MICROCHIP MCP6544

MCP6541/1R/1U/2/3/4
Push-Pull Output Sub-Microamp Comparators
Features:
Description:
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The Microchip Technology Inc. MCP6541/1R/1U/2/3/4
family of comparators is offered in single (MCP6541,
MCP6541R, MCP6541U), single with Chip Select (CS)
(MCP6543), dual (MCP6542) and quad (MCP6544)
configurations. The outputs are push-pull (CMOS/TTLcompatible) and are capable of driving heavy DC or
capacitive loads.
Low Quiescent Current: 600 nA/comparator (typ.)
Rail-to-Rail Input: VSS - 0.3V to VDD + 0.3V
CMOS/TTL-Compatible Output
Propagation Delay: 4 µs (typ., 100 mV Overdrive)
Wide Supply Voltage Range: 1.6V to 5.5V
Available in Single, Dual and Quad
Single available in SOT-23-5, SC-70-5 * packages
Chip Select (CS) with MCP6543
Low Switching Current
Internal Hysteresis: 3.3 mV (typ.)
Temperature Ranges:
- Industrial: -40°C to +85°C
- Extended: -40°C to +125°C
Typical Applications:
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Laptop Computers
Mobile Phones
Metering Systems
Hand-held Electronics
RC Timers
Alarm and Monitoring Circuits
Windowed Comparators
Multi-vibrators
These comparators are optimized for low-power,
single-supply operation with greater than rail-to-rail
input operation. The push-pull output of the MCP6541/
1R/1U/2/3/4 family supports rail-to-rail output swing
and interfaces with TTL/CMOS logic. The internal input
hysteresis eliminates output switching due to internal
input noise voltage, reducing current draw. The output
limits supply current surges and dynamic power
consumption while switching. This product family
operates with a single-supply voltage as low as 1.6V
and draws less than 1 µA/comparator of quiescent
current.
The related MCP6546/7/8/9 family of comparators from
Microchip has an open-drain output. Used with a pullup resistor, these devices can be used as level-shifters
for any desired voltage up to 10V and in wired-OR
logic.
* SC-70-5 E-Temp parts not available at this release of
the data sheet.
MCP6541U SOT-23-5 is E-Temp only.
Related Devices:
• Open-Drain Output: MCP6546/7/8/9
Package Types
MCP6541
PDIP, SOIC, MSOP
OUT
NC
OUT 1
VDD 2
VIN+ 3
MCP6541
SOT-23-5, SC-70-5
5 VDD
-
+
OUT 1
VSS 2
VIN+ 3
4 VIN–
OUTA
VINA–
V
INA+
4 VIN–
VSS
MCP6541U
SOT-23-5
VIN+ 1
VSS 2
VIN– 3
 2011 Microchip Technology Inc.
MCP6542
PDIP, SOIC, MSOP
5 VSS
-
+
NC
VDD
+
8
7
6
5
-
1
2
3
4
+
NC
VIN–
VIN+
VSS
MCP6541R
SOT-23-5
5 VDD
4 OUT
1
2
3
4
8
-+
7
+- 6
5
VDD
OUTA
OUTB VINA–
VINB– VINA+
VDD
VINB+
MCP6543
PDIP, SOIC, MSOP
NC
VIN–
VIN+
VSS
1
2
3
4
+
8
7
6
5
MCP6544
PDIP, SOIC, TSSOP
1
2 -+ +3
4
14 OUTD
13 VIND–
12 VIND+
11 VSS
10 VINC+
VINB+ 5
VINB– 6 - + + - 9 VINC–
OUTB 7
8 OUTC
CS
VDD
OUT
NC
DS21696G-page 1
MCP6541/1R/1U/2/3/4
NOTES:
DS21696G-page 2
 2011 Microchip Technology Inc.
MCP6541/1R/1U/2/3/4
1.0
ELECTRICAL
CHARACTERISTICS
† Notice: Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational listings of this specification is not
implied. Exposure to maximum rating conditions for extended
periods may affect device reliability.
Absolute Maximum Ratings †
VDD - VSS .........................................................................7.0V
Current at Analog Input Pin (VIN+, VIN-.........................±2 mA
†† See Section 4.1.2 “Input Voltage and Current
Limits”
Analog Input (VIN) †† ...................... VSS - 1.0V to VDD + 1.0V
All other Inputs and Outputs........... VSS - 0.3V to VDD + 0.3V
Difference Input voltage ....................................... |VDD - VSS|
Output Short-Circuit Current ................................ Continuous
Current at Input Pins ....................................................±2 mA
Current at Output and Supply Pins ............................±30 mA
Storage temperature .....................................-65°C to +150°C
Maximum Junction Temperature (TJ) .......................... +150°C
ESD protection on all pins (HBM;MM) ...................4 kV; 400V
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = +1.6V to +5.5V, VSS = GND, TA = +25°C,VIN+ = VDD/2,
VIN– = VSS, and RL = 100 k to VDD/2 (Refer to Figure 1-3).
Parameters
Sym
Min
Typ
Max
VDD
IQ
Units
1.6
—
5.5
V
0.3
0.6
1.0
µA
Conditions
Power Supply
Supply Voltage
Quiescent Current per comparator
IOUT = 0
Input
Input Voltage Range
VCMR
VSS0.3
—
VDD+0.3
V
Common Mode Rejection Ratio
CMRR
55
70
—
dB
VDD = 5V, VCM = -0.3V to 5.3V
Common Mode Rejection Ratio
CMRR
50
65
—
dB
VDD = 5V, VCM = 2.5V to 5.3V
Common Mode Rejection Ratio
CMRR
55
70
—
dB
VDD = 5V, VCM = -0.3V to 2.5V
Power Supply Rejection Ratio
PSRR
63
80
—
dB
VCM = VSS
VOS
-7.0
±1.5
+7.0
mV
VOS/TA
—
±3
—
µV/°C
VCM = VSS (Note 1)
TA = -40°C to +125°C, VCM = VSS
Input Offset Voltage
Drift with Temperature
Input Hysteresis Voltage
VHYST
1.5
3.3
6.5
mV
Linear Temp. Co. (Note 2)
TC1
—
6.7
—
µV/°C
Quadratic Temp. Co. (Note 2)
TC2
—
-0.035
—
µV/°C2 TA = -40°C to +125°C, VCM = VSS
IB
—
1
—
At Temperature (I-Temp parts)
IB
—
25
100
pA
TA = +85°C, VCM = VSS (Note 3)
At Temperature (E-Temp parts)
IB
—
1200
5000
pA
TA = +125°C, VCM = VSS (Note 3)
Input Offset Current
IOS
—
±1
—
pA
VCM = VSS
Common Mode Input Impedance
ZCM
—
1013||4
—
||pF
Differential Input Impedance
ZDIFF
—
1013||2
—
||pF
Input Bias Current
Note 1:
2:
3:
4:
pA
VCM = VSS (Note 1)
TA = -40°C to +125°C, VCM = VSS
VCM = VSS
The input offset voltage is the center (average) of the input-referred trip points. The input hysteresis is the difference
between the input-referred trip points.
