EMIF03-SIM03F3 3-line IPAD™, EMI filter including ESD protection Features ■ EMI symmetrical (I/O) low-pass filter ■ high efficiency in EMI/ESD protection ■ lead-free package ■ very thin package ■ high reliability offered by monolithic integration ■ high reduction of parasitic elements through integration and wafer level packaging Complies with the following standards ■ ■ ■ Lead-free Flip-Chip package (8 bumps) Figure 1. IEC 61000-4-2 level 4: – ± 15 kV (air discharge) – ± 8 kV (contact discharge) IEC 61000-4-2 level 1: – ± 2 kV (air discharge) – ± 2 kV (contact discharge) Pin configuration (bump side) 3 2 1 RST in RST ext CLK in GND CLK ext B Data in Vcc Data ext C A ETSI 102.221 (configuration FIDI = 97) Applications Where EMI filtering in ESD sensitive equipment is required: ■ mobile phones and communication systems ■ computers, printers and MCU Boards Figure 2. Configuration C2 A3 100 Ω R1 B3 Description 47 Ω A2 B1 R2 C3 100 Ω C1 R3 The EMIF03-SIM03F3 chip is a very low capacitance EMI filter designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. B2 GND This filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up to 15 kV. TM: IPAD is a trademark of STMicroelectronics. October 2010 Doc ID 16798 Rev 2 1/8 www.st.com 8 Electrical characteristics 1 EMIF03-SIM03F3 Electrical characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit Internal pins (A3, B3, C3): ESD discharge IEC 61000-4-2, level 1, air discharge ESD discharge IEC 61000-4-2, level 1, contact discharge External pins (A2, B1, C1, C2): ESD discharge IEC 61000-4-2, level 4, air discharge ESD discharge IEC 61000-4-2, level 4, contact discharge 15 8 Pd Line resistance power dissipation at 70 °C 60 mW Top Operating temperature range - 40 to + 85 °C Tstg Storage temperature range - 55 to 150 °C VPP Figure 3. 2 2 kV Electrical characteristics - definitions I Symbol VBR = IRM = VRM = Cline = Table 2. Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Line capacitance IR IRM IRM IR V VRM VBR Electrical characteristics - values (Tamb = 25 °C) Symbol Test conditions VBR IR = 1 mA IRM VRM = 3 V per line Min. Typ. Max. 14 Unit V 50 200 nA R1, R3 Tolerance ± 20% 80 100 120 Ω R2 Tolerance ± 20% 37.6 47 56.4 Ω 8 10 12 pF Cline 2/8 VBR VRM Vline = 0 V, Vosc = 30 mV, F = 1 MHz (measured under zero light conditions) Doc ID 16798 Rev 2 EMIF03-SIM03F3 Figure 4. Electrical characteristics Attenuation measurement A2 - A3 Figure 5. Attenuation measurement B1 - B3 S21 (dB) S21 (dB) 0.00 0.00 -10.00 -10.00 -11.6 dB @ 900 MHz -14.9 dB @ 900 MHz -20.00 -18.4 dB @ 1.8 GHz -20.00 -23.1 dB @ 1.8 GHz -30.00 -30.00 -40.00 -40.00 F (Hz) F (Hz) -50.00 -50.00 100.0k Figure 6. 0.00 1.0M 10.0M 100.0M 100.0k 1.0G Attenuation measurement C1 - C3 Figure 7. S21 (dB) 0.00 1.0M 10.0M 100.0M 1.0G Analog crosstalk measurement A2 - B3 (30 kHz < F < 6 GHz > 11.8 dB) Crosstalk (dB) -20.00 -10.00 -14.8 dB @ 900 MHz -40.00 -20.00 -22.8 dB @ 1.8 GHz -30.00 -60.00 -40.00 -80.00 F (Hz) -50.00 100.0k Figure 8. 1.0M 10.0M 100.0M F (Hz) -100.00 100.0k 1.0G 1.0M 10.0M 100.0M 1.0G Analog crosstalk measurement A2 - C3 (30 kHz < F < 6 GHz > 13.8 dB) 0.00 Crosstalk (dB) -20.00 -40.00 -60.00 -80.00 F (Hz) -100.00 100.0k 1.0M 10.0M 100.0M Doc ID 16798 Rev 2 1.0G 3/8 Electrical characteristics Figure 9. EMIF03-SIM03F3 Digital crosstalk measurements Figure 10. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one line 20 V/Div 1 V/Div trise (10-90%) = 2.5 ns IN IN C2 20 ns/Div 100 ns/Div 10 V/Div 500 mV/Div OUT 175 mV OUT 20 ns/Div C3 100 ns/Div Figure 11. ESD response to IEC 61000-4-2 (-15 kV air discharge) on one line C2 Figure 12. Line capacitance versus applied voltage 21 10 V/Div C (pF) 18 IN 15 100 ns/Div C3 10 V/Div 12 9 OUT 6 3 100 ns/Div Vr (V) 0 0 4/8 Doc ID 16798 Rev 2 1 2 3 4 EMIF03-SIM03F3 2 Ordering information scheme Ordering information scheme Figure 13. Ordering information scheme EMIF yy - xxx zz Fx EMI filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip Chip x = 3: lead-free, pitch = 400 µm Doc ID 16798 Rev 2 5/8 Package information 3 EMIF03-SIM03F3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 14. Package dimensions 400 µm ± 40 400 µm ± 40 605 µm ± 55 1.14 mm ± 30 µm 255 µm ± 40 170 µm 170 µm 1.14 mm ± 30 µm Figure 15. Footprint Figure 16. Marking Dot, ST logo ECOPACK status xx = marking z = manufacturing location yww = datecode (y = year ww = week) Copper pad Diameter: 220 µm recommended 260 µm maximum Solder mask opening: 300 µm minimum Solder stencil opening : 220 µm recommended x x z y ww Dot identifying Pin A1 location Ø 1.55 ± 0.1 4.0 ± 0.1 2.0 ± 0.05 3.5 ± 0.1 1.24 xxz yww STE xxz yww 1.24 STE xxz yww STE 8.0 ± 0.3 0.20 ± 0.02 4.0 ± 0.1 0.69 ± 0.05 All dimensions in mm 6/8 1.75 ± 0.1 Figure 17. Flip-Chip tape and reel specification User direction of unreeling Doc ID 16798 Rev 2 EMIF03-SIM03F3 4 Ordering information Ordering information Table 3. Ordering information Order code Marking Package Weight Base qty Delivery mode EMIF03-SIM03F3 JH Flip Chip 1.8 mg 5000 Tape and reel 7” Note: More information is available in the application notes: AN2348: “STMicroelectronics 400 micro-metre Flip Chip: package description and recommendation for use” AN1751: “EMI filters: recommendations and measurements” 5 Revision history Table 4. Document revision history Date Revision Changes 03-May-2010 1 Initial release. 12-Oct-2010 2 Updated Figure 2 and value IRM in Table 2. Doc ID 16798 Rev 2 7/8 EMIF03-SIM03F3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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