STMICROELECTRONICS STS8C5H30L_07

STS8C5H30L
N-channel 30V - 0.018 Ω - 8A/P-channel 30V - 0.045 Ω - 5A - SO-8
Low gate charge STripFET™ III MOSFET
General features
Type
VDSS
RDS(on)
ID
STS8C5H30L(N-channel)
30V
<0.022
8A
STS8C5H30L(P-channel)
30V
<0.056
5A
■
Conduction losses reduced
■
Switching losses reduced
■
Low threshold drive
■
Standard outline for easy automated surface
mount assembly
S0-8
SO-8
Description
This Power MOSFET is the latest development of
STMicroelectronics unique "Single Feature
Size™" strip-based process. The resulting
transistor shows extremely high packing density
for low on-resistance, rugged avalanche
characteristics and less critical alignment steps
therefore a remarkable manufacturing
reproducibility.
Internal schematic diagram
Applications
■
Switching application
Order codes
Part number
Marking
Package
Packaging
STS8C5H30L
S8C5H30L
SO-8
Tape & reel
January 2007
Rev 3
1/14
www.st.com
14
Contents
STS8C5H30L
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Electrical characteristics (curves)
............................ 6
3
Test circuit
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2/14
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
STS8C5H30L
1
Electrical ratings
Electrical ratings
Table 1.
Absolute maximum ratings
Symbol
Parameter
Value
N-channel
VDS
Drain-source voltage (vgs = 0)
VGS
Gate- source voltage
Unit
P-channel
30
V
±16
±16
V
ID
Drain current (continuos) at TC = 25°C
single operating
8
4.2
A
ID
Drain current (continuos) at TC = 100°C
single operating
6.4
3.1
A
IDM (1)
Drain current (pulsed)
32
16.8
A
PTOT
Total dissipation at TC = 25°C dual operating
Total dissipation at TC = 25°C single operating
Tstg
Storage temperature
Tj
Operating junction temperature
1.6
2
W
W
-55 to 150
°C
150
°C
1. Pulse width limited by safe operating area
For the P-channel MOSFET actual polarity of voltages and current has to be reversed
Table 2.
Rthj-a
Tl
Thermal data
Thermal resistance junction-ambient single
operating
Thermal resistance junction-ambient dual
operating
62.5
78
°C/W
°C/W
Maximum lead temperature for soldering purpose
300
°C
3/14
Electrical characteristics
2
STS8C5H30L
Electrical characteristics
(TCASE=25°C unless otherwise specified)
Table 3.
On/off states
Symbol
Parameter
Test conditions
V(BR)DSS
Drain-source
Breakdown voltage
ID = 250 µA, VGS = 0
n-ch
p-ch
VDS = Max rating
n-ch
1
µA
VDS=Max rating,
TC=125°C
p-ch
10
µA
±100
±100
nA
nA
1.6
2.5
V
V
0.018
0.045
0.020
0.070
0.022
0.055
0.025
0.075
Ω
Ω
Ω
Ω
Typ.
Max.
Unit
IDSS
Zero gate voltage
Drain current (VGS = 0)
IGSS
Gate-body leakage
current (VDS = 0)
VGS = ±16V
VGS = ±16V
n-ch
p-ch
Gate threshold voltage
VDS = VGS, ID = 250µA
n-ch
p-ch
Static drain-source on
resistance
VGS = 10V, ID = 4A
VGS = 10V, ID = 2.5A
VGS = 4.5V, ID = 4A
VGS = 4.5V, ID = 2.5A
n-ch
p-ch
n-ch
p-ch
VGS(th)
RDS(on)
Table 4.
Typ.
Max.
30
30
1
1
Unit
V
V
Dynamic
Symbol
Parameter
gfs (1)
Forward transconductance
Ciss
Input capacitance
Coss
Output capacitance
Crss
Reverse transfer
capacitance
Qg
Total gate charge
Qgs
Gate-source charge
Qgd
Gate-drain charge
Test conditions
VDS = 15V, ID= 4A
VDS = 15V, ID= 2.5A
VDS = 25V, f = 1 MHz,
VGS = 0
N-channel
VDD=24V ID=8A
VGS=5V
P-channel
VDD = 24V ID = 4A
VGS= 5V
(see Figure 26)
1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5.
4/14
Min.
Min.
n-ch
p-ch
8.5
10
S
S
n-ch
p-ch
857
1350
pF
pF
n-ch
p-ch
147
490
pF
pF
n-ch
p-ch
20
130
pF
pF
n-ch
p-ch
7
12.5
n-ch
p-ch
2.5
5
nC
nC
n-ch
p-ch
2.3
3
nC
nC
10
16
nC
nC
STS8C5H30L
Electrical characteristics
Table 5.
Symbol
td(on)
tr
td(off)
tf
Table 6.