VHYST at different temperatures is estimated using VHYST (TA) = VHYST + (TA - 25°C) TC1 + (TA - 25°C)2 TC2.
Input bias current at temperature is not tested for SC-70-5 package.
Limit the output current to Absolute Maximum Rating of 30 mA.
 2011 Microchip Technology Inc.
DS21696G-page 3
MCP6541/1R/1U/2/3/4
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, VDD = +1.6V to +5.5V, VSS = GND, TA = +25°C,VIN+ = VDD/2,
VIN– = VSS, and RL = 100 k to VDD/2 (Refer to Figure 1-3).
Parameters
Sym
Min
Typ
Max
Units
Conditions
High-Level Output Voltage
VOH
VDD0.2
—
—
V
Low-Level Output Voltage
VOL
—
—
VSS+0.2
V
ISC
—
-2.5, +1.5
—
mA
VDD = 1.6V (Note 4)
ISC
—
±30
—
mA
VDD = 5.5V (Note 4)
Push-Pull Output
Short-Circuit Current
Note 1:
2:
3:
4:
IOUT = -2 mA, VDD = 5V
IOUT = 2 mA, VDD = 5V
The input offset voltage is the center (average) of the input-referred trip points. The input hysteresis is the difference
between the input-referred trip points.
VHYST at different temperatures is estimated using VHYST (TA) = VHYST + (TA - 25°C) TC1 + (TA - 25°C)2 TC2.
Input bias current at temperature is not tested for SC-70-5 package.
Limit the output current to Absolute Maximum Rating of 30 mA.
AC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = +1.6V to +5.5V, VSS = GND, TA = +25°C, VIN+ = VDD/2,
Step = 200 mV, Overdrive = 100 mV, and CL = 36 pF (Refer to Figure 1-2 and Figure 1-3).
Parameters
Sym
Min
Typ
Max
Units
Rise Time
tR
—
0.85
—
µs
Fall Time
tF
—
0.85
—
µs
tPHL
—
4
8
µs
Propagation Delay (Low-to-High)
tPLH
—
4
8
µs
Propagation Delay Skew
tPDS
—
±0.2
—
µs
Maximum Toggle Frequency
fMAX
—
160
—
kHz
VDD = 1.6V
fMAX
—
120
—
kHz
VDD = 5.5V
Eni
—
200
—
µVP-P
Propagation Delay (High-to-Low)
Input Noise Voltage
Note 1:
Conditions
(Note 1)
10 Hz to 100 kHz
Propagation Delay Skew is defined as: tPDS = tPLH - tPHL.
DS21696G-page 4
 2011 Microchip Technology Inc.
MCP6541/1R/1U/2/3/4
MCP6543 CHIP SELECT (CS) CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = +1.6V to +5.5V, VSS = GND, TA = +25°C, VIN+ = VDD/2, VIN– = VSS,
and CL= 36 pF (Refer to Figures 1-1 and 1-3).
Parameters
Sym
Min
Typ
Max
Units
Conditions
CS Logic Threshold, Low
VIL
VSS
—
0.2 VDD
V
CS Input Current, Low
ICSL
—
5.0
—
pA
CS Logic Threshold, High
VIH
0.8 VDD
—
VDD
V
CS Input Current, High
ICSH
—
1
—
pA
CS = VDD
CS Input High, VDD Current
IDD
—
18
—
pA
CS = VDD
CS Input High, GND Current
ISS
—
–20
—
pA
CS = VDD
Comparator Output Leakage
IO(LEAK)
—
1
—
pA
VOUT = VDD, CS = VDD
CS Low to Comparator Output Low
Turn-on Time
tON
—
2
50
ms
CS = 0.2 VDD to VOUT = VDD/2,
VIN– = VDD
CS High to Comparator Output
High Z Turn-off Time
tOFF
—
10
—
µs
CS = 0.8 VDD to VOUT = VDD/2,
VIN– = VDD
VCS_HYST
—
0.6
—
V
VDD = 5V
CS Low Specifications
CS = VSS
CS High Specifications
CS Dynamic Specifications
CS Hysteresis
CS
VIL
VIH
tON
VOUT
ISS
ICS
tOFF
100 mV
VIN+ = VDD/2
Hi-Z
Hi-Z
-20 pA (typ.)
VIN–
-0.6 µA (typ.)
1 pA (typ.)
FIGURE 1-1:
Timing Diagram for the CS
Pin on the MCP6543.
 2011 Microchip Technology Inc.
tPLH
-20 pA (typ.)
1 pA (typ.)
100 mV
VOUT
VOL
FIGURE 1-2:
Diagram.
tPHL
VOH
VOL
Propagation Delay Timing
DS21696G-page 5
MCP6541/1R/1U/2/3/4
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = +1.6V to +5.5V and VSS = GND.
Parameters
Sym
Min
Typ
Max
Units
Specified Temperature Range
TA
-40
—
+85
°C
Operating Temperature Range
TA
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
Conditions
Temperature Ranges
Note
Thermal Package Resistances
Thermal Resistance, 5L-SC-70
JA
—
331
—
°C/W
Thermal Resistance, 5L-SOT-23
JA
—
256
—
°C/W
Thermal Resistance, 8L-PDIP
JA
—
85
—
°C/W
Thermal Resistance, 8L-SOIC
JA
—
163
—
°C/W
Thermal Resistance, 8L-MSOP
JA
—
206
—
°C/W
Thermal Resistance, 14L-PDIP
JA
—
70
—
°C/W
Thermal Resistance, 14L-SOIC
JA
—
120
—
°C/W
Thermal Resistance, 14L-TSSOP
JA
—
100
—
°C/W
Note:
1.1
The MCP6541/1R/1U/2/3/4 I-Temp parts operate over this extended temperature range, but with reduced
performance. In any case, the Junction Temperature (TJ) must not exceed the Absolute Maximum
specification of +150°C.
Test Circuit Configuration
This test circuit configuration is used to determine the
AC and DC specifications.
VDD
200 k
MCP654X
200 k
200 k
VIN = VSS
200 k
VOUT
36 pF
VSS = 0V
FIGURE 1-3:
AC and DC Test Circuit for
the Push-Pull Output Comparators.
DS21696G-page 6
 2011 Microchip Technology Inc.
MCP6541/1R/1U/2/3/4
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, VDD = +1.6V to +5.5V, VSS = GND, TA = +25°C, VIN+ = VDD /2, VIN – = GND,
RL = 100 k to VDD /2, and CL = 36 pF.
18%
1200 Samples
VCM = VSS
12%
Percentage of Occurrences
10%
8%
6%
4%
2%
0%
16%
14%
1200 Samples
VCM = VSS
12%
10%
8%
6%
4%
2%
0%
4
5
6
7
1.6 2.0 2.4 2.8 3.2 3.6 4.0 4.4 4.8 5.2 5.6 6.0
Input Offset Voltage (mV)
FIGURE 2-4:
VCM = VSS.
