MOTOROLA MRF21085LSR3

MOTOROLA
Freescale Semiconductor, Inc.
Order this document
by MRF21085/D
SEMICONDUCTOR TECHNICAL DATA
The RF MOSFET Line
RF Power Field Effect Transistors
Freescale Semiconductor, Inc...
N - Channel Enhancement - Mode Lateral MOSFETs
Designed for W- CDMA base station applications with frequencies from 2110
to 2170 MHz. Suitable for TDMA, CDMA and multicarrier amplifier applicat i o n s . To b e u s e d i n C l a s s A B f o r P C N - P C S / c e l l u l a r r a d i o a n d W L L
applications.
• Typical 2 - carrier W - CDMA Performance for VDD = 28 Volts,
IDQ = 1000 mA, f1 = 2135 MHz, f2 = 2145 MHz, Channel Bandwidth =
3.84 MHz, Adjacent Channels Measured over 3.84 MHz BW @ f1 - 5 MHz
and f2 +5 MHz, Distortion Products Measured over a 3.84 MHz BW
@ f1 - 10 MHz and f2 +10 MHz, Peak/Avg. = 8.3 dB @ 0.01% Probability
on CCDF.
Output Power — 19 Watts Avg.
Power Gain — 13.6 dB
Efficiency — 23%
IM3 — - 37.5 dBc
ACPR — - 41 dBc
• Internally Matched, Controlled Q, for Ease of Use
• High Gain, High Efficiency and High Linearity
• Integrated ESD Protection
• Designed for Maximum Gain and Insertion Phase Flatness
• Capable of Handling 5:1 VSWR, @ 28 Vdc, 2170 MHz, 90 Watts CW
Output Power
• Excellent Thermal Stability
• Characterized with Series Equivalent Large - Signal Impedance Parameters
• Available with Low Gold Plating Thickness on Leads. L Suffix Indicates
40µ″ Nominal.
• In Tape and Reel. R3 Suffix = 250 Units per 56 mm, 13 inch Reel.
MRF21085R3
MRF21085SR3
MRF21085LSR3
2170 MHz, 90 W, 28 V
LATERAL N - CHANNEL
RF POWER MOSFETs
CASE 465 - 06, STYLE 1
NI - 780
MRF21085R3
CASE 465A - 06, STYLE 1
NI - 780S
MRF21085SR3, MRF21085LSR3
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Drain - Source Voltage
VDSS
65
Vdc
Gate - Source Voltage
VGS
- 0.5, +15
Vdc
Total Device Dissipation @ TC = 25°C
Derate above 25°C
PD
224
1.28
Watts
W/°C
Storage Temperature Range
Tstg
- 65 to +150
°C
Operating Junction Temperature
TJ
200
°C
Symbol
Value (1)
Unit
RθJC
0.78
°C/W
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Case
ESD PROTECTION CHARACTERISTICS
Test Conditions
Class
Human Body Model
1 (Minimum)
Machine Model
M3 (Minimum)
(1) Refer to AN1955/D, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.motorola.com/semiconductors/rf .
Select Documentation/Application Notes - AN1955.
NOTE - CAUTION - MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and
packaging MOS devices should be observed.
REV 6
MOTOROLA
RF DEVICE DATA
 Motorola,
Inc. 2004
MRF21085R3 MRF21085SR3 MRF21085LSR3
1
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ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
Drain - Source Breakdown Voltage
(VGS = 0 Vdc, ID = 100 µAdc)
V(BR)DSS
65
—
—
Vdc
Zero Gate Voltage Drain Current
(VDS = 28 Vdc, VGS = 0 Vdc)
IDSS
—
—
10
µAdc
Gate - Source Leakage Current
(VGS = 5 Vdc, VDS = 0 Vdc)
IGSS
—
—
1
µAdc
Gate Threshold Voltage
(VDS = 10 Vdc, ID = 200 µAdc)
VGS(th)
2
—
4
Vdc
Gate Quiescent Voltage
(VDS = 28 Vdc, ID = 1000 mAdc)
VGS(Q)
3
3.9
5
Vdc
Drain - Source On - Voltage
(VGS = 10 Vdc, ID = 2 Adc)
VDS(on)
—
0.18
0.21
Vdc
Forward Transconductance
(VDS = 10 Vdc, ID = 2 Adc)
gfs
—
6
—
S
Crss
—
3.6
—
pF
OFF CHARACTERISTICS
Freescale Semiconductor, Inc...
