SEMTECH SMS12C

SMS05C through SMS24C
TVS Diode Array
For ESD and Latch-Up Protection
PROTECTION PRODUCTS
Description
Features
‹ Transient protection for data lines to
The SMS series of TVS arrays are designed to protect
sensitive electronics from damage or latch-up due to
ESD and other voltage-induced transient events. Each
device will protect up to five lines. They are available
with operating voltages of 5V, 12V, 15V and 24V. They
are unidirectional devices and may be used on lines
where the signal polarities are above ground.
TVS diodes are solid-state devices designed specifically
for transient suppression. They feature large crosssectional area junctions for conducting high transient
currents. They offer desirable characteristics for board
level protection including fast response time, low
operating and clamping voltage and no device degradation.
The SMS series devices may be used to meet the
immunity requirements of IEC 61000-4-2, level 4. The
low cost SOT23-6L package makes them ideal for use
in portable electronics such as cell phones, PDA’s, and
notebook computers.
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IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) 24A (8/20µs)
Small package for use in portable electronics
Protects five I/O lines
Working voltages: 5V, 12V, 15V and 24V
Low leakage current
Low operating and clamping voltages
Solid-state silicon avalanche technology
Mechanical Characteristics
‹
‹
‹
‹
EIAJ SOT23-6L package
Molding compound flammability rating: UL 94V-0
Marking : Marking Code
Packaging : Tape and Reel per EIA 481
Applications
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‹
‹
‹
‹
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Circuit Diagram
Cell phone Handsets and Accessories
Microprocessor Based Equipment
Personal Digital Assistants (PDA’s)
Notebooks, Desktops, and Servers
Portable Instrumentation
Set Top Box
Peripherals
MP3 Players
Cordless Phones
Schematic & PIN Configuration
SOT23-6L (Top View)
Revision 08/11/04
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SMS05C through SMS24C
PROTECTION PRODUCTS
Absolute Maximum Rating
Rating
Symbol
Value
Units
Peak Pulse Power (tp = 8/20µs)
Pp k
300
Watts
Peak Forward Voltage (IF=1A, tp=8/20µs)
VFP
1.5
V
Lead Soldering Temperature
TL
260 (10 sec.)
°C
Operating Temperature
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
Storage Temperature
Electrical Characteristics
SMS05C
Par ame te r
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Symbo l
Co nditio ns
Minimum
Typical
VRWM
Maximum
Units
5
V
V BR
It = 1mA
Reverse Leakage Current
IR
VRWM = 5V, T=25°C
20
µA
Clamp ing Voltage
VC
IPP = 5A, tp = 8/20µ s
9.8
V
Clamp ing Voltage
VC
IPP = 24A, tp = 8/20µ s
14.5
V
Peak Pulse Current
IP P
tp = 8/20µ s
24
A
Junction Cap acitance
Cj
Between I/O Pins and
Ground
VR = 0V, f = 1MHz
325
400
pF
Symbo l
Co nditio ns
Typical
Maximum
Units
12
V
6
V
SMS12C
Par ame te r
Reverse Stand-Off Voltage
Minimum
VRWM
V BR
It = 1mA
Reverse Leakage Current
IR
VRWM = 12V, T=25°C
1
µA
Clamp ing Voltage
VC
IPP = 5A, tp = 8/20µ s
19
V
Clamp ing Voltage
VC
IPP = 15A, tp = 8/20µ s
23
V
Peak Pulse Current
IP P
tp = 8/20µ s
15
A
Junction Cap acitance
Cj
Between I/O Pins and
Ground
VR = 0V, f = 1MHz
150
pF
Reverse Breakdown Voltage
 2004 Semtech Corp.
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V
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SMS05C through SMS24C
PROTECTION PRODUCTS
Electrical Characteristics (Continued)