5%
VIN–
0
-1
0
1
2
3
4
5
6
7
Time (1 ms/div)
8
9
10
FIGURE 2-3:
The MCP6541/1R/1U/2/3/4
comparators show no phase reversal.
 2011 Microchip Technology Inc.
9.0
8.6
9.4
-0.016
1
VDD = 1.6V
-0.020
2
-0.024
3
VDD = 5.5V
-0.028
4
596 Samples
VCM = VSS
TA = -40°C to +125°C
-0.056
VOUT
5
20%
18%
16%
14%
12%
10%
8%
6%
4%
2%
0%
-0.060
VDD = 5.5V
6
FIGURE 2-5:
Input Hysteresis Voltage
Linear Temp. Co. (TC1) at VCM = VSS.
Percentage of Occurrences
Inverting Input, Output Voltage
(V)
7
8.2
14
12
8
10
6
4
2
0
-2
-4
-6
-8
-10
-12
Input Hysteresis Voltage –
Linear Temp. Co.; TC1 (µV/°C)
Input Offset Voltage Drift (µV/°C)
Input Offset Voltage Drift at
7.8
0%
0%
FIGURE 2-2:
VCM = VSS.
VDD = 1.6V
7.4
2%
VDD = 5.5V
-0.032
4%
10%
7.0
6%
-0.036
8%
15%
5.4
10%
20%
-0.052
12%
596 Samples
VCM = VSS
TA = -40°C to +125°C
5.0
14%
25%
4.6
1200 Samples
VCM = VSS
TA= -40°C to +125°C
Input Hysteresis Voltage at
6.6
Input Offset Voltage at
Percentage of Occurrences
16%
-14
Percentage of Occurrences
FIGURE 2-1:
VCM = VSS.
Input Hysteresis Voltage (mV)
-0.040
3
6.2
2
-0.044
1
5.8
-7 -6 -5 -4 -3 -2 -1 0
-0.048
Percentage of Occurrences
14%
Input Hysteresis Voltage –
2
Quadratic Temp. Co.; TC2 (µV/°C )
FIGURE 2-6:
Input Hysteresis Voltage
Quadratic Temp. Co. (TC2) at VCM = VSS.
DS21696G-page 7
MCP6541/1R/1U/2/3/4
VCM = VSS
VDD = 1.6V
VDD = 5.5V
125
FIGURE 2-7:
Input Offset Voltage vs.
Ambient Temperature at VCM = VSS.
4.5
4.0
3.5
3.0
2.5
TA = -40°C
2.0
Common Mode Input Voltage (V)
Common Mode Input Voltage (V)
FIGURE 2-9:
Input Offset Voltage vs.
Common Mode Input Voltage at VDD = 5.5V.
DS21696G-page 8
2.0
1.8
1.6
4.0
3.5
3.0
2.5
2.0
6.0
5.5
5.0
4.5
1.5
4.0
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-0.5
-2.0
4.5
3.5
-1.5
5.0
3.0
-1.0
TA = +125°C
TA = +85°C
TA = +25°C
TA = -40°C
2.5
TA = +85°C
TA = +125°C
VDD = 5.5V
2.0
0.0
5.5
0.0
TA = -40°C
TA = +25°C
6.0
-0.5
Input Hysteresis Voltage (mV)
Input Offset Voltage (mV)
VDD = 5.5V
-0.5
1.4
FIGURE 2-11:
Input Hysteresis Voltage vs.
Common Mode Input Voltage at VDD = 1.6V.
2.0
0.5
1.2
Common Mode Input Voltage (V)
FIGURE 2-8:
Input Offset Voltage vs.
Common Mode Input Voltage at VDD = 1.6V.
1.0
1.0
1.5
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-0.2
-0.4
-2.0
1.5
125
TA = +125°C
TA = +85°C
TA = +25°C
5.0
0.8
-1.5
VDD = 1.6V
1.5
-1.0
5.5
1.0
-0.5
100
6.0
0.6
TA = +125°C
TA = +85°C
TA = +25°C
TA = -40°C
TA = +125°C
0
25
50
75
Ambient Temperature (°C)
0.4
1.0
0.0
-25
0.2
Input Hysteresis Voltage (mV)
Input Offset Voltage (mV)
VDD = 1.6V
0.5
-50
FIGURE 2-10:
Input Hysteresis Voltage vs.
Ambient Temperature at VCM = VSS.
2.0
1.5
VDD = 5.5V
0.0
0
25
50
75
100
Ambient Temperature (°C)
VDD = 1.6V
-0.2
-25
VCM = VSS
0.5
-50
6.5
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
-0.4
1.0
0.8
0.6
0.4
0.2
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
Input Hysteresis Voltage (mV)
Input Offset Voltage (mV)
Note: Unless otherwise indicated, VDD = +1.6V to +5.5V, VSS = GND, TA = 25°C, VIN+ = VDD/2, VIN– = GND,
RL = 100 k to VDD/2, and CL = 36 pF.
Common Mode Input Voltage (V)
FIGURE 2-12:
Input Hysteresis Voltage vs.
Common Mode Input Voltage at VDD = 5.5V.
 2011 Microchip Technology Inc.
MCP6541/1R/1U/2/3/4
Note: Unless otherwise indicated, VDD = +1.6V to +5.5V, VSS = GND, TA = 25°C, VIN+ = VDD/2, VIN– = GND,
RL = 100 k to VDD/2, and CL = 36 pF.
10n
10000
Input Bias, Offset Currents (A)
90
Input Referred
CMRR, PSRR (dB)
85
80
75
PSRR, VIN+ = VSS, VDD = 1.6V to 5.5V
70
65
CMRR, VIN+ = -0.3 to 5.3V, VDD = 5.0V
60
55
-50
-25
0
25
50
75
Ambient Temperature (°C)
125
100p
100
IOS, TA = +125°C
1p
1
100f
0.1
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
CMRR, PSRR vs. Ambient
FIGURE 2-16:
Input Bias Current, Input
Offset Current vs. Common Mode Input Voltage.
0.7
100
IB
10
| IOS |
1
0.1
0.6
0.5
0.4
TA = +125°C
TA = +85°C
TA = +25°C
TA = -40°C
0.3
0.2
0.1
0.0
55
65
75
85
95
105
115
125
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Power Supply Voltage (V)
Ambient Temperature (°C)
FIGURE 2-14:
Input Bias Current, Input
Offset Current vs. Ambient Temperature.
FIGURE 2-17:
Quiescent Current vs.
Power Supply Voltage.
0.7
VDD = 1.6V
0.6
Quiescent Current
per Comparator (µA)
Quiescent Current
per comparator (µA)
IOS, TA = +85°C
Common Mode Input Voltage (V)
VDD = 5.5V
VCM = VDD
0.5
0.4
0.3
0.2
IB, TA = +85°C
10p
10
1000
0.7
VDD = 5.5V
1n
1000
Quiescent Current
per Comparator (µA)
Input Bias, Offset Currents
(pA)
FIGURE 2-13:
Temperature.
