STPS0540Z / STPS0560Z ® SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) 0.5 A VRRM 40 / 60V VF (max) 0.40 / 0.50V FEATURES AND BENEFITS ■ ■ ■ Very small conduction losses Negligible switching losses Extremely fast switching DESCRIPTION Single Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters. SOD-123 Packages in SOD-123, these devices are intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. Due to the small size of the package these devices fit GSM and PCMCIA requirements. ABSOLUTE RATINGS (limiting values) Value Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) RMS forward current IF(AV) Average forward current δ=0.5 IFSM Surge non repetitive forward current dV/dt Critical rate of rise of reverse voltage Tstg * : STPS STPS0540Z STPS0560Z Storage temperature range Unit 0540Z 0560Z 40 60 V 2 A Ta= 60°C Ta= 40°C 0.5 A tp=10ms sinusoidal 5.5 A 10000 V/µs - 65 to + 150 °C Tj Maximum operating junction temperature * 150 °C TL Maximum temperature for soldering during 10s 260 °C dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j − a ) January 2002 - Ed : 2B 1/5 STPS0540Z / STPS0560Z THERMAL RESISTANCE Symbol Rth (j-a) Parameter Junction to ambient (*) Value Unit 340 °C/W (*) Mounted on epoxy board. STATIC ELECTRICAL CHARACTERISTICS Value Symbol Parameter Tests conditions STPS0540Z typ. IR * VF ** Reverse leakage current Forward voltage drop Tj=25°C Tj=100°C IF = 0.5 A 5 1 0.50 0.35 IF = 1 A 0.40 0.44 0.55 0.45 0.51 * tp = 5 ms, δ < 2% ** tp = 380 µs, δ < 2% To evaluate the maximum conduction losses use the following equation : STPS0540Z: P = 0.29 x IF(AV) + 0.22 x IF2(RMS) STPS0560Z: P = 0.35 x IF(AV) + 0.3 x IF2(RMS) 2/5 typ. 40 1.5 Tj=100°C Tj=25°C Pulse test : VR = VRRM T =100°C Tj=25°C max. STPS0560Z max. 50 µA 4 mA 0.53 V 0.50 0.66 0.58 Unit 0.65 STPS0540Z / STPS0560Z Fig. 1-1: Average forward power dissipation versus average forward current.(STPS0540Z) Fig. 1-2: Average forward power dissipation versus average forward current.(STPS0560Z) PF(av)(W) PF(av)(W) 0.30 δ = 0.1 δ = 0.05 0.35 δ = 0.2 δ = 0.5 0.25 δ = 0.1 δ = 0.05 0.30 δ = 0.2 δ = 0.5 0.25 0.20 δ=1 δ=1 0.20 0.15 0.15 0.10 0.10 T 0.05 IF(av) (A) 0.00 0.0 0.1 0.2 0.3 δ=tp/T 0.4 T 0.05 IF(av) (A) tp 0.5 0.6 Fig. 2: Average forward current versus ambient temperature (δ = 0.5). 0.00 0.0 0.1 0.2 0.3 δ=tp/T 0.4 tp 0.5 0.6 Fig. 3: Non repetitive surge peak forward current versus overload duration (maximum values). IF(av)(A) IM(A) 0.6 4.0 0.5 3.5 Ta = 25°C STPS0540Z 0.4 3.0 0.3 2.0 0.2 1.5 T 1.0 0.1 0.0 δ=tp/T 0 tp 25 50 75 IM 100 125 t(s) t 0.0 1E-3 δ=0.5 1E-2 1E-1 1E+0 Fig. 5-1: Reverse leakage current versus reverse voltage applied (typical values).(STPS0540Z) IR(mA) Zth(j-a)/Rth(j-a) 5E+1 δ = 0.5 δ = 0.2 1E-1 STPS0560Z 0.5 Tamb(°C) Fig. 4: Relative variation of thermal impedance junction to ambient versus pulse duration (Epoxy printed circuit board FR4 with recommended pad layout). 1E+0 STPS0540Z 2.5 STPS0560Z δ = 0.1 1E+1 Tj=125°C 1E+0 Tj=100°C Tj=70°C 1E-1 1E-2 1E-2 tp(s) 1E-3 1E-3 Tj=25°C T Single pulse 1E-2 1E-1 1E+0 1E-3 δ=tp/T 1E+1 VR(V) tp 1E+2 1E-4 0 5 10 15 20 25 30 35 40 3/5 STPS0540Z / STPS0560Z Fig. 5-2: Reverse leakage current versus reverse voltage applied (typical values).(STPS0560Z) Fig. 6: Reverse leakage current versus junction temperature (typical values). IR(mA) IR[Tj] / IR[Tj=25°C] 5E+1 1E+3 VR=VRRM Tj=125°C 1E+1 1E+0 1E-1 Tj=100°C 1E+2 Tj=70°C 1E+1 Tj=25°C 1E+0 1E-2 1E-3 Tj(°C) VR(V) 1E-4 0 5 10 15 20 25 30 35 40 45 50 55 60 Fig. 7: Junction capacitance versus reverse voltage applied (typical values). 1E-1 0 25 50 75 100 125 Fig. 8-1: Forward voltage drop versus forward current (maximum values).(STPS0540Z) C(pF) IFM(A) 200 5E+0 F=1MHz Tj=25°C 100 STPS0540Z 50 STPS0560Z 1E+0 Tj=100°C Typical values Tj=100°C 1E-1 Tj=25°C 1E-2 20 VR(V) 10 1 2 5 10 20 40 60 Fig. 8-2: Forward voltage drop versus forward current (maximum values).(STPS0560Z) VFM(V) 1E-3 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 Fig. 9: Variation of thermal resistance junction to ambient versus copper surface under each lead (Printed circuit board FR4, e(Cu) = 35µm). IFM(A) Rth(j-a) (°C/W) 5E+0 350 Tj=100°C Typical values 1E+0 P=0.25W 300 Tj=100°C 250 1E-1 Tj=25°C 200 1E-2 150 S(Cu) (mm²) VFM(V) 1E-3 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 4/5 100 0 20 40 60 80 100 STPS0540Z / STPS0560Z PACKAGE MECHANICAL DATA SOD-123 H DIMENSIONS A2 A1 b REF. Millimeters Min. E Max. A A D c G Inches Min. 1.45 Max. 0.057 A1 0 0.1 0 0.004 A2 0.85 1.35 0.033 0.053 b 0.55 Typ. 0.022 Typ. c 0.15 Typ. 0.039 Typ. D 2.55 2.85 0.1 0.112 E 1.4 1.7 0.055 0.067 G 0.25 H 3.55 0.01 3.95 0.14 0.156 FOOTPRINT (in millimeters) 4.45 0.65 0.97 2.51 0.97 MARKING ■ ■ Type Marking Package Weight Base qty Delivery mode STPS0540Z Z54 SOD-123 0.01 g 3000 Tape & reel STPS0560Z Z56 SOD-123 0.01 g 3000 Tape & reel Epoxy meets UL94, V0. Band indicates cathode. Information furnished is believed to be accurate and reliable. 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