SANYO LV5122T

Ordering number : ENA0728A
CMOS IC
LV5122T
2-Cell Lithium-Ion Secondary Battery
Protection IC
Overview
The LV5122T is a protection IC for 2-cell lithium-ion secondary batteries.
Features
• Monitoring function for each cell:
• High detection voltage accuracy:
• Hysteresis cancel function:
• Discharge current monitoring function:
• Low current consumption:
• 0V cell charging function:
Detects overcharge and over-discharge conditions and controls the
charging and discharging operation of each cell.
Over-charge detection accuracy
±25mV
Over-discharge detection accuracy ±100mV
The hysteresis of over-discharge detection voltage is canceled by sensing
the connection of a load after overcharging has been detected.
Detects over-currents and load shorting, and an excessive
discharge current is controlled.
Normal operation mode typ. 6.0µA
Stand by mode
max. 0.2µA
Charging is enabled even when the cell voltage is 0V by giving a
potential difference between the VDD pin and V- pin.
Any and all SANYO Semiconductor Co.,Ltd. products described or contained herein are, with regard to
"standard application", intended for the use as general electronics equipment (home appliances, AV equipment,
communication device, office equipment, industrial equipment etc.). The products mentioned herein shall not be
intended for use for any "special application" (medical equipment whose purpose is to sustain life, aerospace
instrument, nuclear control device, burning appliances, transportation machine, traffic signal system, safety
equipment etc.) that shall require extremely high level of reliability and can directly threaten human lives in case
of failure or malfunction of the product or may cause harm to human bodies, nor shall they grant any guarantee
thereof. If you should intend to use our products for applications outside the standard applications of our
customer who is considering such use and/or outside the scope of our intended standard applications, please
consult with us prior to the intended use. If there is no consultation or inquiry before the intended use, our
customer shall be solely responsible for the use.
Specifications of any and all SANYO Semiconductor Co.,Ltd. products described or contained herein stipulate
the performance, characteristics, and functions of the described products in the independent state, and are not
guarantees of the performance, characteristics, and functions of the described products as mounted in the
customer's products or equipment. To verify symptoms and states that cannot be evaluated in an independent
device, the customer should always evaluate and test devices mounted in the customer' s products or
equipment.
52307 MS IM / 32207 MS IM 20061130-S00001 No.A0728-1/10
LV5122T
Specifications
Absolute Maximum Ratings at Ta = 25°C
Parameter
Power supply voltage
Input voltage
Symbol
Conditions
Ratings
VDD
Unit
-0.3 to +12
V
V-
VDD-28 to VDD+0.3
V
Vcout
VDD-28 to VDD+0.3
V
Charger minus voltage
Output voltage
Cout pin voltage
Dout pin voltage
Allowable power dissipation
Vdout
Pd max
VSS-0.3 to VDD+0.3
Independent IC
170
V
mW
Operating ambient temperature
Topr
-30 to +80
°C
Storage temperature
Tstg
-40 to +125
°C
Electrical Characteristics 1 at Ta = 25°C, unless especially specified.
Parameter
Symbol
Conditions
Operation input voltage
Vcell
Between VDD and VSS
0V cell charging minimum operation
Vmin
Between VDD-VSS =0 and VDD-V-
Ratings
min
typ
Unit
max
1.5
10
V
1.5
V
voltage
Over-charge detection voltage
Vd1
4.325
4.350
4.375
V
Over-charge reset voltage
Vh1
4.100
4.150
4.200
V
Over-charge detection delay time