100
IB, TA = +125°C
Sweep VIN+, VIN– = VDD/2
0.1
Sweep VIN–, VIN+ = VDD/2
VDD = 5.5V
0.6
0.5
0.4
0.3
0.2
0.1
Sweep VIN+, VIN– = VDD/2
Sweep VIN–, VIN+ = VDD/2
0.0
0.0
0.0
0.2 0.4 0.6 0.8 1.0 1.2 1.4
Common Mode Input Voltage (V)
1.6
FIGURE 2-15:
Quiescent Current vs.
Common Mode Input Voltage at VDD = 1.6V.
 2011 Microchip Technology Inc.
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Common Mode Input Voltage (V)
FIGURE 2-18:
Quiescent Current vs.
Common Mode Input Voltage at VDD = 5.5V.
DS21696G-page 9
MCP6541/1R/1U/2/3/4
Note: Unless otherwise indicated, VDD = +1.6V to +5.5V, VSS = GND, TA = 25°C, VIN+ = VDD/2, VIN– = GND,
RL = 100 k to VDD/2, and CL = 36 pF.
Output Short Circuit Current
Magnitude (mA)
Supply Current (µA)
10
100 mV Overdrive
VCM = VDD/2
RL = infinity
1
VDD = 5.5V
VDD = 1.6V
35
25
20
15
10
0.1
1
10
Toggle Frequency (kHz)
Supply Current vs. Toggle
0.8
0.7
0.6
0.5
0.4
VDD = 1.6V
VOL–VSS:
TA = +125°C
TA = +85°C
TA = +25°C
TA = -40°C
VDD–VOH:
TA = +125°C
TA = +85°C
TA = +25°C
TA = -40°C
0.3
0.2
0.1
0.0
0.0
0.5
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Power Supply Voltage (V)
100
1.0
1.5
2.0
Output Current (mA)
2.5
FIGURE 2-22:
Output Short Circuit Current
Magnitude vs. Power Supply Voltage.
Output Voltage Headroom (V)
FIGURE 2-19:
Frequency.
Output Voltage Headroom (V)
5
0
0.1
VDD – VOH:
TA = +125°C
TA = +85°C
TA = +25°C
TA = -40°C
VDD = 5.5V
5
10
15
Output Current (mA)
20
25
FIGURE 2-23:
Output Voltage Headroom
vs. Output Current at VDD = 5.5V.
45%
Percentage of Occurrences
35%
VOL – VSS:
TA = +125°C
TA = +85°C
TA = +25°C
TA = -40°C
0
45%
40%
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
3.0
FIGURE 2-20:
Output Voltage Headroom
vs. Output Current at VDD = 1.6V.
Percentage of Occurrences
TA = -40°C
TA = +25°C
TA = +85°C
TA = +125°C
30
600 Samples
100 mV Overdrive
VCM = VDD/2
30%
25%
20%
15%
VDD = 1.6V
10%
VDD = 5.5V
5%
0%
600 Samples
100 mV Overdrive
VCM = VDD/2
40%
35%
30%
25%
20%
15%
VDD = 1.6V
10%
VDD = 5.5V
5%
0%
0
1
2
3
4
5
6
7
8
0
1
High-to-Low Propagation Delay (µs)
FIGURE 2-21:
Delay.
DS21696G-page 10
High-to-Low Propagation
2
3
4
5
6
7
8
Low-to-High Propagation Delay (µs)
FIGURE 2-24:
Delay.
Low-to-High Propagation
 2011 Microchip Technology Inc.
MCP6541/1R/1U/2/3/4
45%
8
600 Samples
100 mV Overdrive
VCM = VDD/2
40%
35%
30%
25%
20%
VDD = 1.6V
VDD = 5.5V
15%
10%
5%
Propagation Delay (µs)
Percentage of Occurrences
Note: Unless otherwise indicated, VDD = +1.6V to +5.5V, VSS = GND, TA = 25°C, VIN+ = VDD/2, VIN– = GND,
RL = 100 k to VDD/2, and CL = 36 pF.
0%
100 mV Overdrive
VCM = VDD/2
7
6
tPLH @ VDD = 5.5V
tPHL @ VDD = 5.5V
tPLH @ VDD = 1.6V
tPHL @ VDD = 1.6V
5
4
3
2
1
0
-2.0
-1.5
-1.0
-0.5
0.0
0.5
1.0
1.5
2.0
-50
-25
Propagation Delay Skew (µs)
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Propagation Delay Skew.
tPLH @ 10 mV Overdrive
tPHL @ 10 mV Overdrive
tPLH @ 100 mV Overdrive
tPHL @ 100 mV Overdrive
2.5
3.0
3.5
4.0
4.5
Power Supply Voltage (V)
5.0
tPHL @ VDD = 5.5V
tPLH @ VDD = 1.6V
tPHL @ VDD = 1.6V
10
tPLH @ VDD = 5.5V
5.5
FIGURE 2-29:
Overdrive.
8
VDD = 1.6V
100 mV Overdrive
6
5
tPLH
4
3
1
Propagation Delay (µs)
Propagation Delay (µs)
VCM = VDD/2
1
2.0
FIGURE 2-26:
Propagation Delay vs.
Power Supply Voltage.
7
125
100
VCM = VDD/2
1.5
8
100
FIGURE 2-28:
Propagation Delay vs.
Ambient Temperature.
Propagation Delay (µs)
Propagation Delay (µs)
FIGURE 2-25:
0
25
50
75
Ambient Temperature (°C)
tPHL
2
1
0
7
10
100
Input Overdrive (mV)
1000
Propagation Delay vs. Input
VDD = 5.5V
100 mV Overdrive
6
5
4
tPHL
tPLH
3
2
1
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
Common Mode Input Voltage (V)
1.6
FIGURE 2-27:
Propagation Delay vs.
Common Mode Input Voltage at VDD = 1.6V.
 2011 Microchip Technology Inc.
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Common Mode Input Voltage (V)
FIGURE 2-30:
Propagation Delay vs.
Common Mode Input Voltage at VDD = 5.5V.
DS21696G-page 11
MCP6541/1R/1U/2/3/4
Chip Select, Output Voltage (V)
100 mV Overdrive
VCM = VDD/2
tPHL @ VDD = 1.6V
tPLH @ VDD = 1.6V
tPHL @ VDD = 5.5V
tPLH @ VDD = 5.5V
0
10
20
FIGURE 2-31:
Capacitance.
1.E-03
1m
Supply Current
per Comparator (A)
1.E-04
100µ
30
40
50
60
70
Load Capacitance (nF)
80
90
Propagation Delay vs. Load
Comparator
Shuts Off
VOUT
CS
0
1
2
CS
High-to-Low
CS
Low-to-High
7
8
9
10
FIGURE 2-34:
Chip Select (CS) Step
Response (MCP6543 only).
