FUJITSU MB88101AP

FUJITSU SEMICONDUCTOR
DATA SHEET
DS04-13105-3E
Linear IC Converter
CMOS
A/D Converter
(With 4-channel Input at 12-bit Resolution)
MB88101A
■ DESCRIPTION
The MB88101A is an analog-to-digital converter that converts its analog input to a 12-bit digital value and outputs it
as serial data.
The MB88101A employs a successive approximation method for A/D conversion.
The MB88101A has four input channels selectable for analog input under control of the dedicated external pins.
The MB88101A can be switched to a mode for continuous A/D conversion, in which it outputs serial data from the
MSB or LSB selectable depending on the mode setting.
■ FEATURES
•
•
•
•
•
•
•
•
•
4-channel analog input
One analog input channel selectable for conversion by external control
CR-type successive approximation system with a sample-and-hole circuit
12-bit resolution
Serial output of 12-bit digital data
Capable of continuous conversion (continuous conversion mode)
MSB or LSB selectable for serial output
CMOS process
Package options of 16-pin DIP, 16-pin SSOP, and 16-pin SOP available
■ PACKAGES
16-pin Plastic DIP
16-pin Plastic SSOP
16-pin Plastic SOP
(DIP-16P-M04)
(FPT-16P-M05)
(FPT-16P-M06)
MB88101A
■ PIN ASSIGNMENT
(TOP VIEW)
16
VCC
15
SAMP
3
14
DO
AGND
4
13
CLK
AN2
5
12
CS
AN3
6
11
C0
MOD0
7
10
MOD1
8
9
AN0
1
AN1
2
VREF
INDEX
(DIP-16P-M04)
(FPT-16P-M06)
(FPT-16P-M05)
2
C1
DGND
MB88101A
■ PIN DESCRIPTION
Pin no.
Symbol
I/O
Descriptions
1
2
5
6
AN0
AN1
AN2
AN3
I
Analog input pins. One of these channels can be selected depending on
the C0 and C1 settings.
14
DO
O
This pin outputs the result of A/D conversion. The result is 12-bit serial
data output in synchronization with the rise of CLK.
13
CLK
I
Clock input pin for A/D conversion
12
CS
I
Chip select signal input pin. Setting the signal level to “L” after turning
the power on starts A/D conversion; setting it to “H” stops A/D
conversion. When this pin is “H”, the DO and SAMP pins are “Hi-Z”.
11
10
C0
C1
I
Input pins for selecting the analog input channels from among pins AN0
to AN3. See Table 1 for the correspondence between the pin settings
and the channels selected. To switch the channel in mode 2 or 3, set
these pins before the SAMP pin goes “H”.
7
8
MOD0
MOD1
I
Conversion mode setting pins. For the correspondence between the pin
settings and the modes selected, see Table 2 and “■ FUNCTIONAL
DESCRIPTION.”
15
SAMP
O
This pin becomes active in prior to data output. Serial data is output from
the DO pin five clock cycles after the signal level at this pin goes “L” after
“H” for one clock cycle.
3
VREF
—
Reference voltage input pin
4
AGND
—
Analog circuit ground pin
9
DGND
—
Digital circuit ground pin
16
VCC
—
Power supply pin
Hi-Z : High-Z
• Channel selection
Table 1
• Mode selection
Pin Settings and Channel Selection
Table 2
Pin Settings and Mode Selection
C1
C0
Channel
MOD 0
MOD1
Mode
L
L
AN0
L
L
Mode 1
L
H
AN1
L
H
Mode 2
H
L
AN2
H
L
(Disabled)
H
H
AN3
H
H
Mode 3
3
MB88101A
■ BLOCK DIAGRAM
VREF
12-bit D/A converter
AN0
Comparator
Successive
approximation
register
AN3
12-bit
latch
C0
C1
MOD0
MOD1
Decoder
Sample-and-hold
circuit
VCC AGND DGND
4
CS
CLK
Selecter
AN2
SAMP
Input circuit
AN1
DO
MB88101A
■ FUNCTIONAL DESCRIPTION
1. Mode 1
This mode sets the DO pin to “L” and stops conversion upon completion of conversion of 12 bits. To restart
conversion, set CS to “H” once then to “L”. In this mode, converted data is output from the MSB.