td1
VDD-Vc=3.5V→4.5V, Vc-VSS=3.5V
0.5
1.0
1.5
s
tr1
VDD-Vc=4.5V→3.5V, Vc-VSS=3.5V
ms
Over-charge reset delay time
20.0
40.0
60.0
Over-discharge detection voltage
Vd2
2.20
2.30
2.40
V
Over-discharge reset hysteresis voltage
Vh2
10.0
20.0
40.0
mV
Over-discharge detection delay time
td2
50
100
150
ms
ms
Over-discharge reset delay time
tr2
VDD-Vc=3.5V→2.2V, Vc-VSS=3.5V
0.5
1.0
1.5
Over-current detection voltage
Vd3
VDD-Vc=3.5V, Vc-VSS=3.5V
VDD-Vc=2.2V→3.5V, Vc-VSS=3.5V
0.28
0.30
0.32
V
Over-current reset hysteresis voltage
Vh3
VDD-Vc=3.5V, Vc-VSS=3.5V
5.0
10.0
20.0
mV
Over-current detection delay time
td3
VDD-Vc=3.5V, Vc-VSS=3.5V
2.5
5.0
7.5
ms
Over-current reset delay time
tr3
VDD-Vc=3.5V, Vc-VSS=3.5V
0.5
1.0
1.5
ms
Short circuit detection voltage
Vd4
VDD-Vc=3.5V, Vc-VSS=3.5V
1.0
1.3
1.6
V
Short circuit detection delay time
td4
VDD-Vc=3.5V, Vc-VSS=3.5V
ms
Standby reset voltage
Vstb
Between VDD-Vc=2.0V, Vc-VSS=2.0V
(V-)-VSS
Reset resistance (connected to VDD)
Reset resistance (connected to VSS)
0.2
0.5
0.8
VDD×0.4
VDD×0.5
VDD×0.6
RDD
100
200
400
kΩ
RSS
0.5
1.0
1.5
MΩ
Cout Nch ON voltage
VOL1
IOL=50µA, VDD-Vc=4.4V, Vc-VSS=4.4V
Cout Pch ON voltage
VOH1
IOL=50µA, VDD-Vc=3.9V, Vc-VSS=3.9V
Dout Nch ON voltage
VOL2
IOL=50µA, VDD-Vc=Vd2(min),
0.5
VDD-0.5
V
V
V
0.5
V
Vc-VSS=Vd2(min)
Dout Pch ON voltage
VOH2
IOL=50µA, VDD-Vc=3.9V, Vc-VSS=3.9V
VDD-0.5
V
Vc input current
Ivc
VDD-Vc=3.5V, Vc-VSS=3.5V
0.0
1.0
µA
Current drain
IDD
VDD-Vc=3.5V, Vc-VSS=3.5V
6.0
13.0
µA
Standby current
Istb
VDD-Vc=2.2V, Vc-VSS=3.5V
0.2
µA
No.A0728-2/10
LV5122T
Electrical Characteristics 2 at Ta = -20 to 70°C, unless especially specified.
Parameter
Symbol
Conditions
Operation input voltage
Vcell
Between VDD and VSS
0V cell charging minimum operation
Vmin
Between VDD-VSS =0 and VDD-V-
Ratings
min
typ
Unit
max
1.65
10
V
1.65
V
voltage
Over-charge detection voltage
Vd1
4.305
4.350
4.390
V
Over-charge reset voltage
Vh1
4.080
4.150
4.215
V
Over-charge detection delay time
td1
VDD-Vc=3.5V→4.5V, Vc-VSS=3.5V
0.350
1.000
1.950
s
tr1
VDD-Vc=4.5V→3.5V, Vc-VSS=3.5V
ms
Over-charge reset delay time
14.0
40.0
78.0
Over-discharge detection voltage
Vd2
2.18
2.30
2.42
V
Over-discharge reset hysteresis voltage
Vh2
8.0
20.0
42.0
mV
Over-discharge detection delay time
td2
VDD-Vc=3.5V→2.2V, Vc-VSS=3.5V
35
100
195
ms
Over-discharge reset delay time
tr2
VDD-Vc=2.2V→3.5V, Vc-VSS=3.5V
0.35
1.0
1.95
ms
Over-current detection voltage
Vd3
VDD-Vc=3.5V, Vc-VSS=3.5V
0.271
0.300
0.329
V
Over-current reset hysteresis voltage
Vh3
VDD-Vc=3.5V, Vc-VSS=3.5V
3.5
10.0
23.0
mV
Over-current detection delay time
td3
VDD-Vc=3.5V, Vc-VSS=3.5V
1.75
5.00
9.75
ms
Over-current reset delay time
tr3
VDD-Vc=3.5V, Vc-VSS=3.5V
0.35
1.00
1.95
ms
Short circuit detection voltage
Vd4
VDD-Vc=3.5V, Vc-VSS=3.5V
0.9
1.3
1.7
V
Short circuit detection delay time
td4
VDD-Vc=3.5V, Vc-VSS=3.5V
ms
Standby reset voltage
Vstb
Between VDD-Vc=2.0V, Vc-VSS=2.0V
(V-)-VSS
Reset resistance (connected to VDD)
Reset resistance (connected to VSS)
0.14
0.5
1.04
VDD×0.4
VDD×0.5
VDD×0.6
RDD
70
200
520
kΩ
RSS
0.35
1.0
1.95
MΩ
Cout Nch ON voltage
VOL1
IOL=50µA, VDD-Vc=4.4V, Vc-VSS=4.4V
Cout Pch ON voltage
VOH1
IOL=50µA, VDD-Vc=3.9V, Vc-VSS=3.9V
Dout Nch ON voltage
VOL2
IOL=50µA, VDD-Vc=Vd2(min),
0.5
VDD-0.5
V
V
V
0.5
V
Vc-VSS=Vd2(min)
Dout Pch ON voltage
VOH2
IOL=50µA, VDD-Vc=3.9V, Vc-VSS=3.9V
VDD-0.5
V
Vc input current
Ivc
VDD-Vc=3.5V, Vc-VSS=3.5V
0.0
1.0
µA
Current drain
IDD
VDD-Vc=3.5V, Vc-VSS=3.5V
6.0
16.9
µA
Standby current
Istb
VDD-Vc=2.2V, Vc-VSS=3.5V
0.2
µA
The Ratings of the table above is a design guarantees and are not measured.
