STMICROELECTRONICS STW6NA80

STW6NA80
STH6NA80FI

N - CHANNEL 800V - 1.8Ω - 5.4A - TO-247/ISOWATT218
FAST POWER MOS TRANSISTOR
TYPE
STW 6NA80
STH6NA80FI
■
■
■
■
■
■
■
V DSS
R DS(on)
ID
800 V
800 V
< 2.2 Ω
< 2.2 Ω
5.4 A
3.4 A
TYPICAL RDS(on) = 1.8 Ω
AVALANCE RUGGED TECHNOLOGY
100% AVALANCHE TESTED
REPETITIVE AVALANCHE DATA AT 100oC
LOW GATE CHARGE
VERY HIGH CURRENT CAPABILITY
APPLICATION ORIENTED
CHARACTERIZATION
3
3
2
2
1
1
TO-247
APPLICATIONS
■ HIGH CURRENT, HIGH SPEED SWITCHING
■ SOLENOID AND RELAY DRIVERS
■ REGULATORS
■ DC-DC & DC-AC CONVERTERS
■ MOTOR CONTROL, AUDIO AMPLIFIERS
■ AUTOMOTIVE ENVIRONMENT (INJECTION,
ABS, AIR-BAG, LAMPDRIVERS, Etc.)
ISOWATT218
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Value
ST W6NA80
V DS
V DGR
V GS
Un it
STH6NA80F I
Drain-source Voltage (V GS = 0)
800
V
Drain- gate Voltage (R GS = 20 kΩ)
800
V
± 30
V
G ate-source Voltage
o
ID
Drain Current (continuous) at Tc = 25 C
5.4
3.4
A
ID
Drain Current (continuous) at Tc = 100 oC
3.4
2.1
A
Drain Current (pulsed)
22
22
A
T otal Dissipation at Tc = 25 C
150
60
W
Derating Factor
1.2
0.48
W /o C
Insulation W ithstand Voltage (DC)

