TSB43DA42, TSB43DB42 www.ti.com SLLS560 – FEBRUARY 2007 IEEE 1394a-2000 CONSUMER ELECTRONICS SOLUTION FEATURES • • • • 1394 Features – Integrated 400/200/100 Mbps 2-Port PHY – Compliant to IEEE 1394-1995 and IEEE 1394a-2000 Standards – Supports Bus Manager Functions and Automatic 1394 Self-ID Verification – Separate Asyncchronous Ack FIFOs Decrease the Ack-Tracking Burden on External CPU DTLA Encryption Support for MPEG2-DVB, DSS, and Audio Data (TSB43DA42 Only) – Support for up to Three Encrypted/Decrypted Streams at One Time – Full Ake Performed With Hardware Assist – Secure Method for Loading DTLA Information Using Ex-CPU Interface Audio and Video Interfaces – Three Configurable High-Speed Data Ports for Video Data – Two Ports Configurable as Parallel or Serial – One Port Serial Only – Two Interfaces for Audio Data (Only One Audio Stream Supported at a Time) – 60958 Port – I2S-Style DAC Interface for PCM Data (Two Channel) – Pass-Through Modes for HSDI0 and HSDI1 – Packet Insertion – Two Insertion Buffers per HSDI – PID Filtering (32 PID Filters per HSDI Port) External CPU Interfaces – Motorola 68K-Style 16-Bit Asynchronous Interface (Supports External DMA Only) • • • – SRAM-Like 16-Bit Asynchronous Interface (Supports External DMA Only) – PCI Interface (33 MHz) Compliant to PCI Specification Version 2.2 (Supports PCI Slave and Master Function) Data Buffers – 3x 4K Byte Isochronous Buffers for Audio and Video Data – 2x 2K Byte Asynchronous/Asynchronous Stream Transmit Buffers – 2x 2K Byte Asynchronous/Asynchronous Stream Receive Buffers – 1x 1K Byte Self-ID Buffer – Insertion Buffers for MPEG2 Packet Insertion (DAT, PMT, SIT, and DIT) – Programmable Data/Space Available Indicators for Buffer Flow Control Hardware Packet Formatting for the Following Standards – IEC61883-1 (General) – IEC61883-2 (SD-DVCR) – IEC61883-4 (MPEG2-TS) – IEC61883-6 (Audio and Music) – IEC61883-7 (ITU-R BO.1294 System B) – DSS – Asynchronous Packets – Asynchronous Streams – PHY Packets (Including Self-IDs) Additional Features – JTAG Interface to Support Post-Assembly Scan of Device I/O – Boundary Scan – Unique Binding Method for Protecting Sensitive Off-Chip Data From Ex-CPU Interface Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2007, Texas Instruments Incorporated TSB43DA42, TSB43DB42 www.ti.com SLLS560 – FEBRUARY 2007 DESCRIPTION/ORDERING INFORMATION The TSB43DA42/TSB43DB42 are high-performance consumer electronics 1394 link layer and integrated physical layer devices designed for digitally interfacing advanced audio/video consumer electronics applications. TSB43DA42/DB42 support formatting and transmission of IEC61883 data; including IEC61883-1 (general), IEC61883-2 (SD-DVCR), IEC61883-4 (MPEG2-TS), IEC61883-5 (SDL-DVCR), IEC61883-6 (audio and music), and IEC61883-7 (ITU-R BO.1294 SystemB-DSS). TSB43DA42/DB42 also supports standard 1394 data types, such as asynchronous, asynchronous streams, and PHY packets. The TSB43DA42 version incorporates M6 baseline per the 5C specification to support transmit and receive of up to three MPEG2 or audio formatted transport streams with encryption and decryption. The TSB43DA42 version also includes hardware acceleration for content key generation. The TSB43DB42 version is identical to the TSB43DA42 without implementation of the encryption/decryption features. The TSB43DB42 device allows customers that do not require the encryption/decryption features to incorporate the TSB43DA42 function without becoming DTLA licensees. The TSB43DA42/TSB43DB42 feature an integrated two-port PHY. The PHY operates at 100 Mbps, 200 Mbps, or 400 Mbps. They follow all requirements as stated in the IEEE 1394-1995 and IEEE 1394a-2000 standards. ORDERING INFORMATION TA PACKAGE TOP-SIDE MARKING Reel of 126 TSB43DA42AGHC Reel of 1000 TSB43DA42AGHCR Reel of 126 TSB43DA42GHC Reel of 1000 TSB43DA42GHCR Reel of 126 TSB43DA42AZHC Reel of 1000 TSB43DA42AZHCR