STPS15H100CB ® HIGH VOLTAGE POWER SCHOTTKY RECTIFIER MAIN PRODUCTS CHARACTERISTICS IF(AV) 2 x 7.5 A VRRM 100 V Tj (max) 175 °C VF (max) 0.67 V A1 K A2 K FEATURES AND BENEFITS NEGLIGIBLE SWITCHING LOSSES LOW LEAKAGE CURRENT GOOD TRADE OFF BETWEEN LEAKAGE CURRENT AND FORWARD VOLTAGE DROP LOW THERMAL RESISTANCE AVALANCHE CAPABILITY SPECIFIED ■ ■ ■ A2 A1 ■ ■ DPAK DESCRIPTION Dual center tab Schottky rectifier suited for Switch Mode Power Supply and high frequency DC to DC converters. Package in DPAK, this device is intended for use in high frequency inverters. ABSOLUTE RATINGS (limiting values, per diode) Symbol VRRM IF(RMS) IF(AV) Parameter Repetitive peak reverse voltage RMS forward current Average forward current Tc = 135°C δ = 0.5 Value 100 Unit V 10 A Per diode 7.5 Per device 15 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 75 A IRRM Peak repetitive reverse current tp = 2 µs square F=1kHz 1 A PARM Repetitive peak avalanche power tp = 1µs 6600 W - 65 to + 175 °C 175 °C 10000 V/µs Tstg Tj dV/dt * : Storage temperature range Tj = 25°C Maximum operating junction temperature * Critical rate of rise reverse voltage dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j − a ) July 2003 - Ed : 2A 1/4 STPS15H100CB THERMAL RESISTANCES Symbol Rth(j-c) Rth(c) Parameter Value 4 2.4 0.7 Per diode Total Junction to case Coupling Unit °C/W When the diodes 1 and 2 are used simultaneously : ∆ Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) STATIC ELECTRICAL CHARACTERISTICS (per diode) Symbol IR * Parameter Tests Conditions Reverse leakage current Min. VR = VRRM Tj = 25°C Forward voltage drop Max. 3 Unit mA 4 mA 0.8 V 1.3 Tj = 125°C VF * Typ. Tj = 25°C IF = 7.5 A Tj = 125°C IF = 7.5 A Tj = 25°C IF = 12 A Tj = 125°C IF = 12 A Tj = 25°C IF = 15 A Tj = 125°C IF = 15 A 0.62 0.67 0.85 0.68 0.73 0.89 0.71 0.76 Pulse test : * tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation : P = 0.58 x IF(AV) + 0.012 IF2(RMS) Fig. 1: Conduction losses versus average current. Fig. 2: Average forward current versus ambient temperature (δ = 0.5). PF(av)(W) IF(av)(A) 7 9 δ = 0.5 6 8 δ = 0.2 5 6 δ=1 δ = 0.1 4 Rth(j-a)=Rth(j-c) 7 5 δ = 0.05 4 3 Rth(j-a)=70°C/W 3 2 T IF(av)(A) 0 1 2 3 4 1 δ=tp/T 0 5 6 7 T 2 1 δ=tp/T tp 0 8 9 Fig. 3: Normalized avalanche power derating versus pulse duration. 0 25 50 75 100 125 150 175 Fig. 4: Normalized avalanche power derating versus junction temperature. PARM(tp) PARM(1µs) 1 Tamb(°C) tp 1.2 PARM(tp) PARM(25°C) 1 0.1 0.8 0.6 0.4 0.01 0.2 0.001 0.01 2/4 Tj(°C) tp(µs) 0.1 1 0 10 100 1000 0 25 50 75 100 125 150 STPS15H100CB Fig. 5: Non repetitive surge peak forward current versus overload duration (maximum values). Fig. 6: Relative variation of thermal impedance junction to case versus pulse duration. Zth(j-c)/Rth(j-c) IM(A) 100 1.0 90 0.9 80 0.8 70 0.7 60 50 0.5 Tc=75°C 40 Tc=125°C 30 20 δ = 0.2 0.3 δ = 0.1 T Single pulse 0.1 t(s) t δ=0.5 0 0.4 0.2 IM 10 δ = 0.5 0.6 Tc=25°C tp(s) δ=tp/T 0.0 1.E-03 1.E-02 1.E-01 1.E+00 Fig. 7: Reverse leakage current versus reverse voltage applied (typical values). 1.E-03 1.E-02 tp 1.E-01 1.E+00 Fig. 8: Junction capacitance versus reverse voltage applied (typical values). IR(mA) C(nF) 1.E+01 1.0 Tj=150°C 1.E+00 F=1MHz Vosc=30mV Tj=25°C Tj=125°C Tj=100°C 1.E-01 0.1 Tj=75°C 1.E-02 Tj=50°C 1.E-03 Tj=25°C VR(V) VR(V) 1.E-04 0.0 0 10 20 30 40 50 60 70 80 90 100 Fig. 9: Forward voltage drop versus forward current. 1 10 100 Fig. 10: Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu = 35µm). IFM(A) Rth(j-a)(°C/W) 100 100 90 Tj=125°C (Maximum values) 80 70 60 Tj=125°C (Typical values) 10 50 Tj=25°C (Maximum values) 40 30 20 S(cm²) 10 VFM(V) 1 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 2 4 6 8 10 12 14 16 18 20 3/4 STPS15H100CB PACKAGE MECHANICAL DATA DPAK DIMENSIONS REF. Millimeters Inches A A1 A2 B B2 C C2 D E G H L2 L4 V2 Min. Max 2.20 2.40 0.90 1.10 0.03 0.23 0.64 0.90 5.20 5.40 0.45 0.60 0.48 0.60 6.00 6.20 6.40 6.60 4.40 4.60 9.35 10.10 0.80 typ. 0.60 1.00 0° 8° Min. Max. 0.086 0.094 0.035 0.043 0.001 0.009 0.025 0.035 0.204 0.212 0.017 0.023 0.018 0.023 0.236 0.244 0.251 0.259 0.173 0.181 0.368 0.397 0.031 typ. 0.023 0.039 0° 8° FOOTPRINT (dimensions in mm) 6.7 6.7 3 3 1.6 1.6 2.3 ■ 2.3 Ordering type Marking Package Weight Base qty Delivery mode STPS15H100CB S15H100 DPAK 0.30 g 75 Tube STPS15H100CB-TR S15H100 DPAK 0.30 g 2500 Tape & reel EPOXY MEETS UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. 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