Comparator
Turns On
100µ
1.E-04
Comparator
Shuts Off
VDD = 1.6V
10p
1.E-11
0.0 0.2 0.4
CS
Hysteresis
100n
1.E-07
10n
1.E-08
CS
Low-to-High
1n
1.E-09
0.6
0.8
1.0
1.2
1.4
1.6
VDD = 5.5V
10p
1.E-11
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Chip Select (CS) Voltage (V)
Chip Select (CS) Voltage (V)
1.6
VOUT
25
CS
20
0.0
-1.6
VDD = 1.6V
15
Charging output
capacitance
Start-up
IDD
5
-3.2
-4.9
-6.5
0
-8.1
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14
Time (1 ms/div)
FIGURE 2-33:
Supply Current (charging
current) vs. Chip Select (CS) pulse at VDD = 1.6V
(MCP6543 only).
FIGURE 2-35:
Supply Current (shoot
through current) vs. Chip Select (CS) Voltage at
VDD = 5.5V (MCP6543 only).
Supply Current
per Comparator (µA)
30
Output Voltage,
Chip Select Voltage (V),
FIGURE 2-32:
Supply Current (shoot
through current) vs. Chip Select (CS) Voltage at
VDD = 1.6V (MCP6543 only).
DS21696G-page 12
CS
High-to-Low
100p
1.E-10
100p
1.E-10
Supply Current (µA)
4
5
6
Time (ms)
1µ
1.E-06
CS Hysteresis
100n
1.E-07
10
3
10µ
1.E-05
1µ
1.E-06
1n
1.E-09
VDD = 5.5V
1.E-03
1m
Comparator
Turns On
10µ
1.E-05
10n
1.E-08
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-0.5
200
180
160
140
120
100
80
60
40
20
0
6
3
0
-3
-6
-9
-12
-15
-18
-21
-24
VOUT
CS
Start-up IDD
VDD = 5.5V
Charging output
capacitance
0.0
0.5
1.0 1.5 2.0 2.5 3.0
Time (0.5 ms/div)
Output Voltage,
Chip Select Voltage (V)
50
45
40
35
30
25
20
15
10
5
0
Supply Current
per Comparator (A)
Propagation Delay (µs)
Note: Unless otherwise indicated, VDD = +1.6V to +5.5V, VSS = GND, TA = 25°C, VIN+ = VDD/2, VIN– = GND,
RL = 100 k to VDD/2, and CL = 36 pF.
3.5
FIGURE 2-36:
Supply Current (charging
current) vs. Chip Select (CS) pulse at VDD = 5.5V
(MCP6543 only).
 2011 Microchip Technology Inc.
MCP6541/1R/1U/2/3/4
Input Current Magnitude (A)
Note: Unless otherwise indicated, VDD = +1.6V to +5.5V, VSS = GND, TA = 25°C, VIN+ = VDD/2, VIN– = GND,
RL = 100 k to VDD/2, and CL = 36 pF.
1.E-02
10m
1.E-03
1m
1.E-04
100µ
1.E-05
10µ
1µ
1.E-06
100n
1.E-07
10n
1.E-08
1n
1.E-09
100p
1.E-10
10p
1.E-11
1p
1.E-12
+125°C
+85°C
+25°C
-40°C
-1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0.0
Input Voltage (V)
FIGURE 2-37:
Voltage.
Input Bias Current vs. Input
 2011 Microchip Technology Inc.
DS21696G-page 13
MCP6541/1R/1U/2/3/4
NOTES:
DS21696G-page 14
 2011 Microchip Technology Inc.
MCP6541/1R/1U/2/3/4
3.0
PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 3-1.
MCP6541
PDIP,
SOIC,
MSOP
MCP6541
SOT-23-5,
SC-70-5
MCP6541U
MCP6542
MCP6543
MCP6544
PIN FUNCTION TABLE
MCP6541R
TABLE 3-1:
6
1
1
4
1
6
1
OUT, OUTA Digital Output (comparator A)
2
4
4
3
2
2
2
VIN–, VINA– Inverting Input (comparator A)
3
3
3
1
3
3
3
VIN+, VINA+ Non-inverting Input (comparator A)
7
5
2
5
8
7
4
VDD
Symbol
Description
Positive Power Supply
—
—
—
—
5
—
5
VINB+
Non-inverting Input (comparator B)
—
—
—
—
6
—
6
VINB–
Inverting Input (comparator B)
—
—
—
—
7
—
7
OUTB
Digital Output (comparator B)
—
—
—
—
—
—
8
OUTC
Digital Output (comparator C)
—
—
—
—
—
—
9
VINC–
Inverting Input (comparator C)
—
—
—
—
—
—
10
VINC+
Non-inverting Input (comparator C)
4
2
5
2
4
4
11
VSS
—
—
—
—
—
—
12
VIND+
Non-inverting Input (comparator D)
Negative Power Supply
—
—
—
—
—
—
13
VIND–
Inverting Input (comparator D)
—
—
—
—
—
—
14
OUTD
Digital Output (comparator D)
—
—
—
—
—
8
—
CS
Chip Select
1, 5, 8
—
—
—
—
1, 5
—
NC
No Internal Connection
3.1
Analog Inputs
The comparator non-inverting and inverting inputs are
high-impedance CMOS inputs with low bias currents.
3.2
CS Digital Input
This is a CMOS, Schmitt-triggered input that places the
part into a low-power mode of operation.
3.3
Digital Outputs
The comparator outputs are CMOS, push-pull digital
outputs. They are designed to be compatible with
CMOS and TTL logic and are capable of driving heavy
DC or capacitive loads.
 2011 Microchip Technology Inc.
3.4
Power Supply (VSS and VDD)
The positive power supply pin (VDD) is 1.6V to 5.5V
higher than the negative power supply pin (VSS). For
normal operation, the other pins are at voltages
between VSS and VDD.
Typically, these parts are used in a single (positive)
supply configuration. In this case, VSS is connected to
ground and VDD is connected to the supply. VDD will
need a local bypass capacitor (typically 0.01 µF to
0.1 µF) within 2 mm of the VDD pin. These can share a
bulk capacitor with nearby analog parts (within
100 mm), but it is not required.
DS21696G-page 15
MCP6541/1R/1U/2/3/4
NOTES:
DS21696G-page 16
 2011 Microchip Technology Inc.
MCP6541/1R/1U/2/3/4
4.0
APPLICATIONS INFORMATION
The MCP6541/1R/1U/2/3/4 family of push-pull output
comparators are fabricated on Microchip’s state-of-theart CMOS process. They are suitable for a wide range
of applications requiring very low-power consumption.
4.1
VDD
D1
R1
Comparator Inputs
4.1.1
INPUT VOLTAGE AND CURRENT
LIMITS
The ESD protection on the inputs can be depicted as
shown in Figure 4-1. This structure was chosen to
protect the input transistors, and to minimize input bias
current (IB). The input ESD diodes clamp the inputs
when they try to go more than one diode drop below
VSS. They also clamp any voltages that go too far
above VDD; their breakdown voltage is high enough to
allow normal operation, and low enough to bypass ESD
events within the specified limits.
