HIGH CURRENT POWER INDUCTORS SDL1108 SERIES 1. PART NO. EXPRESSION : SDL1108-R47MF (a) (b) (c) (d)(e) (a) Series code (d) Tolerance code : M = ±20% (b) Dimension code (e) F : Lead Free (c) Inductance code : R47 = 0.47uH 2. CONFIGURATION & DIMENSIONS : G A F H I B C R47 D PCB Pattern E mm Part No. A mm mm B C mm D mm E mm mm F G mm mm H I -0 SDL1108-R47MF 12.0 Max. 12.0 Max. 8.5 Max. 3.4±0.5 5.6±0.5 6.7±0.5 5.6±0.5 6.7±0.5 1.8 +0.2 SDL1108-R60MF 12.0 Max. 12.0 Max. 8.5 Max. 3.4±0.5 5.6±0.5 6.7±0.5 5.6±0.5 6.7±0.5 1.8 +0.2 SDL1108-1R0MF 12.0 Max. 12.0 Max. 8.5 Max. 3.4±0.5 6.6±0.5 6.2±0.5 6.6±0.5 6.2±0.5 1.5 +0.2 SDL1108-1R2MF 12.5 Max. 12.0 Max. 8.5 Max. 3.4±0.5 6.6±0.5 6.2±0.5 6.6±0.5 6.2±0.5 1.5 +0.2 SDL1108-1R5MF 12.0 Max. 12.0 Max. 8.5 Max. 3.4±0.5 7.2±0.5 6.2±0.5 7.2±0.5 6.2±0.5 1.4 +0.2 SDL1108-2R0MF 12.0 Max. 12.0 Max. 8.5 Max. 3.4±0.5 6.5±0.5 6.4±0.5 6.5±0.5 6.4±0.5 1.2 +0.2 -0 -0 -0 -0 -0 3. SCHEMATIC : 4. MATERIALS : (a) Core : Ferrite Core b (b) Wire : Enamelled Copper Wire a NOTE : Specifications subject to change without notice. Please check our website for latest information. 05.05.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 HIGH CURRENT POWER INDUCTORS SDL1108 SERIES 5. GENERAL SPECIFICATION : a) Operating temp. : -55°C to +125°C b) Storage temp. : -55°C to +125°C c) Ambient temp. : 20°C d) Irms (A) : Will cause the coil temperature rise approximately ǻT=40°C without core loss e) Isat (A) : Will cause L0 to drop approximately 20% typical f) Part temperature (ambient + temp. rise) : Should not exceed 125°C under worst case operating conditions 6. ELECTRICAL CHARACTERISTICS : Part No. Inductance L 0 ( µH ) Test Frequency ( Hz ) DCR ( mȍ ) ±8% Irms (A) Max. Isat (A) Max. SDL1108-R47MF 0.47±20% 0.25V / 100K 0.8 40 50 SDL1108-R60MF 0.60±20% 0.25V / 100K 0.8 38 45 SDL1108-1R0MF 1.00±20% 0.25V / 100K 1.7 30 40 SDL1108-1R2MF 1.20±20% 0.25V / 100K 2.0 27 34 SDL1108-1R5MF 1.50±20% 0.25V / 100K 2.4 25 30 SDL1108-2R0MF 2.00±20% 0.25V / 100K 3.5 20 25 NOTE : Specifications subject to change without notice. Please check our website for latest information. 05.05.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 HIGH CURRENT POWER INDUCTORS SDL1108 SERIES 7. CHARACTERISTICS CURVES : SDL1108-R47MF SW DL1108-R47MF SDL1108-1R0MF SWDL1108-1R0MF SDL1108-1R5MF SWDL1108-1R5MF SW DL1108-R60MF SDL1108-R60MF SDL1108-1R2MF SWDL1108-1R2MF SDL1108-2R0MF SWDL1108-2R0MF NOTE : Specifications subject to change without notice. Please check our website for latest information. 05.05.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 HIGH CURRENT POWER INDUCTORS SDL1108 SERIES 8. RELIABILITY AND TEST CONDITION : ITEM PERFORMANCE TEST CONDITION Electrical Characteristics Test Refer to standard electrical characteristics list Inductance HP4284A, CH11025, CH3302, CH1320, CH1320S LCR meter. DCR CH16502, Agilent33420A Micro-Ohm Meter. Heat Rated Current (Irms) Irms(A) will cause the coil temperature rise approximately ǻT=40°C without core loss Saturation Current (Isat) Isat(A) will cause Lo to drop approximately 20%. Mechanical Performance Test Solderability Test More than 90% of the terminal electrode should be covered with solder. Preheating Dipping 230°C 150°C 60 seconds Natural cooling 4±1 seconds After fluxing components shall be dipped in a melted solder bath at 230±5°C for 4 seconds. Solder Heat Resistance 1. Components should have no evidence of electrical & mechanical damage. 2. Inductance : Within ±20% of initial value. Preheat : 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 260±5°C Flux for lead free : rosin Dip Time : 10±0.5sec. Preheating Dipping 260°C 150°C 60 seconds Natural cooling 10±0.5 seconds Reliability Test High Temperature Life Test Low Temperature Life Test Temperature : 125±5°C Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. 1. Appearance : No damage 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. Thermal Shock Temperature : -40±5°C Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. Conditions of 1 cycle. Times (min.) Step Temperature (°C) 1 -55±3 30±3 2 Room Temperature Within 3 3 125±3 30±3 4 Room Temperature Within 3 Total : 5 cycles Measure at room temperature after placing for 2 to 3 hrs. Humidity Resistance 1. Appearance : No damage 2. Inductance : Within ±20% of initial value. No disconnection or short circuit. Temperature : 40±5°C Humidity : 90% to 95% Applied Current : Rated Curent Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. NOTE : Specifications subject to change without notice. Please check our website for latest information. 05.05.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 HIGH CURRENT POWER INDUCTORS SDL1108 SERIES 9. SOLDERIND AND MOUNTING : Part No. mm mm mm G H SDL1108-R47MF 5.6±0.5 6.7±0.5 1.8 +0.2 SDL1108-R60MF 5.6±0.5 6.7±0.5 1.8 +0.2 SDL1108-1R0MF 6.6±0.5 6.2±0.5 1.5 +0.2 SDL1108-1R2MF 6.6±0.5 6.2±0.5 1.5 +0.2 SDL1108-1R5MF 7.2±0.5 6.2±0.5 1.4 +0.2 SDL1108-2R0MF 6.5±0.5 6.4±0.5 1.2 +0.2 I -0 -0 -0 -0 I G H -0 -0 9-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 9-2.1 Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 9-2.2 Soldering Iron (Figure 2) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : a) Preheat circuit and products to 150°C. d) 1.0mm tip diameter (max) e) Use a 20 watt soldering iron with tip diameter of 1.0mm b) 280°C tip temperature (max) c) Never contact the ceramic with the iron tip f) Limit soldering time to 3 secs. Soldering 10s max. Natural cooling 250~260 230 180 150 60~120s Preheating TEMPERATURE °C TEMPERATURE °C Preheating Soldering 280 Natural cooling 260 150 Over 1min. 30~60s Gradual Cooling Within 3secs. Figure 1. Re-flow Soldering Figure 2. Iron Soldering 10. PACKING AND QUANTITY : Size SDL1108 Styrofoam 210 Inner box 420 Carton 2100 NOTE : Specifications subject to change without notice. Please check our website for latest information. 05.05.2008 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5