BAT54VV Schottky barrier triple diode in ultra small SOT666 package Rev. 01 — 14 September 2004 Product data sheet 1. Product profile 1.1 General description Planar Schottky barrier triple diode with an integrated guard ring for stress protection. Three electrically isolated Schottky barrier diodes, encapsulated in a SOT666 ultra small SMD plastic package. 1.2 Features ■ ■ ■ ■ Low forward voltage Ultra small SMD plastic package Low capacitance Flat leads: excellent coplanarity and improved thermal behavior. 1.3 Applications ■ ■ ■ ■ Ultra high-speed switching Voltage clamping Line termination Inverse-polarity protection. 1.4 Quick reference data Table 1: Quick reference data Symbol Parameter Min Typ Max Unit VR continuous reverse voltage Conditions - - 30 V IF continuous forward current - - 200 mA 2. Pinning information Table 2: Pinning Pin Description 1 anode (diode 1) 2 anode (diode 2) 3 anode (diode 3) 4 cathode (diode 3) 5 cathode (diode 2) 6 cathode (diode 1) Simplified outline 6 5 4 Symbol 6 5 1 2 4 3 sym046 1 2 3 SOT666 BAT54VV Philips Semiconductors Schottky barrier triple diode in ultra small SOT666 package 3. Ordering information Table 3: Ordering information Type number BAT54VV Package Name Description Version - plastic surface mounted package; 6 leads SOT666 4. Marking Table 4: Marking codes Type number Marking code BAT54VV C6 5. Limiting values Table 5: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per diode VR continuous reverse voltage - 30 V IF continuous forward current - 200 mA IFRM repetitive peak forward current tp ≤ 1 s; δ ≤ 0.5 - 300 mA IFSM non-repetitive peak forward current tp < 10 ms - 600 mA Ptot total power dissipation Tamb ≤ 25 °C - 170 mW Tj junction temperature - 125 °C Tamb ambient temperature −65 +125 °C Tstg storage temperature −65 +150 °C [1] [2] [1] Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint. [2] Single diode loaded. 6. Thermal characteristics Table 6: Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air [1] Refer to SOT666 standard mounting conditions. [2] Reflow soldering is the only recommended soldering method. 9397 750 13524 Product data sheet [1] [2] Min Typ Max Unit - - 590 K/W © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 14 September 2004 2 of 9 BAT54VV Philips Semiconductors Schottky barrier triple diode in ultra small SOT666 package 7. Characteristics Table 7: Characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit forward voltage see Figure 1; IF = 0.1 mA - - 240 mV IF = 1 mA - - 320 mV IF = 10 mA - - 400 mV IF = 30 mA - - 500 mV IF = 100 mA - - 800 mV Per diode VF IR reverse current VR = 25 V; see Figure 2 - - 2 µA Cd diode capacitance VR = 1 V; f = 1 MHz; see Figure 3 - - 10 pF [1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02. 9397 750 13524 Product data sheet [1] © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 14 September 2004 3 of 9 BAT54VV Philips Semiconductors Schottky barrier triple diode in ultra small SOT666 package msa892 103 IF (mA) msa893 103 IR (µA) (1) (2) (3) 102 (1) 102 (2) 10 10 1 10−1 (1) (2) (3) 0 1 0.4 0.8 VF (V) (3) 10−1 0 1.2 10 (1) Tamb = 125 °C. (1) Tamb = 125 °C. (2) Tamb = 85 °C. (2) Tamb = 85 °C. (3) Tamb = 25 °C. (3) Tamb = 25 °C. Fig 1. Forward current as a function of forward voltage; typical values. 20 VR (V) 30 Fig 2. Reverse current as a function of reverse voltage; typical values. msa891 15 Cd (pF) 10 5 0 0 10 20 VR (V) 30 Tamb = 25 °C; f = 1 MHz. Fig 3. Diode capacitance as a function of reverse voltage; typical values. 9397 750 13524 Product data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 14 September 2004 4 of 9 BAT54VV Philips Semiconductors Schottky barrier triple diode in ultra small SOT666 package 8. Package outline Plastic surface mounted package; 6 leads SOT666 D E A X Y S S HE 6 5 4 pin 1 index A 1 2 e1 c 3 bp w M A Lp e detail X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A bp c D E e e1 HE Lp w y mm 0.6 0.5 0.27 0.17 0.18 0.08 1.7 1.5 1.3 1.1 1.0 0.5 1.7 1.5 0.3 0.1 0.1 0.1 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 01-01-04 01-08-27 SOT666 Fig 4. Package outline SOT666. 9397 750 13524 Product data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 14 September 2004 5 of 9 BAT54VV Philips Semiconductors Schottky barrier triple diode in ultra small SOT666 package 9. Packing information Table 8: Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. [1] Type number Package Description Packing quantity 4000 BAT54VV [1] SOT666 4 mm pitch, 8 mm tape and reel -115 For further information and the availability of packing methods, see Section 14. 9397 750 13524 Product data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 14 September 2004 6 of 9 BAT54VV Philips Semiconductors Schottky barrier triple diode in ultra small SOT666 package 10. Revision history Table 9: Revision history Document ID Release date Data sheet status Change notice Doc. number Supersedes BAT54VV_1 20040914 Product data sheet - 9397 750 13524 - 9397 750 13524 Product data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 14 September 2004 7 of 9 BAT54VV Philips Semiconductors Schottky barrier triple diode in ultra small SOT666 package 11. Data sheet status Level Data sheet status [1] Product status [2] [3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 12. Definitions 13. Disclaimers Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 14. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: [email protected] 9397 750 13524 Product data sheet © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Rev. 01 — 14 September 2004 8 of 9 BAT54VV Philips Semiconductors Schottky barrier triple diode in ultra small SOT666 package 15. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . General description. . . . . . . . . . . . . . . . . . . . . . Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . Quick reference data. . . . . . . . . . . . . . . . . . . . . Pinning information . . . . . . . . . . . . . . . . . . . . . . Ordering information . . . . . . . . . . . . . . . . . . . . . Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics. . . . . . . . . . . . . . . . . . . Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . . Packing information. . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . . 1 1 1 1 1 1 2 2 2 2 3 5 6 7 8 8 8 8 © Koninklijke Philips Electronics N.V. 2004 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 14 September 2004 Document number: 9397 750 13524 Published in The Netherlands