VDD
Bond
Pad
Input
Stage
Bond
Pad
VIN–
VSS Bond
Pad
FIGURE 4-1:
Structures.
Simplified Analog Input ESD
In order to prevent damage and/or improper operation
of these amplifiers, the circuits they are in must limit the
currents (and voltages) at the VIN+ and VIN– pins (see
Absolute Maximum Ratings † at the beginning of
Section 1.0 “Electrical Characteristics”). Figure 4-3
shows the recommended approach to protecting these
inputs. The internal ESD diodes prevent the input pins
(VIN+ and VIN–) from going too far below ground, and
the resistors R1 and R2 limit the possible current drawn
out of the input pin. Diodes D1 and D2 prevent the input
pin (VIN+ and VIN–) from going too far above VDD.
When implemented as shown, resistors R1 and R2 also
limit the current through D1 and D2.
 2011 Microchip Technology Inc.
–
VOUT
V2
R2
R3
R1 
VSS – (minimum expected V1)
2 mA
R2 
VSS – (minimum expected V2)
2 mA
FIGURE 4-2:
Inputs.
Protecting the Analog
It is also possible to connect the diodes to the left of the
resistors R1 and R2. In this case, the currents through
the diodes D1 and D2 need to be limited by some other
mechanism. The resistor then serves as in-rush current
limiter; the DC current into the input pins (VIN+ and
VIN–) should be very small.
A significant amount of current can flow out of the
inputs when the common mode voltage (VCM) is below
ground (VSS); see Figure 2-37. Applications that are
high-impedance may need to limit the usable voltage
range.
4.1.3
VIN+ Bond
Pad
MCP6G0X
D2
PHASE REVERSAL
The MCP6541/1R/1U/2/3/4 comparator family uses
CMOS transistors at the input. They are designed to
prevent phase inversion when the input pins exceed
the supply voltages. Figure 2-3 shows an input voltage
exceeding both supplies with no resulting phase
inversion.
4.1.2
+
V1
NORMAL OPERATION
The input stage of this family of devices uses two
differential input stages in parallel: one operates at low
input voltages and the other at high input voltages. With
this topology, the input voltage is 0.3V above VDD and
0.3V below VSS. Therefore, the input offset voltage is
measured at both VSS - 0.3V and VDD + 0.3V to ensure
proper operation.
The MCP6541/1R/1U/2/3/4 family has internally-set
hysteresis that is small enough to maintain input offset
accuracy (<7 mV) and large enough to eliminate output
chattering caused by the comparator’s own input noise
voltage (200 µVp-p). Figure 4-3 depicts this behavior.
DS21696G-page 17
MCP6541/1R/1U/2/3/4
VDD = 5.0V
VIN–
VOUT
Hysteresis
25
20
15
10
5
0
-5
-10
-15
-20
-25
-30
Input Voltage (10 mV/div)
Output Voltage (V)
4.4
8
7
6
5
4
3
2
1
0
-1
-2
-3
Time (100 ms/div)
FIGURE 4-3:
The MCP6541/1R/1U/2/3/4
comparators’ internal hysteresis eliminates
output chatter caused by input noise voltage.
4.2
Push-Pull Output
Externally Set Hysteresis
Greater flexibility in selecting hysteresis (or input trip
points) is achieved by using external resistors.
Input offset voltage (VOS) is the center (average) of the
(input-referred) low-high and high-low trip points. Input
hysteresis voltage (VHYST) is the difference between
the same trip points. Hysteresis reduces output
chattering when one input is slowly moving past the
other and thus reduces dynamic supply current. It also
helps in systems where it is best not to cycle between
states too frequently (e.g., air conditioner thermostatic
control).
4.4.1
Figure 4-4 shows a non-inverting circuit for singlesupply applications using just two resistors. The
resulting hysteresis diagram is shown in Figure 4-5.
The push-pull output is designed to be compatible with
CMOS and TTL logic, while the output transistors are
configured to give rail-to-rail output performance. They
are driven with circuitry that minimizes any switching
current (shoot-through current from supply-to-supply)
when the output is transitioned from high-to-low, or from
low-to-high (see Figures 2-15, 2-18, 2-32 through 2-36
for more information).
4.3
MCP6543 Chip Select (CS)
The MCP6543 is a single comparator with Chip Select
(CS). When CS is pulled high, the total current
consumption drops to 20 pA (typ.); 1 pA (typ.) flows
through the CS pin, 1 pA (typ.) flows through the output pin and 18 pA (typ.) flows through the VDD pin, as
shown in Figure 1-1. When this happens, the
comparator output is put into a high-impedance state.
By pulling CS low, the comparator is enabled. If the CS
pin is left floating, the comparator will not operate
properly. Figure 1-1 shows the output voltage and
supply current response to a CS pulse.
The internal CS circuitry is designed to minimize
glitches when cycling the CS pin. This helps conserve
power, which is especially important in battery-powered
applications.
NON-INVERTING CIRCUIT
VDD
-
VREF
VOUT
MCP654X
+
VIN
R1
RF
FIGURE 4-4:
Non-inverting circuit with
hysteresis for single-supply.
VOUT
VDD
VOH
High-to-Low
VOL
VSS
VSS
Low-to-High
VIN
VTHL VTLH
VDD
FIGURE 4-5:
Hysteresis Diagram for the
Non-Inverting Circuit.
The trip points for Figures 4-4 and 4-5 are:
DS21696G-page 18
 2011 Microchip Technology Inc.
MCP6541/1R/1U/2/3/4
EQUATION 4-1:
R1 
 R1 

VTLH = V REF  1 + -------  – V OL ------- 
RF 
RF 

R1 
 R1 

VTHL = VREF  1 + -------  – VOH ------- 
RF 
RF 

VTLH = trip voltage from low-to-high
VTHL = trip voltage from high-to-low
 2011 Microchip Technology Inc.
DS21696G-page 19
MCP6541/1R/1U/2/3/4
4.4.2
INVERTING CIRCUIT
Where:
Figure 4-6 shows an inverting circuit for single-supply
using three resistors. The resulting hysteresis diagram
is shown in Figure 4-7.
R2R3
R23 = -----------------R 2 + R3
R3
V23 = ------------------  VDD
R2 + R 3
VDD
VIN
VDD
Using this simplified circuit, the trip voltage can be
calculated using the following equation:
VOUT
MCP654X
R2
EQUATION 4-2:
RF
 R 23 
V THL = V OH  ----------------------- + V 23  ----------------------


R
+
R
R
 23
23 + R F
F
RF
R3
RF
 R23 
V TLH = V OL  ----------------------- + V 23  ----------------------
R
+
R
R
 23
23 + R F
F
FIGURE 4-6:
Hysteresis.
Inverting Circuit With
VTLH = trip voltage from low-to-high
VTHL = trip voltage from high-to-low
VOUT
Figure 2-20 and Figure 2-23 can be used to determine
typical values for VOH and VOL.
VDD
VOH
Low-to-High
High-to-Low
4.5
VIN
VOL
VSS
VSS
VTLH VTHL
FIGURE 4-7:
Inverting Circuit.