No.A0728-3/10
LV5122T
Electrical Characteristics 3 at Ta = -30 to 85°C, unless especially specified.
Parameter
Symbol
Conditions
Operation input voltage
Vcell
Between VDD and VSS
0V cell charging minimum operation
Vmin
Between VDD-VSS =0 and VDD-V-
Ratings
min
typ
Unit
max
1.73
10
V
1.73
V
voltage
Over-charge detection voltage
Vd1
4.295
4.350
4.395
V
Over-charge reset voltage
Vh1
4.070
4.150
4.220
V
Over-charge detection delay time
td1
VDD-Vc=3.5V→4.5V, Vc-VSS=3.5V
0.3
1.0
2.1
s
Over-charge reset delay time
tr1
VDD-Vc=4.5V→3.5V, Vc-VSS=3.5V
12.0
40.0
84.0
ms
Over-discharge detection voltage
Vd2
2.17
2.30
2.43
V
Over-discharge reset hysteresis voltage
Vh2
6.0
20.0
42.0
mV
Over-discharge detection delay time
td2
30
100
210
ms
ms
Over-discharge reset delay time
tr2
VDD-Vc=3.5V→2.2V, Vc-VSS=3.5V
0.3
1.0
2.1
Over-current detection voltage
Vd3
VDD-Vc=3.5V, Vc-VSS=3.5V
VDD-Vc=2.2V→3.5V, Vc-VSS=3.5V
0.267
0.300
0.333
Over-current reset hysteresis voltage
Vh3
VDD-Vc=3.5V, Vc-VSS=3.5V
2.5
10.0
240
mV
Over-current detection delay time
td3
VDD-Vc=3.5V, Vc-VSS=3.5V
1.5
5.0
10.5
ms
Over-current reset delay time
tr3
VDD-Vc=3.5V, Vc-VSS=3.5V
0.3
1.0
2.1
ms
Short circuit detection voltage
Vd4
VDD-Vc=3.5V, Vc-VSS=3.5V
0.8
1.3
1.8
V
Short circuit detection delay time
td4
VDD-Vc=3.5V, Vc-VSS=3.5V
ms
Standby reset voltage
Vstb
Between VDD-Vc=2.0V, Vc-VSS=2.0V
(V-)-VSS
Reset resistance (connected to VDD)
Reset resistance (connected to VSS)
V
0.12
0.5
1.12
VDD×0.4
VDD×0.5
VDD×0.6
RDD
60
200
560
kΩ
RSS
0.3
1.0
2.1
MΩ
Cout Nch ON voltage
VOL1
IOL=50µA, VDD-Vc=4.4V, Vc-VSS=4.4V
Cout Pch ON voltage
VOH1
IOL=50µA, VDD-Vc=3.9V, Vc-VSS=3.9V
Dout Nch ON voltage
VOL2
IOL=50µA, VDD-Vc=Vd2(min),
0.5
VDD-0.5
V
V
V
0.5
V
Vc-VSS=Vd2(min)
Dout Pch ON voltage
VOH2
IOL=50µA, VDD-Vc=3.9V, Vc-VSS=3.9V
VDD-0.5
V
Vc input current
Ivc
VDD-Vc=3.5V, Vc-VSS=3.5V
0.0
1.0
µA
Current drain
IDD
VDD-Vc=3.5V, Vc-VSS=3.5V
6.0
18.2
µA
Standby current
Istb
VDD-Vc=2.2V, Vc-VSS=3.5V
0.2
µA
The Ratings of the table above is a design guarantees and are not measured.