ON CHARACTERISTICS (DC)
DYNAMIC CHARACTERISTICS (1)
Reverse Transfer Capacitance
(VDS = 28 Vdc, VGS = 0, f = 1.0 MHz)
FUNCTIONAL TESTS (In Motorola Test Fixture, 50 ohm system) 2 - carrier W - CDMA, 3.84 MHz Channel Bandwidth Carriers, ACPR and
IM3 measured in 3.84 MHz Bandwidth. Peak/Avg. = 8.3 dB @ 0.01% Probability on CCDF.
Common - Source Amplifier Power Gain
(VDD = 28 Vdc, Pout = 19 W Avg., IDQ = 1000 mA, f1 = 2112.5 MHz,
f2 = 2122.5 MHz and f1 = 2157.5 MHz, f2 = 2167.5 MHz)
Gps
12
13.6
—
dB
Drain Efficiency
(VDD = 28 Vdc, Pout = 19 W Avg., IDQ = 1000 mA, f1 = 2112.5 MHz,
f2 = 2122.5 MHz and f1 = 2157.5 MHz, f2 = 2167.5 MHz)
η
20
23
—
%
Third Order Intermodulation Distortion
(VDD = 28 Vdc, Pout = 19 W Avg., IDQ = 1000 mA, f1 = 2112.5 MHz,
f2 = 2122.5 MHz and f1 = 2157.5 MHz, f2 = 2167.5 MHz; IM3
measured over 3.84 MHz BW at f1 - 10 MHz and f2 +10 MHz
referenced to carrier channel power.)
IM3
—
- 37.5
- 35
dBc
Adjacent Channel Power Ratio
(VDD = 28 Vdc, Pout = 19 W Avg., IDQ = 1000 mA, f1 = 2112.5 MHz,
f2 = 2122.5 MHz and f1 = 2157.5 MHz, f2 = 2167.5 MHz; ACPR
measured over 3.84 MHz at f1 - 5 MHz and f2 +5 MHz.)
ACPR
—
- 41
- 38
dBc
Input Return Loss
(VDD = 28 Vdc, Pout = 19 W Avg., IDQ = 1000 mA, f1 = 2112.5 MHz,
f2 = 2122.5 MHz and f1 = 2157.5 MHz, f2 = 2167.5 MHz)
IRL
—
- 12
-9
dB
Output Mismatch Stress
(VDD = 28 Vdc, Pout = 90 W CW, IDQ = 1000 mA, f = 2170 MHz
VSWR = 5:1, All Phase Angles at Frequency of Tests)
Ψ
No Degradation In Output Power
Before and After Test
(1) Part is internally matched both on input and output.
