SEMTECH EVM737ATF

Edge737
Per-Pin Precision
Measurement Unit
TEST AND MEASUREMENT PRODUCTS
Description
Features
The Edge737 is a precision measurement unit designed
for automatic test equipment and instrumentation.
Manufactured in a wide voltage CMOS process, it is a
monolithic solution for a per pin PMU.
• FV / MI Capability
• FI / MV Capability
• 4 Current Ranges (± 40 mA, ± 1 mA, ± 100 µA,
± 10 µA)
• +7V / –5V I / O Range
• Short Circuit Protection
• Clamps for limiting mode and range select transients
The Edge737 supports two modes of operation: force
current/measure voltage and force voltage/measure
current. The Edge737 can force or measure voltage in
the range of +7V to –5V. In addition, the Edge737 can
force or measure a current of up to 40 mA over four distinct
ranges: ± 40 mA, ± 1 mA, ± 100 µA and ± 10 µA.
Applications
The Edge737 has an on board window comparator that
provides three bits of information: DUT too high, DUT too
low, and DUT fail. There is also a monitor function which
provides a real time analog voltage signal proportional to
either the DUT voltage or current.
• Automatic Test Equipment
- Memory Testers
- VLSI Testers
- Mixed Signal Tester
On board clamps prevent large transient spikes when
changing operating mode or current range. Also, the PMU
will survive a direct short over the legal voltage range.
The Edge737 is designed to be a low power, low cost,
small footprint solution to allow high pin count testers to
support a PMU per pin.
Functional Block Diagram
HIZ
VINP
FORCE
IVIN
MODE SEL
SENSE
I/V MAX
I/V MIN
DISABLE
Comparators
Detector Logic
Voltage Monitor
DUT LTH
PASS/FAIL*
DUT GTL
I/V MONITOR
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Edge737
TEST AND MEASUREMENT PRODUCTS
Pin Description
Pin Name
Pin #
VINP
20
Analog voltage input which forces the output voltage at FORCE (FV/MI mode).
IVIN
21
Analog voltage input which forces the output current at FORCE (FI/MV mode).
FORCE
SENSE
3
2
MODE SEL
10
RS1, RS2
9, 11
I/V MIN
I/V MAX
24
31
Analog input voltages which establish the lower and upper threshold level for the
measurement comparator.
DUT LTH
DUT GTL
32
26
Digital comparator open drain outputs that indicate the DUT measurement is less
than the upper threshold and greater than the lower threshold.
PASS/FAIL*
25
Digital output that indicates whether or not the monitored voltage is between the
comparator thresholds. Logic1 corresponds to a measurement that is between
comparator thresholds.
DISABLE
18
Digital input which places the digital comparator outputs a I/V MONITOR in high
impedance.
HiZ
8
RA, RB,
RC, RD
5, 16
19, 22
I/V MONITOR
12
Analog voltage output that provides a real time monitor of either the measured
voltage or measured current level.
COMP1
COMP2
15
14
External compensation pins that require an external capacitor connected between
the two pins.
VCC
27
Positive analog power supply.
VEE
13, 30
Negative analog power supply.
CA
CB
1
23
CAPI
7
GND
4
Revision 5 / February 20, 2003
Description
Analog output pin which forces current or voltage.
Analog input pin which senses voltage (typically connected to FORCE).
Digital input which determines whether the PMU is forcing voltage or forcing current.
Digital inputs which select one of the four current ranges.
Digital input which places the FORCE output into high impedance.
External resistors corresponding to ranges A through D.
External compensation pins that require an external capacitor connected between
the two pins.
External compensation pins that require an external capacitor connected to ground.
Ground.
2
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Edge737
TEST AND MEASUREMENT PRODUCTS
Pin Description (continued)
CA
PASS/FAIL*
DUT GTL
VCC
N/C
N/C
VEE
I/V MAX
DUT LTH
32 Pin TQFP
(7 mm x 7 mm x 1.4 mm)
(Top View)
25
1
I/V MIN
SENSE
CB
FORCE
RD
GND
IVIN
RA
VINP
N/C
RC
CAPI
Revision 5 / February 20, 2003
COMP1
VEE
I/V MONITOR
RS2
MODE SEL
COMP2
3
N/C
RB
17
9
RS1
HIZ
DISABLE
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Edge737
TEST AND MEASUREMENT PRODUCTS
Circuit Description
Circuit Overview
Comparator Outputs
The Edge737 is a parametric test and measurement unit
that can :
• Force Voltage / Measure Current
• Force Current / Measure Voltage.