No.A0728-4/10
LV5122T
Package Dimensions
unit : mm (typ)
3245B
Pd max -- Ta
Allowable power dissipation, Pd max -- mW
200
3.0
0.5
3.0
4.9
8
1
(0.53)
2
0.65
0.125
1.1MAX
(0.85)
0.25
Independent IC
170
150
100
68
50
0
-30 -20
0
20
40
60
80
100
0.08
Ambient temperature, Ta -- °C
SANYO : MSOP8(150mil)
Pin Assignment
Dout
T
8
7
1
2
VDD Cout
Vc Sense
6
5
3
V-
4
Top view
VSS
Pin Functions
Pin No.
1
Symbol
VDD
Description
VDD pin
2
Cout
Overcharge detection output pin
3
V-
Charger minus voltage input pin
4
VSS
VSS pin
5
Sense
Sense pin
6
Vc
Intermediate voltage input pin
7
T
Pin to shorten detection time (open under normal condition)
8
Dout
Overdischarge detection output pin
No.A0728-5/10
LV5122T
Block Diagram
Sence
5
VDD
1
+
+
-
Vc 6
2 Cout
td1,tr1
Delay
conrol
logic
+
-
td2,tr2
8 Dout
+
+
-
td3,tr3
+
-
4
VSS
3
V-
td4
7
T
No.A0728-6/10
LV5122T
Functional Description
Over-charge detection
If either of the cell voltage is equal to or more than the over-charge detection voltage, stop further charging by
turning “L” the Cout pin and turning off external Nch MOS FET after the over-charge detection delay time. This
delay time is set by the internal counter.
The over-charge detection comparator has the hysteresis function. Note that this hysteresis can be cancelled by
connecting the load after detection of over-charge detection.
Once over-charge detection is made, over-current detection is not made to prevent malfunction. Note that shortcircuit can be detected.
Over-charge return
If charger is connected and both cell voltages become equal to or lower than the over-charge recovery voltage or
over-charge detection voltage when load is connected, the Cout pin returns to “H” after the over-charge recovery
delay time set by the internal counter.
When load is connected and either cell or both cell voltages are equal to or more than the over-charge detection
voltage, the Cout pin does not return to “H.” When the load current is passed through the external Cout pin parasite
diode of Nch MOS FET after the over-charge recovery delay time and each cell voltage becomes equal to or below
over-charge detection voltage, the Cout returns to “H.”
Over-discharge detection
When either cell voltage is equal to or below over-discharge voltage, stop further discharge by turning “L” the Dout
pin and turning off external Nch MOS FET after the over-charge detection delay time.
The IC becomes standby state after detecting over-discharge and its consumption current is kept at about 0A. After
detection, the V- pin will be connected to VDD pin via 200kΩ.
Over-discharge return
Return from over-discharge is made by connecting charger. If the V- pin voltage becomes equal to or lower than the
standby return voltage by connecting charger after detecting over-discharge, it returns from the standby state to start
cell voltage monitoring. If both voltages become equal to or more than the over-discharge detection voltage by
charging, the Dout pin returns to “H” after the over-discharge return.
Over-current detection
When high current is passed through the battery, the V potential rises by the ON resister of external MOS FET and
becomes equal to or more than the over-current detection voltage, that will be deemed over-current state. Turn “L”
the Dout pin after the over-current detection delay time and turn off the external Nch MOS FET to prevent high
current in the circuit. The delay time is set by the internal counter. After detection, the V- pin will be connected to
VSS via 1MΩ. It will not go into standby state after detecting over-current.
Short circuit detection
If greater discharge current is passed and the V- pin voltage becomes equal to or more than the short-circuit detection
voltage, it will go into short-circuit detection state after the short circuit delay time shorter than the over-current
detection delay time. When short-circuit is detected, just like the time of over-current detection, turn Dout pin “L”
and turn off external Nch MOS FET to prevent high current in the circuit. The V- pin will be connected to VSS after
detection via 30kΩ. It will not go into standby state after detecting short-circuit.
Over-current/short-detection return
After detecting over-current or short circuit, the return resistor (typ.1MΩ) between V- pin and VSS pin becomes
effective and if the resistor is opened the V- pin voltage will be pulled by the VSS pin voltage. Thereafter, the IC will
return from the over-current/short-circuit detection state when the V- pin voltage becomes equal to or below the overcurrent detection voltage and the Dout pin returns to “H” after over-current return delay time set by the internal
counter.
No.A0728-7/10
LV5122T
0V cell charge
If the cell voltage is 0V but a potential difference between VDD and V becomes equal to or greater than the 0V cell
charging lowest operation voltage, the Cout pin will output “H” and enable charging.