• Timing diagram
CS
MOD0, MOD1
C0, C1
1
CLK
2
3
4
5
6
7
8
9
10 11 12 13 14 15 16
1
Sampling
Sampling
Bit
Trial
DO
2
B11
B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0
Hi-Z
Hi-Z
B11 B10 B9 B8 B7
B6 B5 B4 B3 B2
Hi-Z
B1 B0
Hi-Z
SAMP
2. Mode 2
This mode continues conversion until CS becomes “H” after it becomes “L”. Converted data is output from the
LSB, with the first piece of converted data output 20 clock cycles after CS becomes “L”. Changing the channel
select pin settings before starting sampling of one analog input allows another to be converted.
• Timing diagram
CS
MOD0, MOD1
C0, C1
Mode 2
AN0
AN2
AN1
CLK
16CLK
Bit
Trial
MSB (AN0) ⇒ LSB
Hi-Z
DO
Hi-Z
MSB (AN2) ⇒ LSB
LSB (AN0) ⇒ MSB
MSB (AN1) ⇒ LSB
LSB (AN2) ⇒ MSB
Hi-Z
Hi-Z
SAMP
5
MB88101A
3. Mode 3
This mode continues conversion until CS becomes “H” after it becomes “L”. Converted data is output from the
MSB. Changing the channel select pin settings before starting sampling of one analog input allows another to
be converted.
• Timing diagram
CS
MOD0, MOD1
C0, C1
Mode 3
AN0
AN2
AN1
CLK
Bit
Trial
MSB (AN0) ⇒ LSB
Hi-Z
DO
Hi-Z
SAMP
6
MSB (AN0) ⇒ LSB
MSB (AN2) ⇒ LSB
MSB (AN2) ⇒ LSB
MSB (AN1) ⇒ LSB
MSB (AN1) ⇒ LSB
Hi-Z
Hi-Z
MB88101A
■ ABSOLUTE MAXIMUM RATINGS
Parameter
Power supply voltage
Input voltage
Output voltage
Symbol
Conditions
VCC
VREF
VIN
Based on GND
(Ta = +25°C)
VOUT
Rating
Unit
Min
Max
–0.3
+7.0
V
–0.3*
+7.0*
V
–0.3
VCC + 0.3
V
–0.3
VCC + 0.3
V
Power consumption
PD
—
—
150
mW
Operating temperature
Ta
—
–40
+85
°C
Storage temperature
Tstg
—
–55
+150
°C
* : VCC ≥ VREF
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
■ RECOMMENDED OPERATING CONDITIONS
Parameter
Power supply voltage
Operation temperature
Symbol
Value
Unit
Min
Typ
Max
VCC
3.3
—
5.5
V
GND
—
0
—
V
Ta
–40
—
+85
°C
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device’s electrical characteristics are warranted when the device is
operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges. Operation
outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on
the data sheet. Users considering application outside the listed conditions are advised to contact their
FUJITSU representatives beforehand.