SMS15C
Par ame te r
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Symbo l
Co nditio ns
Minimum
Typical
VRWM
Maximum
Units
15
V
V BR
It = 1mA
Reverse Leakage Current
IR
VRWM = 15V, T=25°C
1
µA
Clamp ing Voltage
VC
IPP = 5A, tp = 8/20µ s
24
V
Clamp ing Voltage
VC
IPP = 12A, tp = 8/20µ s
29
V
Peak Pulse Current
IP P
tp = 8/20µ s
12
A
Junction Cap acitance
Cj
Between I/O Pins and
Ground
VR = 0V, f = 1MHz
100
125
pF
Symbo l
Co nditio ns
Typical
Maximum
Units
24
V
16.7
V
SMS24C
Par ame te r
Reverse Stand-Off Voltage
Reverse Breakdown Voltage
Minimum
VRWM
V BR
It = 1mA
Reverse Leakage Current
IR
VRWM = 24V, T=25°C
1
µA
Clamp ing Voltage
VC
IPP = 5A, tp = 8/20µ s
40
V
Clamp ing Voltage
VC
IPP = 8A, tp = 8/20µ s
44
V
Peak Pulse Current
IP P
tp = 8/20µ s
8
A
Junction Cap acitance
Cj
Between I/O Pins and
Ground
VR = 0V, f = 1MHz
75
pF
 2004 Semtech Corp.
3
26.7
V
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SMS05C through SMS24C
PROTECTION PRODUCTS
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
110
10
100
% of Rated Power or IPP
Peak Pulse Power - Ppk (kW)
90
1
0.1
80
70
60
50
40
30
20
10
0.01
0
0.1
1
10
100
0
1000
25
125
150
45
W aveform
Parameters:
tr = 8µs
td = 20µs
90
80
40
Clamping Voltage - VC (V)
100
Percent of IPP
100
Clamping Voltage vs. Peak Pulse Current
110
e -t
60
50
40
75
Ambient Temperature - TA ( C)
Pulse Waveform
70
50
o
Pulse Duration - tp (µs)
td = I PP /2
30
20
Waveform
Parameters:
tr = 8µs
td = 20µs
SMS24C
35
30
SMS15C
25
20
SMS12C
15
SMS05C
10
5
10
0
0
0
5
10
15
20
25
0
30
5
10
15
20
25
30
Peak Pulse Current - IPP (A)
T im e (µs)
Forward Voltage vs. Forward Current
5
Forward Voltage - VF (V)
4.5
4
3.5
3
2.5
2
1.5
Waveform
Parameters:
tr = 8µs
td = 20µs
1
0.5
0
0
5
10
15
20
25
30
35
40
45
Forward Current - IF (A)
 2004 Semtech Corp.
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SMS05C through SMS24C
PROTECTION PRODUCTS
Applications Information
Device Connection for Protection of Five Data Lines
SMSxxC Circuit Diagram
The SMSxxC is designed to protect up to five unidirectional data lines. The device is connected as follows:
1. Unidirectional protection of five I/O lines is
achieved by connecting pins 1, 3, 4, 5 and 6 to the
data lines. Pin 2 is connected to ground. The
ground connection should be made directly to the
ground plane for best results. The path length is
kept as short as possible to reduce the effects of
parasitic inductance in the board traces.
Circuit Board Layout Recommendations for Suppression of ESD.
Protection of Five Unidirectional Lines
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
z
z
z
z
z
z
Place the SMSxxC near the input terminals or
connectors to restrict transient coupling.
Minimize the path length between the SMSxxC and
the protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path to ground should be
kept as short as possible.
Never run critical signals near board edges.
Use ground planes whenever possible.
 2004 Semtech Corp.
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SMS05C through SMS24C
PROTECTION PRODUCTS
Outline Drawing
Drawing - SO-8
Outline
A
e1
2X E/2
D
DIM
N
EI
1
H
H
E
ccc C
2X N/2 TIPS
c
GAGE
PLANE
2
A
A1
A2
b
c
D
E1
E
e
e1
L
L1
N
01
aaa
bbb
ccc
0.25
L
e
01
(L1)
B
DETAIL
A
D
aaa C
A2
SEATING
PLANE
C
A
SEE DETAIL
A1
bxN
bbb
A
DIMENSIONS
INCHES
MILLIMETERS
MIN NOM MAX MIN NOM MAX
.057
.035
.000
.006
.035 .045 .051
.010
.020
.003
.009
.110 .114 .118
.060 .063 .069
.110 BSC
.037 BSC
.075 BSC
.012 .018 .024
(.024)
6
0°
10°
.004
.008
.008
1.45
0.90
0.00
0.15
.90 1.15 1.30
0.25
0.50
0.08
0.22
2.80 2.90 3.00
1.50 1.60 1.75
2.80 BSC
0.95 BSC
1.90 BSC
0.30 0.45 0.60
(0.60)
6
0°
10°
0.10
0.20
0.20
SIDE VIEW
C A-B D
NOTES:
1.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DATUMS -A- AND -B- TO BE DETERMINED AT DATUM PLANE -H3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
Land Pattern
X
DIM
(C)
G
C
G
P
X
Y
Z
Z
Y
DIMENSIONS
MILLIMETERS
INCHES
(.098)
.055
.037
.024
.043
.141
(2.50)
1.40
0.95
0.60
1.10
3.60
P
NOTES:
1.
 2004 Semtech Corp.
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
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SMS05C through SMS24C
PROTECTION PRODUCTS
Marking Codes
Part Number
Marking
Code
SMS05C
C05
SMS12C
C12
SMS15C
C15
SMS24C
C24
Note:
Pin 1 Identified with a dot.
Ordering Information
Part Number
Working
Voltage
Qty per
Reel
R eel Size
SMS05C.TC
SnPb
3,000
7 Inch
SMS12C.TC
SnPb
3,000
7 Inch
SMS15C.TC
SnPb
3,000
7 Inch
SMS24C.TC
SnPb
3,000
7 Inch
SMS05C.TCT
Pb Free
3,000
7 Inch
SMS12C.TCT
Pb Free
3,000
7 Inch
SMS15C.TCT
Pb Free
3,000
7 Inch
SMS24C.TCT
Pb Free
3,000
7 Inch
Note:
(1) No suffix indicates tube pack.
 2004 Semtech Corp.
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