The comparator outputs DUT GTL, DUT LTH, and
PASS/FAIL* are open drain outputs. When active (logical
0), they will pull to ground. When disabled (logical 1 or
DISABLE = 1), they require an external pull up resistor to
a positive voltage to achieve a high state.
The Edge737 can force or measure voltage over a +7V to
-5V range, and force or measure current over four distinct
ranges:
• ± 40 mA
• ± 1 mA
• ± 100 µA
• ± 10 µA.
An on board window comparator provides three-bit
measurement range classification. Also, a monitor passes
a real time analog signal which tracks either the DUT’s
current or voltage performance.
Force / Sense
FORCE is an analog output which either forces a current
or forces a voltage, depending on which operating mode
is selected.
The SENSE pin is a high impedance analog input which
measures the DUT voltage input in the FI / MV operating
mode.
FORCE and SENSE are brought out to separate pins to
allow for remote sensing.
Control Inputs
MODE SEL is a digital input which determines whether
the PMU forces voltage or current, when it is not placed in
a high impedance state by the HIZ input (see Table 1).
HIZ
Mode SEL
PMU Operation
1
0
0
X
0
1
High Impedance
FV / MI
FI / MV
I/V MONITOR
I/V MONITOR is a real time analog output which tracks the
sensed parameter. I/V MONITOR functionality is described
in Table 3.
Disable
Mode SEL
I/V Monitor
1
0
0
X
0
1
High Impedance
Measured Current
Measured Voltage
Table 1.
Table 3.
RS1 and RS2 are digital inputs to an analog MUX which
establishes the full scale current range of the PMU. One
of four current ranges can be selected by using RS1 and
RS2 as shown in Table 2.
Rext Nom
RA = 200KΩ
RB = 20KΩ
RC = 2KΩ
RD = 50Ω
RS1
RS2
0
0
1
1
0
1
1
0
I(measured) = I/V MONITOR / (4.0 * REXT).
Current Range
A:
B:
C:
D:
In the FI / MV mode, the output voltage is a 1:1 mapping
of the DUT voltage. In the FV / MI mode, I/V MONITOR
follows the equation:
Using nominal values for the external resistors, I/V
MONITOR of +8.0V corresponds to Imax and –8.0V
corresponds to Imin of the selected current range.
± 10 µA
± 100 µA
± 1 mA
± 40 mA
Table 2.
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Edge737
TEST AND MEASUREMENT PRODUCTS
Circuit Description (continued)
HIZ
HIZ is a digital input which places the FORCE output into a
high impedance state, regardless of the operating mode
(forcing current or voltage.) This function allows the PMU
to be connected directly to the pin electronics without an
isolation relay while NOT adding any leakage current.
The voltage at I/V MONITOR follows the equation:
I(measured) = I/V MONITOR / (4.0 * REXT).
Nominally, the external resistors (RA, RB, RC, and RD)
should be chosen such that Imax * REXT = 2.0V.
DISABLE
Force Current / Measure Voltage Mode
DISABLE is a digital input which places DUT LTH, DUT GTL,
I/V MONITOR, and PASS/FAIL* into high impedance states.
In the FI / MV mode, IVIN is a high input impedance,
analog voltage input that is converted into a current (see
Table 5) using the following relationship:
Force Voltage / Measure Current Mode
FORCE = IVIN / (4.0 * REXT)
In the FV / MI mode, VINP is a high input impedance,
analog voltage input that maps directly to the voltage forced
at the DUT (see Figure 1), where FORCE = VINP.
with positive current is defined as current flowing out of
the PMU.
A current monitor is connected in series with the Op Amp
driving the FORCE voltage. This monitor generates a
voltage that is proportional to the current passing through
it, and its output is brought out to I/V MONITOR. The
monitor’s voltage may also be evaluated using the Window
Comparator whose operation is in accordance with the
FV/MI functional truth table (Table 6).
I/V MAX and I/V MIN are high impedance analog inputs
that establish the upper and lower thresholds for the
window comparator (see Table 4). In the FV / MI mode, a
maximum voltage input corresponds to at least a maximum
current output. Positive current is defined as current
flowing out of the PMU.
