SIM Card EMI Filter Array with ESD Protection CM1402 Features • • • • • • • • • • Functionally and pin compatible with CMD’s CSPEMI400 OptiGuard coated for improved reliability at assembly Three channels of EMI filtering, each with ESD protection Two additional channels of ESD-only protection ±10kV ESD protection (IEC 61000-4-2, contact discharge) on all pins ±25kV ESD protection (HBM) Greater than 30dB of attenuation at 1GHz 10-bump, 1.960mm x 1.330mm footprint Chip Scale Package (CSP) Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance RoHS-compliant, lead-free packaging Applications • • • SIM Card slot in mobile handsets I/O port protection for mobile handsets, notebook computers, PDAs, etc. EMI filtering for data ports in cell phones, PDAs or notebook computers Product Description The CM1402 is an EMI filter array with ESD protection, which integrates three pi filters (C-R-C) and two additional channels of ESD protection. The CM1402 has component values of 20pF-47Ω-20pF, and 20pF-100Ω-20pF. The parts include avalanche-type ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports are designed and characterized to safely dissipate ESD strikes of ±10kV, beyond the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±25kV. The ESD diodes on pins A4 and C4 ports are designed and characterized to safely dissipate ESD strikes of ±10kV, well beyond the maximum requirement of the IEC 61000-4-2 international standard. This device is particularly well suited for portable electronics (e.g. mobile handsets, PDAs, notebook computers) because of its small package format and easy-to-use pin assignments. In particular, the CM1402 is ideal for EMI filtering and protecting data lines from ESD for the SIM card slot in mobile handsets. The CM1402 incorporates OptiGuard coating which results in improved reliability at assembly.The CM1402 is available in a space-saving, low-profile Chip Scale Package. ©2010 SCILLC. All rights reserved. May 2010 Rev. 3 Publication Order Number: CM1402/D CM1402 Electrical Schematic Rev. 3 | Page 2 of 12 | www.onsemi.com CM1402 PIN DESCRIPTIONS TYPE PIN DESCRIPTION A1 EMI Filter with ESD Protection for RST Signal C1 EMI Filter with ESD Protection for RST Signal A2 EMI Filter with ESD Protection for CLK Signal C2 EMI Filter with ESD Protection for CLK Signal B1 Device Ground B2 Device Ground A3 EMI Filter with ESD Protection for DAT Signal C3 EMI Filter with ESD Protection for DAT Signal ESD Channel A4 ESD Protection Channel - VCC Supply ESD Channel C4 ESD Protection Channel EMI Filter EMI Filter Device Ground EMI Filter Ordering Information PART NUMBERING INFORMATION Lead-free Finish Bumps Package Ordering Part Number1 Part Marking 10 CSP CM1402-03CP CE Note 1: Parts are shipped in Tape and Reel form unless otherwise specified. Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 300 mW Storage Temperature Range Rev. 3 | Page 3 of 12 | www.onsemi.com CM1402 STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING UNITS -40 to +85 °C ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS R1 Resistance of R1 80 100 120 Ω R2 Resistance of R2 38 47 56 Ω C Capacitance VIN = 2.5VDC, 1MHz, 30mV ac 16 20 24 pF Stand-off Voltage I = 10μA 6.0 ILEAK Diode Leakage Current VBIAS = 3.3V 0.1 1.0 μA VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA ILOAD = -10mA 6.8 -0.8 9.0 -0.4 V V VSTANDOFF VESD 5.6 -1.5 V In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Notes 2 and 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2,3, and 4 fC1 Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω R = 100Ω, C = 20pF 77 MHz fC2 Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω R = 47Ω, C = 20pF 85 MHz VCL ±25 kV ±10 kV +12 -7 Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open. Rev. 3 | Page 4 of 12 | www.onsemi.com V V CM1402 Performance Information Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 1. A1-C1 EMI Filter Performance Rev. 3 | Page 5 of 12 | www.onsemi.com CM1402 Figure 2. A2-C2 EMI Filter Performance Rev. 3 | Page 6 of 12 | www.onsemi.com CM1402 Performance Information (cont’d) Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment) Figure 3. A3-C3 EMI Filter Performance Rev. 3 | Page 7 of 12 | www.onsemi.com CM1402 Figure 4. Typical Diode Capacitance vs. Input Voltage (normalized to 2.5VDC) Rev. 3 | Page 8 of 12 | www.onsemi.com CM1402 Application Information The CM1402 provides a bidirectional filter and protector for all the signals and the power line on the SIM (subscriber identity module) card connector. SIM cards are found in all GSM cellular phones and in some other handheld devices or card readers. The ESD diodes protect the controller against possible ESD strikes that may occur when the connector pins are exposed during direct contact, or during insertion of the SIM card into the card slot. The EMI filter suppresses all high-frequency noise, preventing the unwanted EMI signals from both entering and exiting the main board. The signals that interface with the SIM card are the Reset, the Clock and the bidirectional data I/O, as shown in Typical Application Diagram for the SIM Card Interface. Note: One channel of the CM1402 with a zener diode is not shown on the diagram. Figure 5. Typical Application Diagram for the SIM Card Interface For best filter and ESD performance, both GND bumps (B1, B2) of the CM1402 should be directly connected to the Ground plane. A small capacitor of about 1μF is required next to the VCC pin of the SIM connector in order to improve stability of the SIM card supply rail. Rev. 3 | Page 9 of 12 | www.onsemi.com CM1402 Application Information PARAMETER VALUE Pad Size on PCB 0.240mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.290mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50μm Solder Ball Side Coplanarity +20μm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste Non-Solder Mask Defined Pad 0.240mm DIA. Solder Stencil Opening 0.300mm DIA. Solder Mask Opening 0.290mm DIA. Figure 5. Recommended Non-Solder Mask Defined Pad Illustration Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 3 | Page 10 of 12 | www.onsemi.com 260°C CM1402 CSP Mechanical Specifications CM1402 devices are packaged in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. Controlling dimension: millimeters PACKAGE DIMENSIONS Package Custom CSP Bumps 10 BOTTOM VIEW A1 Millimeters Inches C1 Dim Nom Max Min Nom Max A2 1.285 1.330 1.375 0.0506 0.0524 0.0541 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 C B A2 1.915 1.960 2.005 0.0754 0.0772 0.0789 A 1 # per tape and reel 0.091 2 3 4 C2 A1 B2 B1 B4 B3 Min D1 D2 0.30 DIA. 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS DIMENSIONS IN MILLIMETERS 0.0110 Package Dimensions for CM1402 Chip Scale Package 3500 pieces Rev. 3 | Page 11 of 12 | www.onsemi.com SIDE VIEW CM1402 CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CM1402 1.96 X 1.33 X 0.644 2.08 X 1.45 X 0.711 8mm 178mm (7") 3500 4mm 4mm Figure 8. Tape and Reel Mechanical Data ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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