VDD
Hysteresis Diagram for the
VDD
MCP654X
+
VSS
VOUT
V23
FIGURE 4-8:
DS21696G-page 20
Capacitive Loads
Reasonable capacitive loads (e.g., logic gates) have
little impact on propagation delay (see Figure 2-31).
The supply current increases with increasing toggle
frequency (Figure 2-19), especially with higher
capacitive loads.
4.7
-
R23
With this family of comparators, the power supply pin
(VDD for single supply) should have a local bypass
capacitor (i.e., 0.01 µF to 0.1 µF) within 2 mm for good
edge rate performance.
4.6
In order to determine the trip voltages (VTHL and VTLH)
for the circuit shown in Figure 4-6, R2 and R3 can be
simplified to the Thevenin equivalent circuit with
respect to VDD, as shown in Figure 4-8.
Bypass Capacitors
Battery Life
In order to maximize battery life in portable
applications, use large resistors and small capacitive
loads. Avoid toggling the output more than necessary.
Do not use Chip Select (CS) frequently to conserve
start-up power. Capacitive loads will draw additional
power at start-up.
RF
Thevenin Equivalent Circuit.
 2011 Microchip Technology Inc.
MCP6541/1R/1U/2/3/4
4.8
PCB Surface Leakage
4.9
Unused Comparators
In applications where low input bias current is critical,
PCB (Printed Circuit Board) surface leakage effects
need to be considered. Surface leakage is caused by
humidity, dust or other contamination on the board.
Under low humidity conditions, a typical resistance
between nearby traces is 1012. A 5V difference would
cause 5 pA of current to flow. This is greater than the
MCP6541/1R/1U/2/3/4 family’s bias current at 25°C
(1 pA, typ.).
An unused amplifier in a quad package (MCP6544)
should be configured as shown in Figure 4-10. This
circuit prevents the output from toggling and causing
crosstalk. It uses the minimum number of components
and draws minimal current (see Figure 2-15 and
Figure 2-18).
The easiest way to reduce surface leakage is to use a
guard ring around sensitive pins (or traces). The guard
ring is biased at the same voltage as the sensitive pin.
An example of this type of layout is shown in
Figure 4-9.
VDD
¼ MCP6544
–
VIN-
VIN+
VSS
+
FIGURE 4-10:
Unused Comparators.
Guard Ring
FIGURE 4-9:
Example Guard Ring Layout
for Inverting Circuit.
1.
2.
Inverting Configuration (Figures 4-6 and 4-9):
a. Connect the guard ring to the non-inverting
input pin (VIN+). This biases the guard ring
to the same reference voltage as the
comparator (e.g., VDD/2 or ground).
b. Connect the inverting pin (VIN–) to the input
pad without touching the guard ring.
Non-inverting Configuration (Figure 4-4):
a. Connect the non-inverting pin (VIN+) to the
input pad without touching the guard ring.
b. Connect the guard ring to the inverting input
pin (VIN–).
 2011 Microchip Technology Inc.
DS21696G-page 21
MCP6541/1R/1U/2/3/4
4.10
4.10.1
4.10.3
Typical Applications
PRECISE COMPARATOR
Some applications require higher DC precision. An
easy way to solve this problem is to use an amplifier
(such as the MCP6041) to gain-up the input signal
before it reaches the comparator. Figure 4-11 shows an
example of this approach.
BISTABLE MULTI-VIBRATOR
A simple bistable multi-vibrator design is shown in
Figure 4-13. VREF needs to be between the power
supplies (VSS = GND and VDD) to achieve oscillation.
The output duty cycle changes with VREF.
R1
R2
VREF
VDD
VDD
VREF
MCP6541
MCP6041
VOUT
VDD
VIN
R1
R2
MCP654X
VREF
FIGURE 4-11:
Comparator.
4.10.2
C1
VOUT
FIGURE 4-13:
R3
Bistable Multi-vibrator.
Precise Inverting
WINDOWED COMPARATOR
Figure 4-12 shows one approach to designing a windowed comparator. The AND gate produces a logic ‘1’
when the input voltage is between VRB and VRT (where
VRT > VRB).
VRT
1/2
MCP6542
VIN
VRB
FIGURE 4-12:
DS21696G-page 22
1/2
MCP6542
Windowed Comparator.
 2011 Microchip Technology Inc.
MCP6541/1R/1U/2/3/4
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
5-Lead SC-70 (MCP6541)
XXNN Front)
YWW (Back)
Example:
Device
I-Temp
Code
E-Temp
Code
MCP6541U
BANN
Note 2
Note 1:
2:
BA25 Front)
102 (Back)
I-Temp parts prior to March
2005 are marked “BAN”
SC-70-5 E-Temp parts not
available at this release of
this data sheet.
Example:
5-Lead SOT-23 (MCP6541, MCP6541R, MCP6541U)
XXNN
Device
I-Temp
Code
E-Temp
Code
MCP6541
ABNN
GTNN
MCP6541R
AGNN
GUNN
—
ATNN
MCP6541U
Note:
Applies to 5-Lead SOT-23
8-Lead PDIP (300 mil)
XXXXXXXX
XXXXXNNN
YYWW
Example:
MCP6541
I/P256
1102
8-Lead SOIC (150 mil)
XXXXXXXX
XXXXYYWW
NNN
8-Lead MSOP
MCP6541
e3
E/P^^256
1102
OR
MCP6541E
SN^^1102
e3
256
Example:
YWWNNN
102256
e3
Note:
MCP6542
I/SN1102
256
6543I
*
OR
Example:
XXXXXX
Legend: XX...X
Y
YY
WW
NNN
AB25
6543E
OR
102256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
 2011 Microchip Technology Inc.
DS21696G-page 23
MCP6541/1R/1U/2/3/4
Package Marking Information (Continued)
14-Lead PDIP (300 mil) (MCP6544)
Example:
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
YYWWNNN
MCP6544-I/P
110256
OR
MCP6544E/P e3
1102256
MCP6544
I/P e3
1102256
OR
14-Lead SOIC (150 mil) (MCP6544)
Example:
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
MCP6544ISL
1102256
MCP6544
e3
E/SL^^
1102256
OR
OR
14-Lead TSSOP (MCP6544)
XXXXXXXX
YYWW
NNN
DS21696G-page 24
MCP6544
e3
I/SL^^
1102256
Example:
MCP6544I
1102
256
OR
MCP6544E
1102
256
 2011 Microchip Technology Inc.
MCP6541/1R/1U/2/3/4
.
#
#$#/!- 0 #
1/%#
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 2011 Microchip Technology Inc.
DS21696G-page 25
MCP6541/1R/1U/2/3/4
.
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DS21696G-page 26
 2011 Microchip Technology Inc.
MCP6541/1R/1U/2/3/4
!
.
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1/%#
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 2011 Microchip Technology Inc.
DS21696G-page 27
MCP6541/1R/1U/2/3/4
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21696G-page 28
 2011 Microchip Technology Inc.
MCP6541/1R/1U/2/3/4
"
#
$%!
