MICREL SY89850UMG

SY89850U
Precision Low-Power LVPECL Line
Driver/Receiver with Internal Termination
General Description
The SY89850U is a 2.5V/3.3V precision, high-speed,
differential receiver capable of handling clocks up to
4GHz and data streams up to 3.2Gbps.
The differential input includes Micrel's unique, 3-pin
input termination architecture that allows users to
interface to any differential signal (AC or DC-coupled)
as small as 100mV (200mVpp) without any level
shifting or termination resistor networks in the signal
path. The outputs are 800mV LVPECL, with extremely
fast rise/fall times guaranteed to be less than 160ps.
The SY89850U operates from a 2.5V ±5% supply or a
3.3V ±10% supply and is guaranteed over the full
industrial temperature range of –40°C to +85°C. The
SY89850U is part of Micrel's high-speed, Precision
Edge™ product line.
All support documentation can be found on Micrel's
web site at www.micrel.com.
Typical Application
Precision Edge™
Features
• Guaranteed AC performance over temperature
and supply voltage:
– DC- to > 3.2Gbps data rate throughput
– 4GHz clock fmax (typ.)
– <280ps In-to-Out tpd
– <160ps tr/tf
• Low power: 50mW (2.5V typ.)
• Ultra-low jitter design:
– <1ps(rms) random jitter
– <10ps(pp) deterministic jitter
– <10ps(pp) total jitter (clock)
• Unique input termination and VT pin accepts DCand AC-coupled inputs (CML, PECL, LVDS)
• Typical 800mV (100k) LVPECL Output Swing
• Power supply 2.5V ±5% or 3.3V ±10%
• Industrial temperature range –40°C to +85°C
• Available in ultra-small (2mm x 2mm) 8-pin
MLF™ package
Applications
• Backplane buffering
• OC-12 to OC-192 SONET/SDN clock/data
distribution
• All Gigabit Ethernet clock or data distribution
• Fibre Channel distribution
Markets
•
•
•
•
LAN/WAN
Enterprise Servers
ATE
Test and Measurement
Precision Edge is a trademark of Micrel, Inc.
MicroLeadFrame and MLF are trademarks of Amkor Technology, Inc.
February 2005
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SY89850U
Ordering Information(1)
Part Number
SY89850UMG
SY89850UMGTR
(2)
Package
Type
Operating Range
Package Marking
Lead Finish
MLF-8
Industrial
850U with Pb-Free bar-line indicator
NiPdAu Pb-Free
MLF-8
Industrial
850U with Pb-Free bar-line indicator
NiPdAu Pb-Free
Notes:
1. Contact factory for dice availability. Dice are guaranteed at TA = 25°C, DC Electrical Only.
2. Tape and Reel.
Pin Configuration
8-Pin MLF™ (MLF-8)
Pin Description
Pin Number
Pin Name
1, 4
IN, /IN
Differential Input: This input pair is the signal to be buffered. These inputs accept
AC- or DC-coupled signals as small as 100mV. Each pin of this pair internally
terminates to a VT pin through 50Ω. Note that this input will default to an
indeterminate state if left open. Please refer to the “Input Interface Applications”
section for more details.
2
VT
Input Termination Center-Tap: Each side of the differential input pair terminates to
this pin. The VT pin provides a center-tap to a termination network for maximum
interface flexibility. See “Input Interface Applications” section for more details.
3
VREF-AC
5
GND,
Exposed Pad
7, 6
Q, /Q
Differential 100K LVPECL Output: This LVPECL output is the output of the device.
Terminate through 50Ω to VCC–2V. See “Output Interface Applications” section.
8
VCC
Positive Power Supply: Bypass with 0.1µF//0.01µF low ESR capacitors as close to
the VCC pin as possible.
February 2005
Pin Function
Reference Output Voltage: This output biases to VCC –1.2V. Connect to VT pin
when AC-coupling the input. Bypass with 0.01µF low ESR capacitor to VCC.
