STPS2L40U ® LOW DROP POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) 2A VRRM 40 V Tj (max) 150 °C VF (max) 0.34 V FEATURES AND BENEFITS n n n n n VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES LOW FORWARD VOLTAGE DROP SURFACE MOUNT MINIATURE PACKAGE AVALANCHE CAPABILITY SPECIFIED SMB (JEDEC DO-214AA) DESCRIPTION Single chip Schottky rectifiers suited to Switched Mode Power Supplies and high frequency DC to DC converters. Packaged in SMB, this device is especially intended for surface mounting and used in low voltage, high frequency inverters, free wheeling and polarity protection applications. ABSOLUTE RATINGS (limiting values) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 40 V IF(RMS) RMS forward current 8 A IF(AV) Average forward current TL = 130°C δ = 0.5 2 A IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 75 A PARM Repetitive peak avalanche power tp = 1µs 2200 W - 65 to + 150 °C 150 °C 10000 V/µs Tstg Tj dV/dt * : Storage temperature range Tj = 25°C Maximum operating junction temperature * Critical rate of rise of reverse voltage dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j − a ) July 2003 - Ed: 2A 1/5 STPS2L40U THERMAL RESISTANCES Symbol Rth (j-l) Parameter Junction to lead Value Unit 20 °C/W SMB STATIC ELECTRICAL CHARACTERISTICS Symbol Tests Conditions IR * Reverse leakage current Tests Conditions Tj = 25°C Min. Typ. VR = 40 V Tj = 100°C Tj = 125°C VF * Forward voltage drop Tj = 25°C 38 IF = 1 A Tj = 125°C Tj = 25°C 0.25 IF = 2 A Unit 220 µA 20 mA 80 mA 0.39 V 0.28 0.43 Tj = 125°C Tj = 25°C Max. 0.31 IF = 4 A 0.34 0.5 Tj = 125°C 0.39 V 0.45 Pulse test : * tp = 380µs, δ < 2% To evaluate the maximum conduction losses use the following equation : P = 0.22 x IF(AV) + 0.06 IF2(RMS) Fig. 1: Average forward power dissipation versus average forward current. Fig. 2: Average forward current versus ambient temperature (δ=0.5). PF(av)(W) 1.0 IF(av)(A) δ = 0.05 δ = 0.1 δ = 0.2 2.4 δ = 0.5 Rth(j-a)=Rth(j-l) 2.0 0.8 δ=1 1.6 0.6 Rth(j-a)=100°C/W 1.2 0.4 0.8 T T 0.2 0.4 IF(av) (A) δ=tp/T tp 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2/5 0.0 δ=tp/T 0 Tamb(°C) tp 25 50 75 100 125 150 STPS2L40U Fig. 3: Normalized avalanche power derating versus pulse duration. Fig. 4: Normalized avalanche power derating versus junction temperature. PARM(tp) PARM(1µs) 1 1.2 PARM(tp) PARM(25°C) 1 0.1 0.8 0.6 0.4 0.01 0.2 Tj(°C) tp(µs) 0.001 0.01 0.1 1 0 10 100 0 1000 Fig. 5: Non repetitive surge peak forward current versus overload duration (maximum values). 50 75 100 125 150 Fig. 6: Relative variation of thermal impedance junction to ambient versus pulse duration. Zth(j-a)/Rth(j-a) IM(A) 12 1.0 10 0.8 8 0.6 Ta=25°C 6 Ta=50°C 4 2 25 δ = 0.5 0.4 δ = 0.2 Ta=100°C 0.2 IM t 0 1E-3 Single pulse t(s) δ=0.5 1E-2 T δ = 0.1 1E-1 1E+0 Fig. 7: Reverse leakage current versus reverse voltage applied (typical values). IR(mA) 0.0 1E-2 tp(s) 1E-1 1E+0 δ=tp/T 1E+1 1E+2 tp 1E+3 Fig. 8: Junction capacitance versus reverse voltage applied (typical values). C(pF) 1E+2 1000 Tj=125°C F=1MHz Tj=25°C 1E+1 1E+0 100 1E-1 Tj=25°C 1E-2 VR(V) VR(V) 1E-3 0 5 10 15 20 25 30 35 40 10 1 10 100 3/5 STPS1L40A/U Fig. 9-1: Forward voltage drop versus forward current (maximum values, high level). Fig. 9-2: Forward voltage drop versus forward current (maximum values, low level). IFM(A) 10.00 3.0 IFM(A) Tj=125°C 1.00 Tj=125°C 2.5 Tj=125°C (typical values) Tj=125°C (typical values) 2.0 Tj=25°C Tj=25°C 1.5 0.10 1.0 VFM(mV) 0.01 0 50 100 150 200 250 300 350 400 450 500 550 600 650 700 Fig. 10: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness s(Cu) = 35µm) Rth(j-a) (°C/W) 120 100 80 60 40 20 S(Cu) (cm²) 0 0.0 4/5 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.5 VFM(mV) 0.0 0 50 100 150 200 250 300 350 400 450 500 STPS2L40U PACKAGE MECHANICAL DATA SMB DIMENSIONS REF. E1 D E A1 A2 C L b Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.41 0.006 0.016 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 D 3.30 3.95 0.130 0.156 L 0.75 1.60 0.030 0.063 FOOT PRINT DIMENSIONS (in millimeters) 2.3 1.52 n n 2.75 1.52 Ordering type Marking Package Weight Base qty Delivery mode STPS2L40U GD4 SMB 0.107g 2500 Tape & reel BAND INDICATES CATHODE EPOXY MEETS UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. 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