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.
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#$#/!- 0 #
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NOTE 1
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- *;)
 2011 Microchip Technology Inc.
DS21696G-page 29
MCP6541/1R/1U/2/3/4
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21696G-page 30
 2011 Microchip Technology Inc.
MCP6541/1R/1U/2/3/4
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2011 Microchip Technology Inc.
DS21696G-page 31
MCP6541/1R/1U/2/3/4
"
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1/%#
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DS21696G-page 32
 2011 Microchip Technology Inc.
MCP6541/1R/1U/2/3/4
"
,
-.,,
.
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1/%#
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 2011 Microchip Technology Inc.
DS21696G-page 33
MCP6541/1R/1U/2/3/4
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21696G-page 34
 2011 Microchip Technology Inc.
MCP6541/1R/1U/2/3/4
/0
#
$%!
&'#$
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#$#/!- 0 #
1/%#
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NOTE 1
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1
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c
b1
b
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 2011 Microchip Technology Inc.
DS21696G-page 35
MCP6541/1R/1U/2/3/4
/0
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#$#/!- 0 #
1/%#
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e
h
b
α
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A
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φ
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DS21696G-page 36
 2011 Microchip Technology Inc.
MCP6541/1R/1U/2/3/4
.
#
#$#/!- 0 #
1/%#
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##+22---
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 2011 Microchip Technology Inc.
DS21696G-page 37
MCP6541/1R/1U/2/3/4
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21696G-page 38
 2011 Microchip Technology Inc.
MCP6541/1R/1U/2/3/4
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
 2011 Microchip Technology Inc.
DS21696G-page 39
MCP6541/1R/1U/2/3/4
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21696G-page 40
 2011 Microchip Technology Inc.
MCP6541/1R/1U/2/3/4
APPENDIX A:
REVISION HISTORY
Revision G (March 2011)
The following is the list of modifications:
1.
Updated the marking information for the 5-Lead
SC-70 package in Section 5.1 “Package
Marking Information”.
Revision F (September 2007)
1.
2.
Corrected polarity of MCP6541U SOT-23-5 pin
out diagram on front page.
Section 5.1 “Package Marking Information”:
Updated package outline drawings per
MarCom.
Revision E (September 2006)
The following is the list of modifications:
1.
2.
3.
4.
Added MCP6541U pinout for the SOT-23-5
package.
Clarified Absolute Maximum Analog Input
Voltage and Current Specifications.
Added applications write-ups on unused
comparators.
Added disclaimer to package outline drawings.
Revision D (May 2006)
The following is the list of modifications:
1.
2.
3.
4.
5.
6.
Added E-temp parts.
Changed VHYST temperature specification to
linear and quadratic temperature coefficients.
Changed specifications and plots for E-Temp.
Added Section 3.0 Pin Descriptions
Corrected package marking (See Section 5.1
“Package Marking Information”)
Added Appendix A: Revision History.
Revision C (September 2003)
Revision B (November 2002)
Revision A (March 2002)
• Original Release of this Document.
 2011 Microchip Technology Inc.
DS21696G-page 41
MCP6541/1R/1U/2/3/4
NOTES:
DS21696G-page 42
 2011 Microchip Technology Inc.
MCP6541/1R/1U/2/3/4
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
-X
/XX
Device
Temperature
Range
Package
Examples:
a)
b)
Device:
MCP6541:
MCP6541T:
MCP6541RT:
MCP6541UT:
MCP6542:
MCP6542T:
MCP6543:
MCP6543T:
MCP6544:
MCP6544T:
Temperature Range:
Single Comparator
Single Comparator (Tape and Reel)
(SC-70, SOT-23, SOIC, MSOP)
Single Comparator (Rotated - Tape and
Reel) (SOT-23 only)
Single Comparator (Tape and Reel)
(SOT-23-5 is E-Temp only)
Dual Comparator
Dual Comparator
(Tape and Reel for SOIC and MSOP)
Single Comparator with CS
Single Comparator with CS
(Tape and Reel for SOIC and MSOP)
Quad Comparator
Quad Comparator
(Tape and Reel for SOIC and TSSOP)
I
= -40°C to +85°C
E * = -40°C to +125°C
* SC-70-5 E-Temp parts not available at this release of the
data sheet.
Package:
LT
OT
MS
P
SN
SL
ST
=
=
=
=
=
=
=
Plastic Package (SC-70), 5-lead
Plastic Small Outline Transistor (SOT-23), 5-lead
Plastic MSOP, 8-lead
Plastic DIP (300 mil Body), 8-lead, 14-lead
Plastic SOIC (150 mil Body), 8-lead
Plastic SOIC (150 mil Body), 14-lead (MCP6544)
Plastic TSSOP (4.4mm Body), 14-lead (MCP6544)
c)
d)
e)
f)
a)
b)
c)
d)
a)
b)
c)
d)
a)
b)
c)
d)
 2011 Microchip Technology Inc.
MCP6541T-I/LT:
Tape and Reel,
Industrial Temperature,
5LD SC-70.
MCP6541T-I/OT: Tape and Reel,
Industrial Temperature,
5LD SOT-23.
MCP6541-E/P:
Extended Temperature,
8LD PDIP.
MCP6541RT-I/OT: Tape and Reel,
Industrial Temperature,
5LD SOT23.
MCP6541-E/SN: Extended Temperature,
8LD SOIC.
MCP6541UT-E/OT:Tape and Reel,
Extended Temperature,
5LD SOT23.
MCP6542-I/MS:
Industrial Temperature,
8LD MSOP.
MCP6542T-I/MS: Tape and Reel,
Industrial Temperature,
8LD MSOP.
MCP6542-I/P:
Industrial Temperature,
8LD PDIP.
MCP6542-E/SN: Extended Temperature,
8LD SOIC.
MCP6543-I/SN:
Industrial Temperature,
8LD SOIC.
MCP6543T-I/SN: Tape and Reel,
Industrial Temperature,
8LD SOIC.
MCP6543-I/P:
Industrial Temperature,
8LD PDIP.
MCP6543-E/SN: Extended Temperature,
8LD SOIC.
MCP6544T-I/SL:
Tape and Reel,
Industrial Temperature,
14LD SOIC.
MCP6544T-E/SL: Tape and Reel,
Extended Temperature,
14LD SOIC.
MCP6544-I/P:
Industrial Temperature,
14LD PDIP.
MCP6544T-E/ST: Tape and Reel,
Extended Temperature,
14LD TSSOP.
DS21696G-page 43
MCP6541/1R/1U/2/3/4
NOTES:
DS21696G-page 44
 2011 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,
TSHARC, UniWinDriver, WiperLock and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2011, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-60932-933-4
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
 2011 Microchip Technology Inc.
DS21696G-page 45
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-6578-300
Fax: 886-3-6578-370
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Fax: 886-7-330-9305
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
02/18/11
DS21696G-page 46
 2011 Microchip Technology Inc.