Maximum sink/source current is ±1.5mA. Due to the limited drive capability, the
VREF-AC pin is only intended to drive its respective VT pin. See “Input Interface
Applications” section.
Ground: Ground pin and exposed pad must be connected to the same ground
plane.
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SY89850U
Absolute Maximum Ratings(1)
Operating Ratings(2)
Supply Voltage (VCC) .......................... –0.5V to +4.0V
Input Voltage (VIN) .................................. –0.5V to VCC
LVPECL Output Current (IOUT) ...................................
Continuous..................................................50mA
Surge ........................................................100mA
Input Current ..............................................................
Source or sink current on IN, /IN ..............±50mA
Termination Current ...................................................
Source or sink current on VT ..................±100mA
Source or sink current on VREF–AC .....................±2mA
Lead Temperature (soldering, 20sec.) ............. 260°C
Storage Temperature (Ts) ...............–65°C to +150°C
Supply Voltage (VCC).................. +2.375V to +2.625V
......................................................+3.0V to +3.6V
Ambient Temperature (TA)................ –40°C to +85°C
Package Thermal Resistance(3)
MLF™ (θJA)
Still-Air ..................................................... 93°C/W
MLF™ (ψJB)
Junction-to-Board .................................... 60°C/W
DC Electrical Characteristics(4)
TA = –40°C to +85°C, unless noted.
Symbol
Parameter
VCC
Power Supply
ICC
Power Supply Current
RDIFF_IN
Differential Input Resistance
(IN-to-/IN)
RIN
Input Resistance
(IN-to-VT), (/IN-to-VT)
VIH
Input High Voltage
(IN, /IN)
VIL
Input Low Voltage
(IN, /IN)
VIN
Input Voltage Swing
(IN, /IN)
VDIFF_IN
Differential Input Voltage Swing
|IN–/IN|
VT_IN
In-to-VT
(IN, /IN)
VREF–AC
Output Reference Voltage
Condition
Min
Typ
Max
Units
2.375
3.0
2.5
3.3
2.625
3.6
V
V
20
30
mA
90
100
110
Ω
45
50
55
Ω
VCC–1.6
VCC
V
0
VIH–0.1
V
See Figure 1a.
0.1
1.7
V
See Figure 1b.
0.2
No load, max. VCC
Note 5
VCC–1.3
V
VCC–1.2
1.28
V
VCC–1.1
V
Notes:
1.
Permanent device damage may occur if Absolute Maximum Ratings are exceeded. This is a stress rating only and functional operation is
not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2.
The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3.
Package Thermal Resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.
4.
The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
5.
VIH (min) not lower than 1.2V.
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SY89850U
LVPECL Output DC Electrical Characteristics(6)
VCC = +2.5V ±5% or +3.3V ±10%; TA = –40°C to +85°C; RL = 50Ω to VCC –2V, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
VCC
Output High Voltage
Q, /Q
VCC –1.145
VCC –0.895
V
VOL
Output Low Voltage
Q, /Q
VCC –1.945
VCC –1.695
V
VOUT
Output Voltage Swing
Q, /Q
See Figure 1a.
550
800
mV
VDIFF_OUT
Differential Output Voltage Swing
Q, /Q
See Figure 1b.
1100
1600
mV
Note:
6.
The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
AC Electrical Characteristics(7)
VCC = +2.5V ±5% or +3.3V ±10%; TA = –40°C to +85°C; RL = 50Ω to VCC –2V, unless otherwise stated.
