TDA9309 VERTICAL DEFLECTION BOOSTER .. .. .. POWER AMPLIFIER FLYBACK GENERATOR THERMAL PROTECTION OUTPUT CURRENT UP TO 2.0APP FLYBACK VOLTAGE UP TO 70V (on Pin 5) SUITABLE FOR DC COUPLING APPLICATION HEPTAWATT (Plastic Package) DESCRIPTION Designed for monitors and high performance TVs, the TDA9309 vertical deflection booster delivers flyback voltages up to 70V. The TDA9309 operates with supplies up to 35Vand provides up to 2App output current to drive the yoke. The TDA9309 is offered in HEPTAWATT package. ORDER CODE : TDA9309 PIN CONNECTIONS 7 6 5 4 3 2 1 Inve rting Input Output S ta ge S upply Output GND Flyba ck Ge ne ra tor S upply Voltage Non-inverting Input 9309-01.EPS Ta b conne cte d to pin 4 November 1996 1/6 TDA9309 BLOCK DIAGRAM SUPPLY VOLTAGE OUTP UT STAGE SUPPLY FLYBACK GENERATOR 2 6 3 FLYBACK GENER ATOR INVERTING INPUT 7 P OWER AMP LIFIER NON-INVERTING INPUT 5 OUTP UT 1 THERMAL PROTE CTION 9309-02.EPS TDA9 309 4 GROUND Symbol Parameter Value Unit 40 V VS Supply Voltage (Pin 2) (see note 1) V6 Flyback Peak Voltage (Pin 6) (see note 1) 70 V Amplifier Input Voltage (Pins 1-7) (see note 1) VS V VS + 3.0 V V1 , V7 V3 Voltage at Pin 3 (see note 5) IO Maximum Output Peak Current (see notes 2 and 3) 1.5 A I3 Maximum Sink Current (first part of flyback) (t < 1ms) 1.5 A I3 Maximum Source Current (t < 1ms) (see note 2) 1.5 A VESD Electrostatic Handling for all pins (see note 4) 2000/300 V Toper Operating Ambient Temperature - 20, + 75 o C C C Tstg Storage Temperature - 40, + 150 o Tj Junction Temperature +150 o Notes : 1. 2. 3. 4. 5. 9309-01.TBL ABSOLUTE MAXIMUM RATINGS Versus Pin 4. The output current can reach 4A peak for t ≤ 10µs (up to 200Hz). Provided SOAR is respected (see Figures 1 and 2). Equivalent to discharging a 100pF capacitor through a 1.5kΩ serial resistor / 200pF capacitor through 0Ω resistor. This will occur during 1st half of flyback pulse. THERMAL DATA Parameter Value Rth (j-c) Junction-case Thermal Resistance Tt Temperature for Thermal Shutdown 150 o C Tjr Recommended Max. Junction Temperature 120 o C 2/6 Max. 3 Unit o C/W 9309-02.TBL Symbol TDA9309 ELECTRICAL CHARACTERISTICS (VS = 35V, TA = 25oC, unless otherwise specified) Parameter Test Conditions Min. VS Operating Supply Voltage Range I2 Pin 2 Quiescent Current I3 = 0, I5 = 0 I3 = 0, I5 = 0, V6 = 35V I6 Pin 6 Quiescent Current Max. Peak Output Current I1 Amplifier Bias Current V1 = 1V, V7 = 2.2V I7 Amplifier Bias Current V1 = 2.2V, V7 = 1V ∆VIO/dt Max. 35 V 9 20 mA 35 mA 10 IO VIO Typ. 8 19 Offset Voltage Offset Drift versus Temperature Unit ±1 A - 0.6 - 1.5 µA - 0.6 - 1.5 µA 3 mV - 10 µV/oC GV Voltage Gain V5L Output Saturation Voltage to GND (Pin 4) I5 = 1A 80 1 1.7 dB V V5H Output Saturation Voltage to Supply (Pin 6) I5 = - 1A 1.8 2.3 V VD5 - 6 Diode Forward Voltage between Pins 5-6 I5 = 1A 1.3 2 V VD3 - 2 Diode Forward Voltage between Pins 3-2 I3 = 1A 1.2 2 V V3SL Saturation Voltage on Pin 3 I3 = 20mA 0.4 1 V V3SH Saturation Voltage to Pin 2 (2nd part of flyback) I3 = - 1A 2.1 2.8 V 9309-03.TBL Symbol APPLICATION CIRCUITS AC COUPLING + VS CF 2 6 3 FLYBACK GENERATOR R5 POWER AMPLIFIER 0.22µF 1.5Ω THERMAL PROTECTION TDA9309 4 R3 R4 CL R2 R1 9309-03.EPS VREF 2.2V YOKE 5 1 330Ω 7 3/6 TDA9309 APPLICATION CIRCUITS (continued) DC COUPLING + VS CF 2 6 3 FLYBACK GENERATOR R3 POWER AMPLIFIER 5 1 THERMAL PROTECTION 0.22µF TDA9309 4 V EE VREF YOKE Vertical Position Adjustment 1.5Ω VREF 330Ω 7 R2 Figure 1 : Output Transistors SOA (for secondary breakdown) 9309-04.EPS R1 Figure 2 : Secondary Breakdown Temperature Derating Curve (ISB = secondary breakdown current) ISB (%) IC (A) 100 10 @ T ca se = 25 C 90 1 80 t = 1ms t = 10ms t = 100ms -2 1 4/6 70 VCE (V) 10 10 2 T case (°C) 60 25 50 75 100 125 9309-06.EPS 10 -1 9309-05.EPS 10 TDA9309 PIN CONFIGURATION Figure 3 : Pins 1-7 Figure 4 : Pin 3 VS VS 3 7 9309-08.EPS 9309-07.EPS 1 Figure 5 : Pins 5-6 VS 6 9309-09.EPS 5 5/6 TDA9309 PM-HEPTV.EPS PACKAGE MECHANICAL DATA : HEPTAWATT A C D D1 E F F1 G G1 G2 H2 H3 L L1 L2 L3 L5 L6 L7 M M1 Dia. Min. Millimeters Typ. 2.4 1.2 0.35 0.6 2.41 4.91 7.49 2.54 5.08 7.62 10.05 Max. 4.8 1.37 2.8 1.35 0.55 08 0.9 2.67 5.21 7.8 10.4 10.4 Min. 0.094 0.047 0.014 0.024 0.095 0.193 0.295 Max. 0.189 0.054 0.110 0.053 0.022 0.031 0.035 0.105 0.205 0.307 0.409 0.409 0.668 0.587 0.848 0.891 3 15.8 6.6 0.102 0.594 0.236 2.8 5.08 3.65 0.100 0.200 0.300 0.396 16.97 14.92 21.54 22.62 2.6 15.1 6 Inches Typ. 0.118 0.622 0.260 0.110 0.200 3.85 0.144 0.152 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. 1996 SGS-THOMSON Microelectronics - All Rights Reserved Purchase of I2C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips I2C Patent. Rights to use these components in a I2C system, is granted provided that the system confo rms to the I2C Standard Specifications as defined by Philips. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. 6/6 HEPTV.TBL Dimensions