4000
I DM (•)
P tot
V ISO
Ts tg
Tj
o
Storage Temperature
Max. Operating Junction Temperature
V
-65 to 150
o
C
150
o
C
(•) Pulse width limited by safe operating area
October 1998
1/10
STW6NA80-STH6NA80FI
THERMAL DATA
R thj -case
Thermal Resistance Junction-case
R thj -amb
R thc-sink
Tl
Thermal Resistance Junction-ambient
Max
Thermal Resistance Case-sink
Typ
Maximum Lead Temperature For Soldering Purpose
Max
TO-247
ISOW AT T218
0.83
2.08
30
0.1
300
o
C/W
o
C/W
C/W
o
C
o
AVALANCHE CHARACTERISTICS
Symbo l
Max Valu e
Unit
IAR
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by Tj max, δ < 1%)
Parameter
5.4
A
E AS
Single Pulse Avalanche Energy
(starting Tj = 25 o C, I D = IAR , VDD = 50 V)
150
mJ
E AR
Repetitive Avalanche Energy
(pulse width limited by Tj max, δ < 1%)
5.8
mJ
IAR
Avalanche Current, Repetitive or Not-Repetitive
o
(T c = 100 C, pulse width limited by T j max, δ < 1%)
3.4
A
ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified)
OFF
Symbo l
V (BR)DSS
Parameter
Drain-source
Breakdown Voltage
Test Con ditions
I D = 250 µA
Min.
V DS = Max Rating
Zero G ate Voltage
Drain Current (V GS = 0) V DS = Max Rating x 0.8
IGSS
Gate-body Leakage
Current (VDS = 0)
Max.
800
V GS = 0
I DSS
T yp.
Unit
V
Tc = 100 o C
V GS = ± 30 V
25
50
µA
µA
± 100
nA
ON (∗)
Symbo l
Parameter
Test Con ditions
ID = 250 µA
V GS(th)
Gate Threshold
Voltage
R DS(on)
Static Drain-source O n V GS = 10 V ID = 3 A
Resistance
V GS = 10 V I D = 3 A
I D(o n)
V DS = V GS
Min.
T yp.
Max.
Unit
2.25
3
3.75
V
1.8
2.2
4.4
Ω
Ω
o
T c = 100 C
5.4
On State Drain Current V DS > ID(o n) x R DS(on )ma x
V GS = 10 V
A
DYNAMIC
Symbo l
g f s (∗)
C iss
C os s
C rss
2/10
Parameter
Test Con ditions
Forward
Transconductance
V DS > ID(o n) x R DS(on )ma x
Input Capacitance
Output Capacitance
Reverse T ransfer
Capacitance
V DS = 25 V
f = 1 MHz
ID = 3 A
V GS = 0
Min.
T yp.
3
5.5
1250
140
35
Max.
Unit
S
1700
190
50
pF
pF
pF
STW6NA80-STH6NA80FI
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbo l
t d(on)
tr
(di/dt) on
Qg
Q gs
Q gd
T yp.
Max.
Unit
Turn-on Time
Rise Time
Parameter
V DD = 400 V ID = 3 A
VGS = 10 V
R G = 4.7 Ω
(see test circuit, figure 3)
Test Con ditions
40
100
55
135
ns
ns
Turn-on Current Slope
V DD = 640 V ID = 6 A
V GS = 10 V
R G = 47 Ω
(see test circuit, figure 5)
180
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V DD = 640 V
ID = 6 A
Min.
V GS = 10 V
A/µs
55
8
24
75
nC
nC
nC
T yp.
Max.
Unit
75
25
110
100
35
150
ns
ns
ns
T yp.
Max.
Unit
5.4
22
A
A
1.6
V
SWITCHING OFF
Symbo l
tr (Voff)
tf
tc
Parameter
Off-voltage Rise Time
Fall Time
Cross-over Time
Test Con ditions
Min.
V DD = 640 V ID = 6 A
R G = 47 Ω VGS = 10 V
(see test circuit, figure 5)
SOURCE DRAIN DIODE
Symbo l
Parameter
Test Con ditions
ISD
I SDM (•)
Source-drain Current
Source-drain Current
(pulsed)
V SD (∗)
Forward On Voltage
I SD = 6 A
Reverse Recovery
Time
Reverse Recovery
Charge
Reverse Recovery
Current
I SD = 6 A di/dt = 100 A/µs
o
T j = 150 C
V DD = 100 V
(see test circuit, figure 5)
t rr
Q rr
I RRM
Min.
V GS = 0
800
ns
15.2
µC
38
A
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
(•) Pulse width limited by safe operating area
Safe Operating Area for TO-247
Safe Operating Area for ISOWATT218
3/10
STW6NA80-STH6NA80FI
Thermal Impedance for TO-247
Thermal Impedance for ISOWATT218
Derating Curve for TO-247
Derating Curve for ISOWATT218
Output Characteristics
Transfer Characteristics
4/10
STW6NA80-STH6NA80FI
Transconductance
Static Drain-source On Resistance
Gate Charge vs Gate-source Voltage
Capacitance Variations
Normalized Gate Threshold Voltage vs
Temperature
Normalized On Resistance vs Temperature
5/10
STW6NA80-STH6NA80FI
Turn-on Current Slope
Turn-off Drain-source Voltage Slope
Cross-over Time
Switching Safe Operating Area
Accidental Overload Area
Source-drain Diode Forward Characteristics
6/10
STW6NA80-STH6NA80FI
Fig. 1: Unclamped Inductive Load Test Circuit
Fig. 2: Unclamped Inductive Waveform
Fig. 3: Switching Times Test Circuits For
Resistive Load
Fig. 4: Gate Charge test Circuit
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Recovery Times
7/10
STW6NA80-STH6NA80FI
TO-247 MECHANICAL DATA
mm
DIM.
MIN.
TYP.
inch
MAX.
MIN.
TYP.
MAX.
A
4.7
5.3
0.185
0.209
D
2.2
2.6
0.087
0.102
E
0.4
0.8
0.016
0.031
F
1
1.4
0.039
0.055
F3
2
2.4
0.079
0.094
F4
3
3.4
0.118
0.134
G
10.9
0.429
H
15.3
15.9
0.602
0.626
L
19.7
20.3
0.776
0.779
L3
14.2
14.8
0.559
0.413
L4
34.6
1.362
L5
5.5
0.217
0.582
M
2
3
0.079
0.118
Dia
3.55
3.65
0.140
0.144
P025P
8/10
STW6NA80-STH6NA80FI
ISOWATT218 MECHANICAL DATA
mm
DIM.
MIN.
inch
MAX.
MIN.
A
5.35
TYP.
5.65
0.210
TYP.
MAX.
0.222
C
3.3
3.8
0.130
0.149
D
2.9
3.1
0.114
0.122
D1
1.88
2.08
0.074
0.081
E
0.75
1
0.029
0.039
F
1.05
1.25
0.041
0.049
G
10.8
11.2
0.425
0.441
H
15.8
16.2
0.622
0.637
L1
20.8
21.2
0.818
0.834
L2
19.1
19.9
0.752
0.783
L3
22.8
23.6
0.897
0.929
L4
40.5
42.5
1.594
1.673
L5
4.85
5.25
0.190
0.206
L6
20.25
20.75
0.797
0.817
M
3.5
3.7
0.137
0.145
N
2.1
2.3
0.082
0.090
U
4.6
0.181
L3
C
D1
D
A
E
N
L2
L6
F
L5
H
G
U
M
1
2
3
L1
L4
P025C
9/10
STW6NA80-STH6NA80FI
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of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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 1998 STMicroelectronics – Printed in Italy – All Rights Reserved
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