I/V MAX
I/V MIN
Comparator
Threshold
+8.0V
0V
–8.0V
> Imax (full scale)
0
< Imin (full scale)
IVIN
Forced Current
+8.0V
0V
–8.0V
Imax (full scale)
0
Imin (full scale)
Table 5.
The resulting DUT voltage is then tested via the SENSE
input by a window comparator, whose functional truth table
is shown in Table 7.
I/V MAX and I/V MIN are high impedance analog inputs
that establish the upper and lower thresholds for the window comparator. In the FI / MV mode, the reference inputs translate 1:1 to SENSE level thresholds.
Table 4.
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SENSE
IVIN
VINP
5KΩ
6
40KΩ
40KΩ
FV*
A*
B*
C*
D*
A
B
C
D
D
Cext
CAPI: Input noise filter capacitor (low pass)
Cext
CB, CA: Current sense resistor compensation
Cext
COMP1, COMP2: Force amplifier compensation
CB
FV
FV*
COMP1
FV*
Cext
–
DRIVER
+
HiZ
FV
COMP2
CAPI
Cext
FV ⇒ FV/FI* = 1
FV* ⇒ FV/FI* = 0
FV* FV
15KΩ FV
FV* FV
D*
Cext
C
C*
B
B*
A
A*
RA
RB
RC
RD
CA
+
INST.
–
Edge737 Functional Schematic
FV
15 KΩ
FV*
5 KΩ
–
4X
+
IV_MIN
IV_MAX
FV*
FV
+
–
+
–
–
+
DISABLE
1
1
1
1
0
0
0
0
70 Ω typ.
DUT_GTL
PASS/FAIL*
DUT_LTH
I/V MONITOR
FORCE
Edge737
TEST AND MEASUREMENT PRODUCTS
Circuit Description (continued)
Figure 1. Edge737 Functional Schematic
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Edge737
TEST AND MEASUREMENT PRODUCTS
Circuit Description (continued)
TEST CONDITION
DISABLE
DUT LTH
DUT GTL
I/V MONITOR
PASS / FAIL*
X
1
Hi Z
Hi Z
Hi Z
I/V MONITOR > I/V MAX
I/V MONITOR < I/V MAX
0
0
0
1
N/A
N/A
I/V MONITOR = Iout * 4.0 * REXT
I/V MONITOR = Iout * 4.0 * REXT
0
N/A
I/V MONITOR > I/V MIN
I/V MONITOR < I/V MIN
0
0
N/A
N/A
1
0
I/V MONITOR = Iout * 4.0 * REXT
I/V MONITOR = Iout * 4.0 * REXT
N/A
0
I/V MONITOR < I/V MAX
and
I/V MONITOR > I/V MIN
0
1
1
I/V MONITOR = Iout * 4.0 * REXT
1
Table 6. FV / MI Truth Table
TEST CONDITION
DISABLE
DUT LTH
DUT GTL
I/V MONITOR
PASS / FAIL*
X
1
Hi Z
Hi Z
Hi Z
SENSE > I/V MAX
SENSE < I/V MAX
0
0
0
1
N/A
N/A
I/V MONITOR = SENSE
I/V MONITOR = SENSE
0
N/A
SENSE > I/V MIN
SENSE < I/V MIN
0
0
N/A
N/A
1
0
I/V MONITOR = SENSE
I/V MONITOR = SENSE
N/A
0
DUT < I/V MAX
and
DUT > I/V MIN
0
1
1
I/V MONITOR = SENSE
1
Table 7. FI / MV Truth Table
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Edge737
TEST AND MEASUREMENT PRODUCTS
Circuit Description (continued)
VOS@IVMON
REXT Selection
CM Linearity
The Edge737 is designed for the voltage drop across RA,
RB, RC, and RD to be ≤ 2V with the maximum current
passing through them. However, these resistor values
can be changed to support different applications.
Increasing the maximum current beyond the nominal range
is not recommended. However, decreasing the maximum
current is allowed.
CM Error = Slope
VCM@FORCE
–5V
7V
Short Circuit Protection
The Edge737 is designed to survive a direct short circuit
to any voltage within the supply rails at the FORCE and
SENSE pins.
Transient Clamps
The Edge737 has on-board clamps to limit the voltage
and current spikes that might result from either changing
the current range or changing the operating mode.