(continued)
MRF21085R3 MRF21085SR3 MRF21085LSR3
MOTOROLA RF DEVICE DATA
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ELECTRICAL CHARACTERISTICS — continued (TC = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
Two - Tone Common - Source Amplifier Power Gain
(VDD = 28 Vdc, Pout = 90 W PEP, IDQ = 1000 mA,
f1 = 2110 MHz, f2 = 2120 MHz and f1 = 2160 MHz, f2 = 2170 MHz)
Gps
—
13.6
—
dB
Two - Tone Drain Efficiency
(VDD = 28 Vdc, Pout = 90 W PEP, IDQ = 1000 mA,
f1 = 2110 MHz, f2 = 2120 MHz and f1 = 2160 MHz, f2 = 2170 MHz)
η
—
36
—
%
Two - Tone Intermodulation Distortion
(VDD = 28 Vdc, Pout = 90 W PEP, IDQ = 1000 mA,
f1 = 2110 MHz, f2 = 2120 MHz and f1 = 2160 MHz, f2 = 2170 MHz)
IMD
—
- 31
—
dBc
Input Return Loss
(VDD = 28 Vdc, Pout = 90 W PEP, IDQ = 1000 mA,
f1 = 2110 MHz, f2 = 2120 MHz and f1 = 2160 MHz, f2 = 2170 MHz)
IRL
—
- 12
—
dB
P1dB
—
100
—
W
Freescale Semiconductor, Inc...
FUNCTIONAL TESTS (In Motorola Test Fixture, 50 ohm system) (continued)
Pout, 1 dB Compression Point
(VDD = 28 Vdc, IDQ = 1000 mA, f = 2170 MHz)
MOTOROLA RF DEVICE DATA
MRF21085R3 MRF21085SR3 MRF21085LSR3
3
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VGG
R3
R1
R4
B1
+
R2
C5
C4
C3
C7
C2
Z4
RF
INPUT
Z1
Z2
Freescale Semiconductor, Inc...
Z1
Z2
Z3
Z4
Z5
Z6
Z7
Z8
C8
Z5
Z6
x 0.084″
x 0.084″
x 0.800″
x 0.050″
x 0.800″
x 0.084″
x 0.084″
x 0.070″
C10
+
C11
C12
Microstrip
Microstrip
Microstrip
Microstrip
Microstrip
Microstrip
Microstrip
Microstrip
Z7
RF
OUTPUT
C6
DUT
0.750″
1.015″
0.480″
0.750″
0.610″
0.885″
0.720″
0.800″
C9
+
Z8
Z3
C1
VDD
L1
+
0.030″ Glass Teflon,
Keene GX - 0300 - 55 - 22, εr = 2.55
Etched Circuit Boards
MRF21085 Rev. 3, CMR
Board
PCB
Figure 1. MRF21085 Test Circuit Schematic
Table 1. MRF21085 Test Circuit Component Designations and Values
Designators
Description
B1
Short Ferrite Bead, Fair Rite, #2743019447
C1, C6
43 pF Chip Capacitors, ATC #100B430JCA500X
C2
10 pF Chip Capacitor, ATC #100B100JCA500X
C3, C9
1000 pF Chip Capacitors, ATC #100B102JCA500X
C4, C10
0.1 mF Chip Capacitors, Kemet #CDR33BX104AKWS
C5
1.0 mF Tantalum Chip Capacitor, Kemet #T491C105M050
C7
2.7 pF Chip Capacitor, ATC #100B2R7JCA500X
C8
10 mF Tantalum Chip Capacitor, Kemet #T495X106K035AS4394
C11, C12
22 mF Tantalum Chip Capacitors, Kemet #T491X226K035AS4394
L1
1 Turn, #20 AWG, 0.100″ ID, Motorola
N1, N2
Type N Flange Mounts, Omni Spectra #3052 - 1648 - 10
R1
1.0 kΩ, 1/8 W Chip Resistor
R2
180 kΩ, 1/8 W Chip Resistor
R3, R4
10 Ω, 1/8 W Chip Resistors
MRF21085R3 MRF21085SR3 MRF21085LSR3
MOTOROLA RF DEVICE DATA
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C8
C7
C2
R1
B1
R2
C3
L1
R3
WB1
CUT OUT
C5 C4
C1
C10 R4
C9
WB2
C11 C12
C6
Freescale Semiconductor, Inc...