Test time reduction function
By turning T pin to the VDD potential, the delay times set by the counter can be cut. Normal time settings if T pin is
open. Delay time not set by the counter cannot be controlled by this pin.
Operation in case of detection overlap
Operation in case of
detection overlap
Overlap state
State after detection
When, during over-
Over-discharge
Over-charge detection is preferred. If over-
When over-charge detection is made first, V- is
charge detection,
detection is made,
discharge state continues even after over-
released. When over-discharge is detected
charge detection, over-discharge detection is
after over-charge detection, the standby state is
not effectuated. Note that V- is connected to
resumed.
VDD via 200kΩ.
Over-current
(*1) Both detections’ can be made in parallel.
(*2) When over-current is detected first, V- is
detection is made,
Over-charge detection continues even when the
connected to VSS via 1MΩ. When over-charge
detection is made first, V- is released.
over-current state occurs. If the over-charge
state occurs first, over-current detection is
interrupted.
When, during over-
Over-charge detection
Over-discharge detection is interrupted and
The standby state is not effectuated when over-
discharge detection,
is made,
over-charge detection is preferred. When over-
discharge detection is made after over-charge
detection. Note that V- is connected to VDD via
200kΩ.
discharge state continues even after overcharge detection, over-discharge detection is
resumed.
Over-current
(*3) Both detections can be made in parallel.
(*4) If over-current is detected in advance, V will
detection is made,
Over-discharge detection continues even when
be connected to VSS via 1MΩ. After detecting
the over-current state is effectuated first. Over-
over-discharge, V will be connected to VDD via
current detection is interrupted when the over-
200kΩ to get into standby state. If over-
discharge state is effectuated first,
discharge is detected in advance, V will be
(*1)
state.
(*2)
(*3)
(*4)
connected to VDD via 200kΩ to get into standby
When, during overcurrent detection,
Over-charge detection
is made,
Over-discharge
detection is made,
(Note) Short-circuit detection can be made independently.
No.A0728-8/10
LV5122T
Timing Chart
[Cout Output System]
Hysteresis cancellation
by load connection
Charger
connection
Load
connection
Charger
connection
Load
connection
Charger
connection
Vd1
Vr1
VDD Vd2
VDD
Discharging via FETparasite Di
Vd4
V-
Vd3
VSS
Vd5
VDD
td1
Cout
tr1
td1
tr1
VOver-charge detection state
Over-charge detection state
[Dout Output System]
Load
connection
Charger
connection
Load
connection
Charger
Load
connection connection
Over-current
occurrence
Charger
connection
Load
connection
Load short-circuit
occurrence
Vd1
Vr1
VDD Vd2
To standby
To standby
VDD
Vd4
V-
Vd3
VSS
Vd5
Charging via FETparasite Di
Charging via FETparasite Di
VDD
Dout
td2
tr2
td3
tr3
td4
tr3
td2
VSS
Over-discharge detection state
Over-current detection state
Short-circuit detection state
Charge return
Charge return
VDD
Cout
V-
No.A0728-9/10
LV5122T
Application Circuit Example
+
R4
R1
C1
VDD
Sense
C3
VSS
R2
Vc
LV5122T
C2
VVSS
Dout
Cout
R3
−
Components
Recommended value
max
unit
R1, R2
100
1k
Ω
R3
2k
4k
Ω
R4
100
10k
Ω
C1, C2, C3
0.1µ
1µ
F
* These numbers don't mean to guarantee the characteristic of the IC.
* In addition to the components in the upper diagram, it is necessary to insert a capacitor with enough capacity between
VDD and VSS of the IC as near as possible to stabilize the power supply voltage to the IC.
SANYO Semiconductor Co.,Ltd. assumes no responsibility for equipment failures that result from using
products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition
ranges, or other parameters) listed in products specifications of any and all SANYO Semiconductor Co.,Ltd.
products described or contained herein.
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semiconductor products fail or malfunction with some probability. It is possible that these probabilistic failures or
malfunction could give rise to accidents or events that could endanger human lives, trouble that could give rise
to smoke or fire, or accidents that could cause damage to other property. When designing equipment, adopt
safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not
limited to protective circuits and error prevention circuits for safe design, redundant design, and structural
design.
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Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. When designing equipment, refer to the "Delivery Specification" for the
SANYO Semiconductor Co.,Ltd. product that you intend to use.
Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed
for volume production.
Upon using the technical information or products described herein, neither warranty nor license shall be granted
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This catalog provides information as of May, 2007. Specifications and information herein are subject
to change without notice.
PS No.A0728-10/10