Common Mode Error/Calibration
In order to attain a high degree of accuracy in a typical
ATE application, offset and gain errors are accounted for
through software calibration. When forcing or measuring
a current with the Edge737, an additional source of error,
common mode error, should be accounted for. Common
mode error is a measure of how the common mode
voltage, VCM, at the input of the current sense amplifier
affects the forced or measured current values (see Figure
2). Since this error is created by internal resistors in the
current sense amplifier, it is very linear in nature.
Using the common mode error and common mode linearity
specifications, one can see that with a small number of
calibration steps (see Applications note PMU-A1), the
effect of this error can be significantly reduced.
Figure 2. Graphical Representation of
Common Mode Error
Compensation Capacitors
COMP1 and COMP2 are internal op amp compensation
pins that require a 120 pF capacitor connected between
the two pins.
CAPI is an external noise compensation pin that can be
used as a low pass filter to eliminate noise from the IVIN
and VINP input pins through the connection of an external
capacitor from CAPI to GND. The relationship between
the roll-off frequency of noise filtered (in Hz) to the external
capacitance (in farads) can be seen below:
1
Filter Frequency =
80,000 π X CCAPI
CA and CB are internal compensation pins that require a
120 pF capacitor connected between them.
Power Supply Sequencing
In order to help protect the Edge737 from a latch-up
condition, it is important that VCC ≥ All Input Voltages ≥
VEE, and VCC ≥ GND ≥ VEE at all times.
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Edge737
TEST AND MEASUREMENT PRODUCTS
Application Information
FORCE Pin Output Voltage (Positive Headroom
Requirement)
The maximum positive voltage that can be forced at the
FORCE pin by the Edge 737 in the force voltage/measure
current (FV/MI) mode and the maximum compliance voltage that can appear at the FORCE pin in the force current/measure voltage mode (FI/MV) is a function of the
positive power supply (VCC), device case temperature (Tc),
and selected current range. The plot in Figure 3 depicts
the typical positive voltage that can appear at the FORCE
pin for various power supply combinations across the specified case temperature range of the device. All plots represent the Edge 737 being used with a ± 2V full-scale
swing across the external current sense resistors for each
range.
Edge 737 FORCE Voltage Positive Headroom
8.6
VCC = 13V, VEE = -9.5V, Ranges A, B, C
VCC = 13V, VEE = -9.5V, Range D
8.4
8.2
8.0
7.8
VCC = 12V, VEE = 10V, Ranges A, B, C
7.6
VCC = 12V, VEE = 10V, Range D
7.4
VCC = 11.5V, VEE = -9.5V, Ranges A, B, C
7.2
7.0
VCC = 11.5V, VEE = -9.5V, Range D
6.8
6.6
25
30
35
40
45
50
55
60
65
70
75
TEMPERATURE (C)
Figure 3. Typical Edge737 FORCE Pin Voltage vs. Case Temperature
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Edge737
TEST AND MEASUREMENT PRODUCTS
Application Information (continued)
Required External Components
Choose Rext such that:
Iout (low) = V+ / RPU < 1 mA, V+ ≤ VCC
120 pF
V+
120 pF *
Typical Values
COMP1
COMP2
CAPI
200 KΩ
RPU
RPU
RA
RPU
DUT LTH
20 KΩ
RB
DUT GTL
2 KΩ
RC
PASS/FAIL*
50 Ω
RD
CA
FORCE
120 pF
CB
VCC
VEE
.1 µF
.1 µF
VCC
VEE
* Optional (see Compensation Capacitors Section)
Actual decoupling capacitor values depend
on the actual system environment.
Revision 5 / February 20, 2003
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Edge737
TEST AND MEASUREMENT PRODUCTS
Package Information
32 Pin TQFP Package
7 mm x 7 mm x 1.4 mm
TOP VIEW
4
D
D/2
b
3
e
E
N / 4 TIPS
0.20
C
4
E/2
A–B
D
SEE DETAIL "A"
4X
BOTTOM VIEW
5
7
D1
D1 / 2
E1 / 2
5
7
E1
C
OO
4X
Revision 5 / February 20, 2003
0.20
H
A–B
D
11
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Edge737
TEST AND MEASUREMENT PRODUCTS
Package Information (continued)
DETAIL "A"
DETAIL "B"
0 MIN.
3
e/2
–
0.05
S
0.08 / 0.20 R.