7
MB88101A
■ ELECTRICAL CHARACTERISTIC
1. DC Characteristics
(1) Digital section
(VCC = 3.3 V to 5.5 V, DGND = 0 V, Ta = –40°C to +85°C)
Parameter
Symbol
Power supply voltage
VCC
Power supply current
ICC
Input leakage current
IILK
Low-level input voltage
VIL
High-level input voltage
VIH
High-impedance output
leakage current
IOLZ
Low-level output voltage
VOL
High-level output voltage
VOH
Pin name
Value
Conditions
Unit
Min
Typ
Max
3.3
5.0
5.5
V
—
VCC
Operation at
CLK =166kHz
(with no load)
—
0.8
2.0
mA
MOD0,
MOD1
CLK
CS
C0
C1
VIN = 0 to VCC
–10
—
10
µA
—
VSS −
0.3
—
0.2 VCC
V
—
0.8 VCC
—
VCC +
0.3
V
VIN = 0 to VCC
–10
—
10
µA
IOL = 2.5 mA
—
—
0.4
V
VCC −
0.4
—
—
V
DO
SAMP
IOH = –400 µA
(2) Analog section
(VREF, VCC = 3.3 V to 5.5 V (VCC ≥ VREF), AGND = 0 V, Ta = –40°C to +85°C)
Parameter
8
Symbol
Resolution
—
Linearity error
—
Differential linearity error
—
Conversion time
—
Consumption current
IREF
Analog reference voltage
—
Analog input voltage
—
Pin name
AN0 to AN3
—
VREF
AN0 to AN3
Value
Unit
Min
Typ
Max
—
12
—
bit
–4.0
—
2.0
LSB
–1.0
—
3.0
LSB
—
16
—
CLK
—
100
300
µA
3.3
5.0
VCC
V
0
—
VREF
V
MB88101A
(3) Definitions of A/D converter terms
• Resolution
Analog transition identifiable by the A/D converter
• Linearity error
Deviation of the straight line drawn between the zero transition point (0000 0000 0000 ↔ 0000 0000 0001)
and the full-scale transition point (1111 1111 1110 ↔ 1111 1111 1111) of the device from actual conversion
characteristics
• Differential linearity error
Deviation from the ideal input voltage required to shift output code by one LSB
Actual converted value
Digital output
1111 1111 1111
1111 1111 1110
•
•
•
(1 LSB × N + VOT)
Ideal converted value
•
•
•
•
Linearity error
•
•
0000 0000 0010
0000 0000 0001
0000 0000 0000
Analog output
VNT V(N+1)T
VOT
•
1 LSB
=
•
Linearity error
=
•
Differential linearity error =
VFST
VFST - VOT
4094
VNT - (1 LSB × N + VOT)
1 LSB
V(N+1)T - VNT
1 LSB
-1
(LSB)
(LSB)
• Analog input equivalent circuit
Analog input
Comparator
RON1
RON2
C0
⋅ RON1 = About 1.5 kΩ
⋅ RON2 = About 1.5 kΩ
⋅ C0 = About 60 pF
Note: The above values are reference values.
Notes: • The tolerance of output impedance of an external circuit connected to this A/D converter has an effect on
conversion time (CLK frequency). See “■ TYPICAL CHARACTERISTICS”.
• If the output impedance of the external input is too high, the analog voltage sampling time may be short.
• When turning the device on, turn the power supply for the digital system first before turning VREF on.
9
MB88101A
2. AC Characteristics
(VREF, VCC = 3.3 V to +5.5 V (VCC ≥ VREF), AGND = 0 V, Ta = –40°C to +85°C)
Parameter
Symbol
Conditions
Value
Max
VCC = 5 V ± 10% *1
1.0
30.0
µs
—
6.0
30.0
µs
Clock cycle time
tCLK
Low-level clock pulse width
tCKL
—
2.8
14.8
µs
High-level clock pulse width
tCKH
—
2.8
14.8
µs
Clock rise time
Clock fall time
tCr
tCf
—
—
0.2
µs
CS setup time
tCSS
—
tCKL + 0.4
—
µs
CS hold time
tCSH
—
1.0
—
µs
CS release time
tCSR
—
1.0
—
CLK
Channel setup time
tCHS
—
0
—
µs
Channel hold time
tCHH
—
1.0
—
CLK
Data output delay time
tDO
*2
—
0.5
µs
MOD setup time
tMOS
—
0.2
—
µs
MOD hold time
tMOH
—
0.1
—
µs
Data active delay time
tDVE
—
—
0.5
µs
Data float delay time
tDZE
—
—
0.5
µs
SAMP active delay time
tSVE
—
—
0.5
µs
SAMP float delay time
tSZE
—
—
0.5
µs
SAMP high-level output delay time
tSHD
*2
—
0.5
µs
SAMP low-level output delay time
tSLD
*2
—
0.5
µs
*1: Depending on the output impedance of the external circuit connected to the analog input pin
*2: See “• AC test circuit.”
