STMICROELECTRONICS STPS3L25S

STPS3L25S
®
LOW DROP POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS
IF(AV)
3A
VRRM
25 V
Tj (max)
150°C
VF (max)
0.44 V
FEATURES AND BENEFITS
VERY LOW FORWARD VOLTAGE DROP FOR
LESS POWER DISSIPATION
OPTIMIZED CONDUCTION/REVERSE LOSSES
TRADE-OFF WHICH MEANS THE HIGHEST
EFFICIENCY IN THE APPLICATIONS
HIGH POWER SURFACE MOUNT MINIATURE
PACKAGE
SMC
JEDEC DO-214AB
DESCRIPTION
Single Schottky rectifier suited to Switched Mode
Power Supplies and high frequency DC to DC converters.
Packaged in SMC, this device is especially intended for use as an antiparallel diode on synchronous rectification freewheel MOSFET’s at the
secondary of 3.3V SMPS and DC/DC units.
ABSOLUTE RATINGS (limiting values)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
25
V
IF(RMS)
RMS forward current
10
A
IF(AV)
Average forward current
TL = 115°C δ = 0.5
3
A
IFSM
Surge non repetitive forward current
tp = 10 ms Sinusoidal
75
A
IRRM
Repetitive peak reverse current
tp= 2 µs square F=1kHz
1
A
IRSM
Non repetitive peak reverse current
tp = 100 µs square
1
A
Tstg
Storage temperature range
- 65 to + 150
°C
150
°C
10000
V/µs
Tj
dV/dt
* :
Maximum operating junction temperature *
Critical rate of rise of reverse voltage
dPtot
1
<
thermal runaway condition for a diode on its own heatsink
Rth(j−a)
dTj
June 1999 - Ed: 3A
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STPS3L25S
THERMAL RESISTANCES
Symbol
Parameter
Rth(j-l)
Value
Unit
20
°C/W
Junction to lead
STATIC ELECTRICAL CHARACTERISTICS
Symbol
Tests Conditions
Tests Conditions
IR *
Reverse leakage current
Tj = 25°C
Min.
Typ.
Forward voltage drop
Tj = 25°C
90
µA
30
mA
0.49
V
15
IF = 3 A
Tj = 125°C
Tj = 25°C
Unit
VR = VRRM
Tj = 125°C
VF *
Max.
0.37
0.44
IF = 6 A
0.6
Tj = 125°C
0.5
0.58
* tp = 380 µs, δ < 2%
Pulse test :
To evaluate the maximum conduction losses use the following equation :
P = 0.3 x IF(AV) + 0.047 IF2(RMS)
Fig. 1: Average forward power dissipation versus
average forward current.
Fig. 2: Average forward current versus ambient
temperature (δ=0.5).
PF(av)(W)
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.0
IF(av)(A)
3.5
δ = 0.1
δ = 0.2
δ = 0.05
δ = 0.5
Rth(j-a)=Rth(j-l)
3.0
2.5
δ=1
2.0
Rth(j-a)=90°C/W
1.5
1.0
T
T
0.5
δ=tp/T
IF(av) (A)
0.5
1.0
1.5
2.0
2.5
3.0
δ=tp/T
tp
0.0
3.5
4.0
Fig. 3: Non repetitive surge peak forward current
versus overload duration (maximum values).
0
Tamb(°C)
tp
25
50
75
100
125
150
Fig. 4: Relative variation of thermal impedance
junction to ambient versus pulse duration.
Zth(j-a)/Rth(j-a)
IM(A)
14
1.0
12
0.8
10
8
6
Ta=25°C
0.6
Ta=50°C
0.4
4
δ = 0.2
Ta=100°C
IM
2
t
0.2
T
δ = 0.1
t(s)
δ=0.5
0
1E-3
2/4
δ = 0.5
1E-2
1E-1
1E+0
0.0
1E-2
Single pulse
1E-1
δ=tp/T
tp(s)
1E+0
1E+1
tp
1E+2 5E+2
STPS3L25S
Fig. 5: Reverse leakage current versus reverse
voltage applied (typical values).
Fig. 6: Junction capacitance versus reverse
voltage applied (typical values).
C(pF)
IR(mA)
1E+2
500
F=1MHz
Tj=25°C
Tj=150°C
1E+1
Tj=125°C
Tj=100°C
1E+0
100
1E-1
Tj=25°C
1E-2
1E-3
VR(V)
0
5
10
VR(V)
15
20
25
Fig. 7-1: Forward voltage drop versus forward
current (maximum values, high level).
IFM(A)
50
Typical values
Tj=150°C
Tj=25°C
10
Tj=125°C
Tj=100°C
1
0.0
VFM(V)
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
10
1
2
5
10
20
30
Fig. 7-2: Forward voltage drop versus forward
current (maximum values, low level).
IFM(A)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0.1
0.2
Typical values
Tj=150°C
Tj=125°C
Tj=25°C
Tj=100°C
VFM(V)
0.3
0.4
0.5
0.6
Fig. 8: Thermal resistance junction to ambient
versus copper surface under each lead (Epoxy
printed circuit board FR4, copper thickness:
Rth(j-a) (°C/W)
100
90
80
70
60
50
40
30
S(Cu) (cm²)
20
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
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STPS3L25S
PACKAGE MECHANICAL DATA
SMC
DIMENSIONS
REF.
E1
D
E
A1
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b
2.90
3.2
0.114
0.126
c
0.15
0.41
0.006
0.016
E
7.75
8.15
0.305
0.321
E1
6.60
7.15
0.260
0.281
E2
4.40
4.70
0.173
0.185
D
5.55
6.25
0.218
0.246
L
0.75
1.60
0.030
0.063
A2
C
E2
L
b
FOOT PRINT DIMENSIONS (in millimeters)
3.3
2.0
4.2
2.0
Ordering type
Marking
Package
Weight
Base qty
Delivery mode
STPS3L25S
S23
SMC
0.243g
2500
Tape & reel
Band indicates cathode
Epoxy meets UL94,V0
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
© 1999 STMicroelectronics - Printed in Italy - All rights reserved.
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