MRF21085
Rev 3
Figure 2. MRF21085 Test Circuit Component Layout
MOTOROLA RF DEVICE DATA
MRF21085R3 MRF21085SR3 MRF21085LSR3
5
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−40
10
−45
ACPR
5
−50
0
−55
1
−30
−35
35
30
−40
−45
25
3rd Order
−50
20
5th Order
−55
15
η
−60
10
7th Order
5
100
−65
30
10
40
4
10
Pout, OUTPUT POWER (WATTS) PEP
Figure 3. 2-Carrier W-CDMA ACPR, IM3, Power Gain and
Drain Efficiency versus Output Power
Figure 4. Intermodulation Distortion
Products versus Output Power
IM3, THIRD ORDER
INTERMODULATION DISTORTION (dBc)
η, DRAIN EFFICIENCY (%), G ps , POWER GAIN (dB)
Pout, OUTPUT POWER (WATTS Avg.) N−CDMA
−25
24
−30
−35
−40
1150 mA
−45
VDD = 28 Vdc
f1 = 2135 MHz
f2 = 2145 MHz
1000 mA
−30
IM3
−40
ACPR
14
−50
G ps
12
−55
4
−20
16
850 mA
−50
VDD = 28 Vdc
2−Carrier W−CDMA
Pout = 19 W (Avg.)
10 MHz Carrier Spacing
IDQ = 1000 mA
3.84 MHz Channel Bandwidth
Peak/Avg. = 8.3 dB @ 0.01% Probability (CCDF)
18
1300 mA
−10
IRL
20
IDQ = 700 mA
0
η
22
10
100
2090
2110
2130
2150
2170
Pout, OUTPUT POWER (WATTS) PEP
f, FREQUENCY (MHz)
Figure 5. Third Order Intermodulation
Distortion versus Output Power
Figure 6. 2-Carrier W-CDMA Broadband
Performance
14.5
60
−60
2190
42
−24
40
13
30
η
20
VDD = 28 Vdc
IDQ = 1000 mA
f = 2140 MHz
12
11.5
2
10
Pout, OUTPUT POWER (WATTS)
Figure 7. CW Performance
η, DRAIN EFFICIENCY (%)
13.5
12.5
41
50
G ps
η, DRAIN EFFICIENCY (%)
G ps , POWER GAIN (dB)
IMD
14
40
−26
39
−27
38
−28
37
−29
36
−30
IDQ = 1000 mA
f = 2140 MHz
10 MHz Tone Spacing
35
0
100 130
−25
η
10
−31
34
24
25
26
27
28
−32
29
VDD, DRAIN SUPPLY (V)
Figure 8. Two-Tone Intermodulation Distortion and
Drain Efficiency versus Drain Supply
MRF21085R3 MRF21085SR3 MRF21085LSR3
MOTOROLA RF DEVICE DATA
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η, DRAIN EFFICIENCY (%)
G ps
15
Freescale Semiconductor, Inc...
−35
45
VDD = 28 Vdc
IDQ = 1000 mA
f1 = 2135 MHz
f2 = 2145 MHz
IM3 (dBc), ACPR (dBc), IRL, INPUT RETURN LOSS (dB)
20
−30
IM3
−25
IMD, INTERMODULATION DISTORTION (dBc)
25
−25
η
VDD = 28 Vdc, IDQ = 1000 mA
f1 = 2135 MHz, f2 = 2145 MHz
3.84 MHz Channel Bandwidth
Peak/Avg. = 8.3 dB @ 0.01% Probability (CCDF)
IM3 (dBc), ACPR (dBc)
30
IMD, INTERMODULATION DISTORTION (dBc)
η, DRAIN EFFICIENCY (%),G ps , POWER GAIN (dB)
TYPICAL CHARACTERISTICS
Freescale Semiconductor, Inc.