• AC test circuit
Measurement point
CL = 50 pF
10
Unit
Min
MB88101A
■ TIMING DIAGRAM
(1) Input clock timing
t CLK
t CKH
CLK
t Cf
t CKL
t Cr
Evaluation levels are 80% and 20% of the VCC.
(2) A/D startup timing
CLK
tCSH
tCSS
CS
tMOS
tMOH
MOD0, MOD1
tCHS
tCHH
C0, C1
tSVE
SAMP
tSHD
tSLD
Hi-Z
tDVE
Hi-Z
DO
11
MB88101A
(3) Data output delay time and A/D stop timing
CLK
tCSR
CS
tSZE
Hi-Z
SAMP
tDO
tDZE
Hi-Z
DO
12
MB88101A
■ TYPICAL CHARACTERISTICS
Power supply current ICC (µA)
Power supply voltage vs. Power supply current
1,000
900
800
700
600
500
400
300
200
100
0
Ta = +25°C
VREF = VCC
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Power supply voltage VCC (V)
Analog consumption current IREF (µA)
Analog reference voltage vs. Analog consumption current
300
Ta = +25°C
VCC = VREF
250
200
150
100
50
0
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Analog reference voltage VREF (V)
(Continued)
13
MB88101A
(Continued)
Analog input external impedance vs. Clock cycle time (tCLK)
10
160
Ta = +25°C
9
128
7
6
96
5
4
64
3
2
32
VCC = VREF = 3.3 V
VCC = VREF = 5.0 V
1
0
0
0
1
2
3
4
5
6
7
8
Analog input impedance (kΩ)
Note ; Conversion time = Clock cycle time (tCLK) × 16
14
9
10
11
12
13
14
15
Conversion time (µs)
Clock cycle time tCLK (µs)
8
MB88101A
■ ORDERING INFORMATION
Part number
MB88101AP
MB88101APFV
MB88101APF
Package
Remarks
16-pin Plastic DIP
(DIP-16P-M04)
16-pin Plastic SSOP
(FPT-16P-M05)
16-pin Plastic SOP
(FPT-16P-M06)
15
MB88101A
■ PACKAGE DIMENSIONS
16-pin Plastic DIP
(DIP-16P-M04)
+0.20
19.55 –0.30
.770
+.008
–.012
INDEX-1
6.20±0.25
(.244±.010)
INDEX-2
0.51(.020)MIN
4.36(.172)MAX
0.25±0.05
(.010±.002)
3.00(.118)MIN
0.46±0.08
(.018±.003)
+0.30
0.99 –0
+.012
.039 –0
1.27(.050)
MAX
C
+0.30
1.52 –0
+.012
.060 –0
7.62(.300)
TYP
15°MAX
2.54(.100)
TYP
1994 FUJITSU LIMITED D16033S-2C-3
Dimensions in mm (inches) .
Note : The values in parentheses are reference values.
(Continued)
16
MB88101A
Note 1) *1 : Resin protrusion. (Each side : +0.15 (.006) Max).
Note 2) *2 : These dimensions do not include resin protrusion.
Note 3) Pins width and pins thickness include plating thickness.
Note 4) Pins width do not include tie bar cutting remainder.
16-pin Plastic SSOP
(FPT-16P-M05)
*1 5.00±0.10(.197±.004)
0.17±0.03
(.007±.001)
9
16
*2 4.40±0.10 6.40±0.20
(.173±.004) (.252±.008)
INDEX
Details of "A" part
+0.20
1.25 –0.10
+.008
.049 –.004
LEAD No.
