STMICROELECTRONICS STU7NA80

STU7NA80
®
N - CHANNEL 800V - 1.3Ω - 6.5A - Max220
FAST POWER MOSFET
PRELIMINARY DATA
TYPE
V DSS
R DS(on)
ID
STU7NA80
800 V
< 1.5 Ω
6.5 A
■
■
■
■
■
■
■
TYPICAL RDS(on) = 1.3 Ω
± 30V GATE TO SOURCE VOLTAGE RATING
REPETITIVE AVALANCHE TESTED DATA
AT 100 oC
LOW INTRINSIC CAPACITANCE
100% AVALANCHE TESTED
GATE CHARGE MINIMIZED
REDUCED THRESHOLD VOLTAGE SPREAD
1
2
3
Max220TM
DESCRIPTION
The Max220 TM package is a new high volume
power package exibiting the same footprint as the
industry standard TO-220, but designed to
accomodate much larger silicon chips, normally
supplied in bigger packages. The increased die
capacity makes the device ideal to reduce
component count in multiple paralleled TO-220
designs and save board space with respect to
larger packages.
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
■ HIGH CURRENT, HIGH SPEED SWITCHING
■ SWITCH MODE POWER SUPPLIES (SMPS)
■ CONSUMER AND INDUSTRIAL LIGHTING
■ DC-AC CONVERTERS FOR WELDING
EQUIPMENT AND UNINTERRUPTIBLE
POWER SUPPLIES (UPS)
ABSOLUTE MAXIMUM RATINGS
Symbol
V DS
VDGR
Parameter
Value
Unit
Drain-source Voltage (V GS = 0)
800
V
Drain- gate Voltage (R GS = 20 kΩ)
800
V
Gate-source Voltage
± 30
V
ID
Drain Current (continuous) at T c = 25 o C
6.5
A
ID
Drain Current (continuous) at T c = 100 o C
4.3
A
Drain Current (pulsed)
26
A
V GS
I DM (•)
P tot
T stg
Tj
o
Total Dissipation at T c = 25 C
145
W
Derating Factor
1.16
W/ o C
Storage Temperature
Max. Operating Junction Temperature
-65 to 150
o
C
150
o
C
(•) Pulse width limited by safe operating area
June 1998
1/5
STU7NA80
THERMAL DATA
R thj-case
Rthj-amb
R thc-sink
TI
Thermal Resistance Junction-case
Thermal Resistance Junction-ambient
Thermal Resistance Case-sink
Maximum Lead Temperature For Soldering Purpose
o
0.86
30
0.1
300
Max
Max
Typ
C/W
C/W
o
C/W
o
C
o
AVALANCHE CHARACTERISTICS
Symbol
Parameter
Max Value
Unit
I AR
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T j max)
6.5
A
E AS
Single Pulse Avalanche Energy
(starting T j = 25 o C, I D = I AR , VDD = 50 V)
220
mJ
ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified)
OFF
Symbol
V (BR)DSS
I DSS
I GSS
Parameter
Drain-source
Breakdown Voltage
Test Conditions
I D = 250 µA
Zero Gate Voltage
V DS = Max Rating
Drain Current (V GS = 0) V DS = Max Rating x 0.8
Gate-body Leakage
Current (V DS = 0)
Min.
Typ.
Max.
800
VGS = 0
Unit
V
o
T c = 100 C
V GS = ± 30 V
250
1000
µA
µA
± 100
nA
ON (∗)
Symbol
Parameter
Test Conditions
V GS(th)
Gate Threshold
Voltage
V DS = VGS
ID = 250 µA
R DS(on)
Static Drain-source On
Resistance
V GS = 10 V
I D = 3.5 A
ID(on)
On State Drain Current V DS > I D(on) x R DS(on)max
V GS = 10 V
Min.
Typ.
Max.
Unit
2.25
3
3.75
V
1.3
1.5
Ω
6.5
A
DYNAMIC
Symbol
g fs (∗)
C iss
C oss
C rss
2/5
Parameter
Test Conditions
Forward
Transconductance
V DS > I D(on) x R DS(on)max
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
V DS = 25 V
f = 1 MHz
I D = 3.5 A
V GS = 0
Min.
Typ.
4.5
7.2
1770
190
50
Max.
Unit
S
2300
250
70
pF
pF
pF
STU7NA80
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbol
Parameter
Test Conditions
t d(on)
tr
Turn-on Time
Rise Time
V DD = 400 V
3.5 A
R G = 4.7 Ω
Qg
Q gs
Q gd
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V DD = 480 V
Min.
ID =
Typ.
Max.
Unit
20
30
30
45
ns
ns
75
10
34
110
nC
nC
nC
Typ.
Max.
Unit
18
20
25
27
30
40
ns
ns
ns
Typ.
Max.
Unit
6.5
26
A
A
V GS = 10 V
ID = 8 A
V GS = 10 V
SWITCHING OFF
Symbol
t r(Voff)
tf
tc
Parameter
Off-voltage Rise Time
Fall Time
Cross-over Time
Test Conditions
V DD = 640 V
R G = 4.7 Ω
Min.
ID = 7 A
V GS = 10 V
SOURCE DRAIN DIODE
Symbol
I SD
I SDM (•)
V SD (∗)
t rr
Q rr
I RRM
Parameter
Test Conditions
Min.
Source-drain Current
Source-drain Current
(pulsed)
Forward On Voltage
Reverse Recovery
Time
Reverse Recovery
Charge
Reverse Recovery
Current
I SD = 7 A
I SD = 7 A
V DD = 100 V
V GS = 0
di/dt = 100 A/µs
o
T j = 150 C
1.6
V
850
ns
17
µC
40
A
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
(•) Pulse width limited by safe operating area
3/5
STU7NA80
Max220 MECHANICAL DATA
mm
DIM.
MIN.
inch
TYP.
MAX.
MIN.
TYP.
MAX.
A
4.3
4.6
0.169
0.181
A1
2.2
2.4
0.087
0.094
A2
2.9
3.1
0.114
0.122
b
0.7
0.93
0.027
0.036
b1
1.25
1.4
0.049
0.055
b2
1.2
1.38
0.047
0.054
c
0.45
0.6
0.18
0.023
D
15.9
16.3
0.626
0.641
D1
9
9.35
0.354
0.368
D2
0.8
1.2
0.031
0.047
D3
2.8
3.2
0.110
0.126
e
2.44
2.64
0.096
0.104
E
10.05
10.35
0.396
0.407
L
13.2
13.6
0.520
0.535
L1
3
3.4
0.118
0.133
D1
D2
A1
A2
A
C
D3
b
b2
b1
D
e
E
L1
L
P011R
4/5
STU7NA80
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a trademark of STMicroelectronics
© 1998 STMicroelectronics – Printed in Italy – All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
.
5/5