EMIF02-USB01F2 2-line IPAD™, EMI filter including ESD protection Features ■ 2-line low-pass filter + ESD protection ■ High efficiency in EMI filtering ■ Lead-free package ■ Very low PCB space occupation: < 2.5 mm2 ■ Very thin package: 0.65 mm ■ High efficiency in ESD suppression (IEC61000-4-2 level 4) ■ High reliability offered by monolithic integration ■ High reduction of parasitic elements through integration and wafer level packaging Flip Chip (8 bumps) Figure 1. Pin configuration (bump side view) 3 2 Pup 1 Vbus Complies with the following standards B DZ ■ IEC 61000-4-2 level 4 – 15 kV (air discharge) – 8 kV (contact discharge) D+ out D+ in C D GND Din A Dout E Application ESD protection and EMI filtering for: ■ Figure 2. Schematic USB port Pup Vbus Description 33 DZ The EMIF02-USB01F2 is a highly integrated array designed to suppress EMI / RFI noise for USB port filtering. The EMIF02-USB01F2 Flip Chip packaging means the package size is equal to the die size. Additionally, this filter includes ESD protection circuitry which prevents damage to the protected device when subjected to ESD surges up to 15 kV. April 2008 1.3K D+ in D+ out GND 33 D- out D- in TM: IPAD is a trademark of STMicroelectronics. Rev 3 1/8 www.st.com 8 Electrical characteristics 1 EMIF02-USB01F2 Electrical characteristics Table 1. Absolute ratings (Tamb = 25 °C) Symbol Tj Parameter Unit 125 °C junction temperature Top Operating temperature range -40 to +85 °C Tstg Storage temperature range -55 to 150 °C Table 2. Electrical characteristics (Tamb = 25 °C) Symbol Parameters VBR Breakdown voltage IRM Leakage current @ VRM VRM Stand-off voltage VCL Clamping voltage Rd Dynamic impedance IPP Peak pulse current RI/O Series resistance between input and output Cline Input capacitance per line Symbol 2/8 Value Test conditions slope: 1/Rd Min Typ Max Unit VBR IR = 1 mA IRM VRM = 3 V Cline @0V 40 R1, R2 Tolerance ± 5 % 33 Ω R3 Tolerance ± 5 % 1.30 kΩ 6 V 0.5 µA 45 pF EMIF02-USB01F2 Figure 3. Electrical characteristics S21 (dB) attenuation measurement Figure 4. Analog crosstalk measurements 0.00 dB -10.00 EMIF02-USB01: filtering response of lines C1/C3 and E1/E3 0.00 dB -5.00 -20.00 -10.00 -30.00 -15.00 -40.00 -20.00 -50.00 -25.00 -60.00 -30.00 -70.00 -35.00 -40.00 -80.00 -45.00 -90.00 -100.0 -50.00 1.0M E1_E3 Figure 5. 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G 3.0G 1.0M 3.0M 10.0M C1_C3 Frequency/Hz 100.0M 300.0M 1.0G 3.0G f/Hz ESD response to IEC61000-4-2 (+15 kV air discharge) on one input V(in) and on one output (Vout) Figure 6. ESD response to IEC61000-4-2 (-15 kV air discharge) on one input V(in) and on one output (Vout) Vin : 10V/d Vin : 5V/d Vout : 10V/d Vout : 5V/d 100ns/d 100ns/d Figure 7. 30.0M Capacitance versus reverse applied voltage (typical) C(pF) 40 35 30 25 20 15 VR(V) 10 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 3/8 Application information 2 EMIF02-USB01F2 Application information Figure 8. Aplac model (resistors, diodes and bumps and ground connections) R_1k3 3.8nH A1, A3, B2, C1, C3, E1, E3 A3 C1 Csub Csub rsub_1k3 D2 Cbump Rsubump I/O bulk 0.15nH rsub_1k3 Lbump D02_usb 100m D2 bulk Rbump bulk 0.15nH cap_33R R_33R 0.23nH C3 Csub rsub_33R Csub rsub_33R D02_Nw D02_usb Rhole Lgnd_D Rsub_D D2 bulk bulk 0.3nH R_33R 0.7nH E1 E3 cap_33R Csub rsub_33R Csub rsub_33R cap_33R bulk Figure 9. Aplac model parameters R_33R 33.9 cap_33R 1.2pF R_1k3 1.3k Cz29pF Rsub_D 100 Csub0.3pF Rsub_33R 15 Rsub_1k3 50 lhole10pH Rhole400m Caphole0.4pF Lgnd_D 150pH Lbump50pH Rbump50m Cbump1.5pF Rsubump150 4/8 Lhole caphole cap_33R Model D02_Nw BV=100 IBV=1m CJO=6.8p M=0.3333 RS=2 VJ=0.6 TT=100n Model D02_usb BV=16 IBV=1m CJO=Cz M=0.3333 RS=2 VJ=0.6 TT=100n EMIF02-USB01F2 3 Ordering information scheme Ordering information scheme Figure 10. Ordering information scheme EMIF yy - xxx zz Fx EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip Chip X = 2: Lead-free, pitch = 500 µm, bump = 315 µm Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 11. Package dimensions 700 ± 50 315 ± 50 650µm ± 65 µm 5 49 ± 5µ m ± 50 1.97mm ± 50µm 50 1.27mm ± 50µm 285 µm 285µm 49 4 5/8 Ordering information EMIF02-USB01F2 Figure 12. Footprint Figure 13. Marking Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) Copper pad Diameter: 250 µm recommended, 300 µm max Solder stencil opening: 330 µm E x x z y ww Solder mask opening recommendation: 340 µm min for 315 µm copper pad diameter Figure 14. Flip Chip tape and reel specification Dot identifying Pin A1 location 3.5 ± 0.1 xxz yww ST E 6/8 1.37 User direction of unreeling Ordering information Table 3. Note: xxz yww 4 ± 0.1 All dimensions in mm 5 ST E xxz yww ST E 8 ± 0.3 2.07 0.73 ± 0.05 1.75 ± 0.1 Ø 1.5 ± 0.1 4 ± 0.1 Ordering information Order code Marking Package Weight Base qty Delivery mode EMIF02-USB01F2 FF Flip Chip 3.35 mg 5000 Tape and reel 7” More information is available in the application notes: AN1235:"Flip Chip: Package description and recommendations for use" AN1751: “EMI filters: Recommendations and measurements” EMIF02-USB01F2 6 Revision history Revision history Table 4. Document revision history Date Revision Changes 26-Oct-2004 1 Initial release. 16-Apr-2007 2 Updated ECOPACK statement. Updated Figure 10, Figure 11 and Figure 14. Reformatted to current standards. 29-Apr-2008 3 Typographical errors corrected. 7/8 EMIF02-USB01F2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8