1
8
0.65(.026)
0.10(.004)
C
(Mounting height)
"A"
0.24±0.08
(.009±.003)
0.13(.005)
M
0~8˚
0.50±0.20
(.020±.008)
0.60±0.15
(.024±.006)
0.10±0.10
(Stand off)
(.004±.004)
0.25(.010)
2003 FUJITSU LIMITED F16013S-c-4-6
Dimensions in mm (inches) .
Note : The values in parentheses are reference values.
(Continued)
17
MB88101A
(Continued)
Note 1) *1 : These dimensions include resin protrusion.
Note 2) *2 : These dimensions do not include resin protrusion.
Note 3) Pins width and pins thickness include plating thickness.
Note 4) Pins width do not include tie bar cutting remainder.
16-pin Plastic SOP
(FPT-16P-M06)
+0.25
+.010
+0.03
*110.15 –0.20 .400 –.008
0.17 –0.04
+.001
16
.007 –.002
9
*2 5.30±0.30
7.80±0.40
(.209±.012) (.307±.016)
INDEX
Details of "A" part
+0.25
2.00 –0.15
+.010
.079 –.006
1
"A"
8
1.27(.050)
0.47±0.08
(.019±.003)
0.13(.005)
(Mounting height)
0.25(.010)
0~8˚
M
0.50±0.20
(.020±.008)
0.60±0.15
(.024±.006)
+0.10
0.10 –0.05
+.004
.004 –.002
(Stand off)
0.10(.004)
C
2002 FUJITSU LIMITED F16015S-c-4-7
Dimensions in mm (inches) .
Note : The values in parentheses are reference values.
18
MB88101A
FUJITSU LIMITED
All Rights Reserved.
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales
representatives before ordering.
The information, such as descriptions of function and application
circuit examples, in this document are presented solely for the
purpose of reference to show examples of operations and uses of
Fujitsu semiconductor device; Fujitsu does not warrant proper
operation of the device with respect to use based on such
information. When you develop equipment incorporating the
device based on such information, you must assume any
responsibility arising out of such use of the information. Fujitsu
assumes no liability for any damages whatsoever arising out of
the use of the information.
Any information in this document, including descriptions of
function and schematic diagrams, shall not be construed as license
of the use or exercise of any intellectual property right, such as
patent right or copyright, or any other right of Fujitsu or any third
party or does Fujitsu warrant non-infringement of any third-party’s
intellectual property right or other right by using such information.
Fujitsu assumes no liability for any infringement of the intellectual
property rights or other rights of third parties which would result
from the use of information contained herein.
The products described in this document are designed, developed
and manufactured as contemplated for general use, including
without limitation, ordinary industrial use, general office use,
personal use, and household use, but are not designed, developed
and manufactured as contemplated (1) for use accompanying fatal
risks or dangers that, unless extremely high safety is secured, could
have a serious effect to the public, and could lead directly to death,
personal injury, severe physical damage or other loss (i.e., nuclear
reaction control in nuclear facility, aircraft flight control, air traffic
control, mass transport control, medical life support system, missile
launch control in weapon system), or (2) for use requiring
extremely high reliability (i.e., submersible repeater and artificial
satellite).
Please note that Fujitsu will not be liable against you and/or any
third party for any claims or damages arising in connection with
above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You
must protect against injury, damage or loss from such failures by
incorporating safety design measures into your facility and
equipment such as redundancy, fire protection, and prevention of
over-current levels and other abnormal operating conditions.
If any products described in this document represent goods or
technologies subject to certain restrictions on export under the
Foreign Exchange and Foreign Trade Law of Japan, the prior
authorization by Japanese government will be required for export
of those products from Japan.
F0310
 FUJITSU LIMITED Printed in Japan