DATUM
PLANE
A2
0.25
–H–
GAUGE PLANE
A1
b
C.08
R. MIN.
0–7
0.20 MIN.
L
1.00 REF.
SECTION C–C
;;;
;;;
9
8 PLACES)
11 / 13
b
A
– H –) 2
0.05
//
0.10 C
ccc
– C –)
0.09 / 0.20
M
SEE DETAIL "B"
Notes:
1.
All dimensions and tolerances conform to ANSI Y14.5-1982.
2.
Datum plane -H- located at mold parting line and coincident with
lead, where lead exits plastic body at bottom of parting line.
3.
Datums A-B and -D- to be determined at centerline between leads
where leads exit plastic body at datum plane -H-.
4.
To be determined at seating plane -C-.
5.
Dimensions D1 and E1 do not include mold protrusion.
6.
“N” is the total # of terminals.
7.
These dimensions to be determined at the datum plane -H-.
8.
Package top dimensions are smaller than bottom dimensions and
top of package will not overhang bottom of package.
9.
Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08 mm total in excess of the b
dimension at maximum material condition. Dambar cannot be
located on the lower radius or the foot.
10. Controlling dimension: millimeter.
11. Maximum allowable die thickness to be assembled in this
package family is 0.30 millimeters.
12. This outline conforms to JEDEC publication 95, registration
MO-136, variations AC, AE, and AF.
12
M C A–B S
D S
WITH LEAD FINISH
0.09 / 0.16
b
Revision 5 / February 20, 2003
ddd
Lead)
Cross Section
1
BASE METAL
JDEC Variation
Dimensions in Millimeters
Sy m
M in
Nom
A
M ax
Not e
C omment s
1.60
P ac k ag e St and Off Heig ht
A1
0.05
0.10
0.15
A ir Gap
A2
1.35
1.40
1.45
P ac k ag e B ody T hic k ness
D
9.00 B SC
4
D1
7.00 B SC
7,8
E
9.00 B SC
4
E1
7.00 B SC
L
0.45
M
0.15
0.60
7,8
P ac k ag e B ody Leng t h
P ac k ag e B ody W idt h
0.765
5
N
32
Lead C ount
e
0.80 B SC
Lead P it c h
b
0.30
0.37
0.45
b1
0.30
0.35
0.40
ccc
0.10
ddd
0.20
9
Lead T hic k ness
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Edge737
TEST AND MEASUREMENT PRODUCTS
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Units
Positive Analog Power Supply (Relative to GND)
VCC
11.5
12
13
V
Negative Analog Power Supply (Relative to GND)
VEE
– 11
– 10
– 9.5
V
VCC – VEE
21
22
22.5
V
Case Temperature
TC
+25
+75
˚C
Junction Temperature
TJ
+125
˚C
Thermal Resistance of Package (Junction to Case)
θJ C
Total Analog Power Supply
14.1
˚ C/W
Production tested @ +12V, –10V for linearity and min/max parametric testing.
Absolute Maximum Ratings
Parameter
Symbol
Min
Positive Power Supply
VCC
Negative Power Supply
Total Power Supply
Max
Units
0
14.0
V
VEE
– 13.0
0
V
VCC – VEE
0
23.0
V
– .5
7.0
V
Digital Inputs
Typ
Storage Temperature
TS
– 55
+150
˚C
Junction Temperature
TJ
– 65
+150
˚C
+260
˚C
Soldering Temperature
Stresses above listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these or any other conditions above those listed in the
operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for
extended period may affect device reliability.