Symbol
Parameter
fMAX
Maximum Operating Frequency
Condition
Min
NRZ Data
VOUT ≥ 400mV
tpd
Propagation Delay
IN-to-Q
tpd
Tempco
Differential Propagation Delay
Temperature Coefficient
tJITTER
Data
Random Jitter (RJ)
Deterministic Jitter (DJ)
Clock
Cycle-to-Cycle Jitter
Total Jitter (TJ)
tr, tf
Rise/Fall Time (20% to 80%)
Q, /Q
Typ
Units
Gbps
Clock
VIN ≥ 100mV
Max
3.2
4
180
260
GHz
360
115
ps
fs/°C
Note 8
1
ps(rms)
Note 9
10
ps(pp)
Note 10
1
ps(rms)
Note 11
10
ps(pp)
160
ps
At full output swing.
50
100
Notes:
7.
The circuit is designed to meet the AC specifications shown in the above table after thermal equilibrium has been established.
8.
Random jitter is measured with a K28.7 comma detect character pattern, measured at 2.5Gbps and 3.2Gbps.
9.
Deterministic jitter is measured at 2.5Gbps and 3.2Gbps, with both K28.5 and 2 –1 PRBS pattern.
23
10. Cycle-to-cycle jitter definition: the variation of periods between adjacent cycles, Tn –Tn-1 where T is the time between rising edges of the
output signal.
12
11. Total jitter definition: with an ideal clock input of frequency < fMAX, no more than one output edge in 10 output edges will deviate by more
than the specified peak-to-peak jitter value.
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SY89850U
Single-Ended and Differential Swings
Figure 1a. Singled-Ended Voltage Swing
Figure 1b. Differential Voltage Swing
Timing Diagram
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SY89850U
Typical Operating Characteristics
VCC = 3.3V, GND = 0V, VIN = ≥ 400mVpp, tr/tf ≤ 300ps, TA = 25°C, unless otherwise stated.
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SY89850U
Functional Characteristics
VCC = 3.3V, GND = 0V, VIN = ≥ 400mVpp, tr/tf ≤ 300ps, TA = 25°C, unless otherwise stated.
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SY89850U
Input and Output Stages
Figure 2b. Simplified LVPECL Output Stage
Figure 2a. Simplified Differential Input Stage
Input Interface Applications
Option: may connect VT to VCC
Figure 3a. LVPECL Interface
(DC-Coupled)
Figure 3b. LVPECL Interface
(AC-Coupled)
Figure 3d. CML Interface
(AC-Coupled)
Figure 3e. LVDS Interface
(DC-Coupled)
February 2005
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Figure 3c. CML Interface
(DC-Coupled)
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SY89850U
Output Interface Applications
LVPECL has a high input impedance, a very low
output impedance (open emitter), and a small signal
swing which results in low EMI. LVPECL is ideal for
driving 50Ω and 100Ω-controlled impedance
transmission lines. There are several techniques for
terminating the LVPECL output: Parallel TerminationThevenin Equivalent, Parallel Termination (3-resistor),
and AC-coupled Termination. Unused output pairs
may be left floating. However, single- ended outputs
must be terminated, or balanced.
Note:
1.
For +2.5V systems, R1 = 250Ω, R2 = 62.5Ω.
Figure 4a. Parallel Termination-Thevenin Equivalent
Notes:
1. Power-saving alternative to Thevenin termination.
2. Place termination resistors as close to destination inputs as possible.
3. Rb resistor sets the DC bias voltage, equal to VT.
4. For 2.5V systems, Rb = 19Ω.
Figure 4b. Parallel Termination (3-Resistor)
Related Product and Support Documentation
Part Number
Function
Data Sheet Link
SY58601U
Ultra-Precision Differential 800mV LVPECL
Line Driver/Receiver with Internal Termination
www.micrel.com/product-info/products/sy58601u.shtml
MLFTM Application Note
www.amkor.com/products/notes_papers/MLF_AppNote.pdf
New Products and Applications
www.micrel.com/product-info/products/solutions.shtml
HBW Solutions
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SY89850U
Package Information
8-Pin Ultra-Small EPAD MLF™ (MLF-8)
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http:/www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its
use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a
product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for
surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury
to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and
Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale.
© 2005 Micrel, Incorporated.
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