IDQ = 1300 mA
G ps , POWER GAIN (dB)
1150 mA
14
1000 mA
850 mA
13.5
700 mA
13
VDD = 28 Vdc
f1 = 2135 MHz
f2 = 2145 MHz
12.5
10
100
−10
IRL
35
−15
η
VDD = 28 Vdc
Pout = 90 W (PEP)
IDQ = 1000 mA
10 MHz Tone Spacing
30
25
−20
−25
20
IMD
−30
15
Gps
−35
10
2095
2110
2125
Pout, OUTPUT POWER (WATTS) PEP
2140
2155
−40
2185
2170
f, FREQUENCY (MHz)
Figure 9. Two-Tone Power Gain versus
Output Power
Figure 10. Two-Tone Broadband Performance
−20
0
−25
VDD = 28 Vdc
IDQ = 1000 mA
f = 2140 MHz
−10
−30
3rd Order
−20
−35
(dB)
IMD, INTERMODULATION DISTORTION (dBc)
Freescale Semiconductor, Inc...
4
40
IRL, INPUT RETURN LOSS (dB)
IMD, INTERMODULATION DISTORTION (dBc)
14.5
G ps , POWER GAIN (dB),η, DRAIN EFFICIENCY (%)
TYPICAL CHARACTERISTICS
−40
−30
f1
3.84 MHz BW
f2
3.84 MHz BW
−ACPR @
3.84 MHz BW
+ACPR @
3.84 MHz BW
−IM3 @
3.84 MHz BW
+IM3 @
3.84 MHz BW
−40
5th Order
−45
−50
7th Order
−50
−60
−55
0.1
−70
1
10
30
−20
−15
−10
−5
0
5
10
15
Df, TONE SPACING (kHz)
f, FREQUENCY (MHz)
Figure 11. Intermodulation Distortion Products
versus Two - Tone Spacing
Figure 12. 2-Carrier W-CDMA Spectrum
MOTOROLA RF DEVICE DATA
20
MRF21085R3 MRF21085SR3 MRF21085LSR3
7
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Freescale Semiconductor, Inc...
f = 2170 MHz
Zo = 5 Ω
Zload
f = 2110 MHz
f = 2170 MHz
Zsource
f = 2110 MHz
VDD = 28 V, IDQ = 1000 mA, Pout = 19 W Avg.
f
MHz
Zsource
Ω
Zload
Ω
2110
1.10 - j3.71
1.23 - j2.10
2140
1.11 - j3.57
1.26 - j1.92
2170
1.12 - j3.40
1.25 - j1.76
Zsource = Test circuit impedance as measured from
gate to ground.
Zload
= Test circuit impedance as measured
from drain to ground.
Output
Matching
Network
Device
Under Test
Input
Matching
Network
Z
source
Z
load
Figure 13. Series Equivalent Input and Output Impedance
MRF21085R3 MRF21085SR3 MRF21085LSR3
MOTOROLA RF DEVICE DATA
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Freescale Semiconductor, Inc...
NOTES
MOTOROLA RF DEVICE DATA
MRF21085R3 MRF21085SR3 MRF21085LSR3
9
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Freescale Semiconductor, Inc...
NOTES
MRF21085R3 MRF21085SR3 MRF21085LSR3
MOTOROLA RF DEVICE DATA
For More Information On This Product,
10
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Freescale Semiconductor, Inc.
PACKAGE DIMENSIONS
B
G
Q
bbb
2X
1
M
T A
M
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M−1994.
2. CONTROLLING DIMENSION: INCH.
3. DELETED
4. DIMENSION H IS MEASURED 0.030 (0.762) AWAY
FROM PACKAGE BODY.
M
3
B
K
2
(FLANGE)
D
bbb
T A
M
B
M
M
M
bbb
Freescale Semiconductor, Inc...