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Edge737
TEST AND MEASUREMENT PRODUCTS
DC Characteristics
Description
Symbol
Min
Typ
Max
Units
ICC
IEE
ICCB
∆ICC
IEEB
∆IEE
3
– 11
3
0
– 55
–3
5
–5
11
–3
11
3
– 42
0
mA
mA
mA
mA
mA
mA
Power Supplies
Power Supply Consumption
Positive Supply (no-load)
Negative Supply (no-load)
Positive Supply Breakdown (Note 1)
Positive Supply Rejection (Note 1)
Negative Supply Breakdown (Note 1)
Negative Supply Rejection (Note 1)
Power Supply Rejection Ratio (Note 2)
VCC/VEE to FORCE
0.1 kHz
1.0 kHz
10 kHz
100 kHz
PSRR
VCC/VEE to I/V MONITOR
0.1 kHz
1.0 kHz
10 kHz
100 kHz (MI mode)
100 kHz (MV mode)
65
60
50
20
dB
dB
dB
dB
65
60
50
1.5
15
dB
dB
dB
dB
dB
Force Voltage / Measure Current Mode
Input Voltage Range @ VINP
Input Bias Current @ VINP
Capacitive Loading Range @ FORCE for Stability
Output Forcing Voltage Range
VINP
IBIAS
CF O R C E
VF O R C E
VEE + 4
– 0.4
0
VEE + 4.5
VCC – 4
0.4
12
VCC – 5.0
V
µA
nF
V
Forcing Voltage Accuracy (@ FORCE)
Offset (VINP = 0V, no load)
Linearity
Gain
VOS
FV INL
FV Gain
– 100
– 0.025
– 0.985
100
0.025
1.015
mV
% FSVR
V/V
IL E A K
– 20
20
nA
– 10
– 100
–1
– 40
10
100
1
40
µA
µA
mA
mA
VOS
MI INL
MI Gain
CM Error
∆CM Error
– 400
– 0.122
3.94
– 10
– 10.5
400
0.122
4.06
10
10.5
mV
% FSCR
V/V
mV/V
mV
IL E A K
– 150
150
nA
12
nF
FORCE/SENSE Combined Leakage Current in
HiZ Mode
Compliance Current Measurement Range
Range A
Range B
Range C
Range D
Current Measurement Accuracy (@ I/V MONITOR)
Offset
Linearity (Note 3)
Gain (Note 4)
Common Mode Error
Common Mode Linearity
I/V MONITOR Output Leakage Current in Disable
Mode
Capacitive Loading Range @ I/V MONITOR
Revision 5 / February 20, 2003
CI / V M O N I T O R
14
1
4
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Edge737
TEST AND MEASUREMENT PRODUCTS
DC Characteristics (continued)
Description
Symbol
Min
IVIN
IBIAS
CFORCE
IFORCE
Typ
Max
Units
–9.0
–0.4
+9.0
0.4
12
V
µA
nF
–10
–100
–1
–40
10
100
1
40
µA
µA
mA
mA
4
0.26
0.35
0.075
0.1
% FSCR
V/V
% FSCR
% FSCR/V
%FSCR
Force Current/Measure Voltage Mode
Input Voltage Range @ IVIN
Input Bias Current @ IVIN
Capacitive Loading Range @ FORCE for Stability
Output Forcing Current
Range A
Range B
Range C
Range D
Forcing Current Accuracy (@ FORCE)
Offset
Gain (Note 5)
Linearity @ FORCE = –5V to 7V
Common Mode Error
Common Mode Linearity
FORCE/SENSE Combined Leakage Current in
HiZ Mode
Compliance Voltage Range
Voltage Measurement Accuracy (@ I/V MONITOR)
Offset
Gain
Linearity (Note 3)
I/V MONITOR Output Leakage Current in Disable
Mode
Capacitive Loading Range @ I/V MONITOR
IOS
FI Gain
FI INL
ICM Error
∆CM Error
–4
0.24
–0.35
–0.075
–0.1
ILEAK
–20
20
nA
VCOMPLIANCE
VEE + 4.5
VCC – 5.0
V
VOS
MV Gain
MV INL
–100
0.985
–0.025
100
1.015
0.025
mV
V/V
% FSVR
ILEAK
–150
150
nA
12
nF
CI/V MONITOR
0.25
1
Comparator
Input Voltage Range (I/V MIN, I/V MAX)
VIN
VEE + 1
VCC – 3
V
Input Offset Voltage
VOS
–100
100
mV
Input Bias Current (I/V MIN, I/V MAX)
IIN
–0.4
0.4
µA
Output Low Level @ IOL = 1 mA (DUT LTH, DUT
GTL, PASS/FAIL*)
VOL
400
mV
Output Leakage in DISABLED Mode
IOH
–1
1
µA
Output Leakage
ILEAK
–0.2
0.2
µA
IIN
–0.2
0.2
µA
DISABLE Input Bias Current
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Edge737
TEST AND MEASUREMENT PRODUCTS
DC Characteristics (continued)
Description
Symbol
Min
Input High Level
VIH
2.4
Input Low Level
VIL
Input Bias Current
IIN
– 0.2
Input High Level (MODE SEL, HIZ)
VIH
2.4
Input Low Level (MODE SEL, HIZ)
VIL
MODE SEL Input Bias Current
IIN
HIZ Input Bias Current
IIN
Typ
Max
Units
Analog MUX (RS1, RS2)
V
0.8
V
0.2
µA
Other Digital Inputs
V
0 .8
V
– 0.2
0.2
µA
–1
50
µA
DC Test Conditions: CAPI = 120 pF connected to GND, CA – CB = 120 pF, COMP1 – COMP2 = 120 pF,
TA = 25˚C unless otherwise noted.
