IC, COLLECTOR CURRENT (A)
1.2
0.8
IB = 4mA
IB = 3mA
0.6
IB = 2mA
0.4
0
T A = 125°C
300
T A = 85°C
T A = 25°C
200
100
0.2
T A = 150°C
T A = -55°C
IB = 1mA
0
2
4
6
8
10
VCE, COLLECTOR-EMITTER VOLTAGE (V)
Fig. 4 Typical Collector Current
vs. Collector-Emitter Voltage
DSS8110Y
Document number: DS31679 Rev. 2 - 2
3 of 5
www.diodes.com
0
0.001
0.01
0.1
1
10
IC, COLLECTOR CURRENT (A)
Fig. 5 Typical DC Current Gain vs. Collector Current
October 2010
© Diodes Incorporated
DSS8110Y
VBE(ON), BASE-EMITTER TURN-ON VOLTAGE (V)
1
VCE(SAT), COLLECTOR-EMITTER
SATURATION VOLTAGE (V)
IC/IB = 10
0.1
TA = 150°C
TA = 85°C
TA = 125°C
TA = 25°C
T A = -55°C
0.01
0.0001
VBE(SAT), BASE-EMITTER SATURATION VOLTAGE (V)
0.001
0.01
0.1
1
10
IC, COLLECTOR CURRENT (A)
Fig. 6 Typical Collector-Emitter Saturation Voltage
vs. Collector Current
1.2
VCE = 10V
1.0
0.8
TA = -55°C
0.6
T A = 25°C
0.4
T A = 85°C
TA = 125°C
0.2
TA = 150°C
0
0.0001
0.001
0.01
0.1
1
10
IC, COLLECTOR CURRENT (A)
Fig. 7 Typical Base-Emitter Turn-On Voltage
vs. Collector Current
1.2
IC/IB = 10
1.0
0.8
T A = -55°C
0.6
TA = 25°C
0.4
TA = 85°C
TA = 125°C
0.2
0
0.1
T A = 150°C
1
10
100
1,000
IC, COLLECTOR CURRENT (mA)
Fig. 8 Typical Base-Emitter Saturation Voltage
vs. Collector Current
Package Outline Dimensions
A
SOT-363
Dim
Min
Max
A
0.10
0.30
B
1.15
1.35
C
2.00
2.20
D
0.65 Typ
F
0.40
0.45
H
1.80
2.20
J
0
0.10
K
0.90
1.00
L
0.25
0.40
M
0.10
0.22
0°
8°
α
All Dimensions in mm
B C
H
K
J
DSS8110Y
Document number: DS31679 Rev. 2 - 2
M
D
F
L
4 of 5
www.diodes.com
October 2010
© Diodes Incorporated
DSS8110Y
Suggested Pad Layout
C2
Z
C2
Dimensions Value (in mm)
Z
2.5
G
1.3
X
0.42
Y
0.6
C1
1.9
C2
0.65
C1
G
Y
X
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2010, Diodes Incorporated
www.diodes.com
DSS8110Y
Document number: DS31679 Rev. 2 - 2
5 of 5
www.diodes.com
October 2010
© Diodes Incorporated