N
M
T A
M
B
M
ccc
M
T A
S
M
T A
M
B
M
aaa
M
T A
(LID)
B
M
(LID)
ccc
H
R
(INSULATOR)
M
(INSULATOR)
B
M
M
C
F
E
A
T
A
SEATING
PLANE
CASE 465 - 06
ISSUE F
NI - 780
MRF21085R3
(FLANGE)
4X U
(FLANGE)
1
K
2X
2
B
(FLANGE)
D
bbb
M
T A
M
B
M
N
R
(LID)
ccc
M
M
T A
M
B
M
M
B
M
ccc
M
T A
M
aaa
M
T A
M
S
(INSULATOR)
bbb
M
T A
(LID)
B
M
(INSULATOR)
B
M
H
C
3
E
A
A
(FLANGE)
MOTOROLA RF DEVICE DATA
F
T
SEATING
PLANE
INCHES
MIN
MAX
1.335
1.345
0.380
0.390
0.125
0.170
0.495
0.505
0.035
0.045
0.003
0.006
1.100 BSC
0.057
0.067
0.170
0.210
0.774
0.786
0.772
0.788
.118
.138
0.365
0.375
0.365
0.375
0.005 REF
0.010 REF
0.015 REF
MILLIMETERS
MIN
MAX
33.91
34.16
9.65
9.91
3.18
4.32
12.57
12.83
0.89
1.14
0.08
0.15
27.94 BSC
1.45
1.70
4.32
5.33
19.66
19.96
19.60
20.00
3.00
3.51
9.27
9.53
9.27
9.52
0.127 REF
0.254 REF
0.381 REF
STYLE 1:
PIN 1. DRAIN
2. GATE
3. SOURCE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M−1994.
2. CONTROLLING DIMENSION: INCH.
3. DELETED
4. DIMENSION H IS MEASURED 0.030 (0.762) AWAY
FROM PACKAGE BODY.
4X Z
(LID)
B
DIM
A
B
C
D
E
F
G
H
K
M
N
Q
R
S
aaa
bbb
ccc
DIM
A
B
C
D
E
F
H
K
M
N
R
S
U
Z
aaa
bbb
ccc
INCHES
MIN
MAX
0.805
0.815
0.380
0.390
0.125
0.170
0.495
0.505
0.035
0.045
0.003
0.006
0.057
0.067
0.170
0.210
0.774
0.786
0.772
0.788
0.365
0.375
0.365
0.375
−−−
0.040
−−−
0.030
0.005 REF
0.010 REF
0.015 REF
MILLIMETERS
MIN
MAX
20.45
20.70
9.65
9.91
3.18
4.32
12.57
12.83
0.89
1.14
0.08
0.15
1.45
1.70
4.32
5.33
19.61
20.02
19.61
20.02
9.27
9.53
9.27
9.52
−−−
1.02
−−−
0.76
0.127 REF
0.254 REF
0.381 REF
STYLE 1:
PIN 1. DRAIN
2. GATE
5. SOURCE
CASE 465A - 06
ISSUE F
NI - 780S
MRF21085SR3, MRF21085LSR3
MRF21085R3 MRF21085SR3 MRF21085LSR3
11
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Freescale Semiconductor, Inc.
Information in this document is provided solely to enable system and software implementers to use Motorola products. There are no express or implied copyright
licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document.
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including
“Typicals”, must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the
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or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part.
MOTOROLA and the Stylized M Logo are registered in the US Patent and Trademark Office. All other product or service names are the property of their respective
owners. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
E Motorola Inc. 2004
HOW TO REACH US:
USA /EUROPE /LOCATIONS NOT LISTED:
Motorola Literature Distribution
P.O. Box 5405, Denver, Colorado 80217
1-800-521-6274 or 480-768-2130
JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center,
3-20-1, Minami-Azabu, Minato-ku, Tokyo 106-8573, Japan
81-3-3440-3569
ASIA /PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre,
2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong
852-26668334
HOME PAGE: http://motorola.com/semiconductors
MRF21085R3 MRF21085SR3 MRF21085LSR3
MOTOROLA RF DEVICE MRF21085/D
DATA
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For More Information On This Product,
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