Note 1:
Note 2:
Note 3:
Note 4:
Test Conditions are as follows: VCC = 12 to 13V, VEE = –10V, 40 mA is externally forced into
FORCE pin.
Guaranteed by design and characterization. Not production tested.
Characterized with a ± 10 µA current load at I/V MONITOR.
V/V units derived as follows:
MI Gain =
Note 5:
VIVMON
(IMEASURED x REXT)
V/V units derived as follows:
FI Gain =
IFORCE x REXT
VIVIN
Unit Definitions:
FSCR = Full Scale Current Range
Range A, FSCR = 20 µA
Range B, FSCR = 200 µA
Range C, FSCR = 2 mA
Range D, FSCR = 80 mA
FSVR = Full Scale Voltage Range = 12V nominal (–5V to 7V)
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Edge737
TEST AND MEASUREMENT PRODUCTS
Description
Symbol
Min
Typ
Max
Units
150
120
µs
µs
300
µs
35
µs
400
125
µs
µs
1.5
300
ms
µs
1
450
µs
ns
700
250
µs
µs
2
300
ms
µs
35
µs
700
250
µs
µs
2
350
ms
µs
1
0.45
µs
µs
Force Voltage / Measure Current Mode
FORCE Voltage Settling Time
(100 pF load @ FORCE)
To 0.1% of 10V Step
Range A
Ranges B, C, D
To 0.025% of 10V Step
All Ranges
FORCE Amp Saturation Recovery Time
Measure Current Settling Time
(100 pF load @ I/V MONITOR)
To 0.1% of FSCR
Range A
Ranges B, C, D
To 0.025% of FSCR
Range A
Ranges B, C, D
Disable Time, HiZ Low to High
Enable Time, HiZ High to Low
tsettle
tsat
tsettle
tz
toe
Force Current / Measure Voltage Mode
FORCE Output Current Settling Time
(100 pF load @ FORCE)
To 0.1% of FSCR
Range A
Ranges B, C, D
To 0.025% of FSCR
Range A
Ranges B, C, D
FORCE Amp Saturation Recovery Time
Measure Voltage Settling Time
(100 pF load @ I/V MONITOR)
To 0.1% of 10V Step
Range A
Ranges B, C, C
To 0.025% of 10V Step
Range A
Ranges B, C, D
Disable Time, HiZ Low to High
Enable Time, HiZ High to Low
Revision 5 / February 20, 2003
tsettle
tsat
tsettle
tz
toe
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Edge737
TEST AND MEASUREMENT PRODUCTS
AC Characteristics
Description
Symbol
Min
Typ
Max
Units
tp d
30
µs
Disable Time, DISABLE Low to High
tz
300
ns
Enable Time, DISABLE High to Low
to e
5.5
µs
Disable Time, DISABLE Low to High
tz
350
ns
Enable Time, DISABLE High to Low
to e
40
µs
MODE SEL Propagation Delay
tp d
10
µs
RS0/RS1 Propagation Delay
tp d
1
µs
Comparator
Propagation Delay
I/V MONITOR
Mode/Range Selection
AC Test Conditions: CAPI = 120 pF connected to GND, CA – CB = 120 pF, COMP1 – COMP2 = 120 pF,
TA = 25˚C unless otherwise noted.
Settling times guaranteed by design and characterization (not production tested).
Revision 5 / February 20, 2003
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Edge737
TEST AND MEASUREMENT PRODUCTS
Ordering Information
Model Number
Package
E737ATF
32-Pin TQFP
7 mm x 7 mm
EVM737ATF
Edge737H Evaluation Module
This device is ESD sensitive. Care should be taken when handling and
installing this device to avoid damaging it.
Contact Information
Semtech Corporation
Test and Measurement Division
10021 Willow Creek Rd., San Diego, CA 92131
Phone: (858)695-1808 FAX (858)695-2633
Revision 5 / February 20, 2003
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