LQFP – PGF Tube of 36 TSB43DA42PGF PREVIEW PQFP – PDV Tube of 40 TSB43DA42PDV PREVIEW BGA – GHC –20°C to 85°C BGA – ZHC 2 ORDERABLE PART NUMBER Submit Documentation Feedback TSB43DA42A TSB43DA42 TSB43DA42A TSB43DA42, TSB43DB42 www.ti.com SLLS560 – FEBRUARY 2007 APPLICATION INFORMATION HDTV Application SDRAM M6 Async RX FIFO SPDIF 1394 Bus PHY M6 HSDI TSB43DA42 CPU MPEG2 Transport Stream Audio DAC (2 chnl audio) Speaker Video NTSC/PAL Encoder Display MPEG2 Demux and Decode Digital Audio Output 61937 Ex-CPU or PCI I/F PCI or 68K Bus Graphics Controller Figure 1. TSB43DA42 in HDTV Application In the HDTV application, the TSB43DA42 receives the MPEG2 transport stream, decrypts it using the M6 cipher, and outputs it to the application over the HSDI port. The MPEG2 demux and decode device separates the audio and video streams, decodes them, and outputs the 2-channel audio to an audio DAC for listening and video to an NTSC/PAL encoder for display. The HDTV receives on-screen display (OSD) information from the video source, such as a set top box, using the EIA775 standard. The system processor receives the OSD data through the TSB43DA42 asynchronous receive buffer. The system graphics controller controls the OSD and mixes it with the video data for display. The MPEG2 demux device also outputs the encoded audio in SPDIF format using the IEC61937 standard. This stream is input to the TSB43DA42 using the SPDIF input port. The TSB43DA42 encrypts the stream using the M6 cipher (if necessary) and transmits it over 1394 to an AV/R or other audio device. Submit Documentation Feedback 3 TSB43DA42, TSB43DB42 www.ti.com SLLS560 – FEBRUARY 2007 APPLICATION INFORMATION (continued) STB Application TSB43DA42 M6 M6 1394 Bus PHY MPEG2 Transport Stream HSDI MPEG2 Transport Stream from Satellite or Cable CPU SPDIF SDRAM MPEG2 Demux Digital Audio 61937 Async TX FIFO Ex-CPU or PCI I/F PCI or 68K Bus Graphics Controller Figure 2. TSB43DA42 in STB Application The set top box receives the MPEG2 transport stream from either satellite or cable sources. The MPEG2 demux device splits the audio and video portion of the MPEG2 transport stream. The video portion, including 2-channel audio, is input to the TSB43DA42 HSDI port. The TSB43DA42 performs any PID filtering or packet insertion, encrypts the stream using M6 cipher, and transmits the stream over 1394. The audio portion of the transport stream is packed into SPDIF format by the MPEG2 demux device using the IEC61937 standard. The audio stream is input to the TSB43DA42 audio port, encrypted using M6 cipher if necessary, and transmitted over 1394. The set top box also creates on screen display (OSD) graphics to transmit to the sink device. The system inputs the OSD data to the TSB43DA42 asynchronous transmit FIFO. The TSB43DA42 transmits the OSD using asynchronous packets to the sink device. 4 Submit Documentation Feedback PACKAGE OPTION ADDENDUM www.ti.com 28-Feb-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) TSB43DA42AGHC ACTIVE BGA GHC 196 126 TBD Call TI Level-3-220C-168 HR TSB43DA42AGHCR ACTIVE BGA GHC 196 1000 TBD Call TI Level-3-220C-168 HR TSB43DA42AZHC ACTIVE BGA MI CROSTA R ZHC 196 126 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR TSB43DA42AZHCR ACTIVE BGA MI CROSTA R ZHC 196 1000 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR TSB43DA42GHC ACTIVE BGA GHC 196 126 TBD Call TI Level-3-220C-168 HR TSB43DA42GHCR ACTIVE BGA GHC 196 1000 TBD Call TI Level-3-220C-168 HR TSB43DB42GHC ACTIVE BGA GHC 196 126 TBD Call TI Level-3-220C-168 HR TSB43DB42GHCR ACTIVE BGA GHC 196 1000 TBD Call TI Level-3-220C-168 HR TSB43DB42ZHC ACTIVE BGA MI CROSTA R ZHC 196 126 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR TSB43DB42ZHCR ACTIVE BGA MI CROSTA R ZHC 196 1000 Green (RoHS & no Sb/Br) SNAGCU Level-3-260C-168 HR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. 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