Symbol
Switching times
Parameter
Test conditions
Turn-on delay time
Rise time
N-channel
VDD = 15V, ID = 4A
RG=4.7 Ω, VGS = 4.5V
P-channel
VDD = 15V, ID = 2A
RG=4.7 Ω, VGS = 4.5V
(see Figure 25)
Turn-off delay time
Fall time
N-channel
VDD = 15V, ID = 4A
RG=4.7 Ω, VGS = 4.5V
P-channel
VDD = 15V, ID = 2A
RG=4.7 Ω, VGS = 4.5V
(see Figure 25)
Min.
Typ.
Max. Unit
n-ch
p-ch
12
25
ns
ns
n-ch
p-ch
14.5
35
ns
ns
n-ch
p-ch
23
125
ns
ns
n-ch
p-ch
8
35
ns
ns
Source drain diode
Parameter
Test conditions
Min
Typ.
Max
Unit
ISD
Source-drain current
n-ch
p-ch
8
5
A
A
ISDM (1)
Source-drain current
(pulsed)
n-ch
p-ch
32
20
A
A
VSD (2)
Forward on voltage
ISD = 8A, VGS = 0
ISD = 5A, VGS = 0
n-ch
p-ch
1.5
1.2
V
V
Reverse recovery time
Reverse recovery charge
Reverse recovery current
N-channel
ISD = 8A, di/dt = 100A/µs
VDD=15 V,Tj =150 oC
P-channel
ISD = 5 A, di/dt = 100A/µs
VDD=15 V, Tj =150 oC
(see Figure 27)
n-ch
p-ch
n-ch
p-ch
n-ch
p-ch
trr
Qrr
IRRM
15
45
5.7
36
0.76
1.6
ns
ns
nC
nC
A
A
1. Pulse width limited by safe operating area.
2. Pulsed: Pulse duration = 300 µs, duty cycle 1.5%
5/14
Electrical characteristics
STS8C5H30L
2.1
Electrical characteristics (curves)
Figure 1.
Safe operating area n-ch
Figure 2.
Thermal impedance n-ch
Figure 3.
Output characteristics n-ch
Figure 4.
Transfer characteristics n-ch
Figure 5.
Transconductance n-ch
Figure 6.
Static drain-source on resistance nch
6/14
STS8C5H30L
Electrical characteristics
Figure 7.
Gate charge vs. gate-source voltage Figure 8.
n-ch
Figure 9.
Normalized gate threshold voltage
vs. temperature n-ch
Figure 11. Source-drain diode forward
characteristics n-ch
Capacitance variations n-ch
Figure 10. Normalized on resistance vs.
temperature n-ch
Figure 12. Normalized breakdown voltage vs.
temperature n-ch
7/14
Electrical characteristics
STS8C5H30L
Figure 13. Safe operating area p-ch
Figure 14. Thermal impedance p-ch
Figure 15. Output characteristics p-ch
Figure 16. Transfer characteristics p-ch
Figure 17. Transconductance p-ch
Figure 18. Static drain-source on resistance pch
8/14
STS8C5H30L
Electrical characteristics
Figure 19. Gate charge vs. gate-source voltage Figure 20. Capacitance variations p-ch
p-ch
Figure 21. Normalized gate threshold voltage
vs. temperature p-ch
Figure 22. Normalized on resistance vs.
temperature p-ch
Figure 23. Source-drain diode forward
characteristics p-ch
Figure 24. Normalized breakdown voltage vs.
temperature p-ch
9/14
Test circuit
3
STS8C5H30L
Test circuit
Figure 25. Switching times test circuit for
resistive load
Figure 26. Gate charge test circuit
Figure 27. Test circuit for inductive load
Figure 28. Unclamped Inductive load test
switching and diode recovery times
circuit
Figure 29. Unclamped inductive waveform
10/14
Figure 30. Switching time waveform
STS8C5H30L
4
Package mechanical data
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at : www.st.com
11/14
Package mechanical data
STS8C5H30L
SO-8 MECHANICAL DATA
DIM.
mm.
MIN.
TYP
A
a1
inch
MAX.
TYP.
1.75
0.1
MAX.
0.068
0.25
a2
0.003
0.009
1.65
0.064
a3
0.65
0.85
0.025
0.033
b
0.35
0.48
0.013
0.018
b1
0.19
0.25
0.007
0.010
C
0.25
0.5
0.010
0.019
D
4.8
5.0
0.188
0.196
E
5.8
6.2
0.228
c1
45 (typ.)
1.27
e
e3
3.81
0.150
3.8
4.0
0.14
L
0.4
1.27
0.015
S
0.244
0.050
F
M
12/14
MIN.
0.6
0.157
0.050
0.023
8 (max.)
STS8C5H30L
5
Revision history
Revision history
Table 7.
Revision history
Date
Revision
Changes
17-Sep-2004
1
First revision
31-Oct-2006
2
The document has been reformatted
30-Jan-2007
3
typo mistake on Table 1.
13/14
STS8C5H30L
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2007 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
14/14