DYNEX DS2101SY

DS2101SY
DS2101SY
Rectifier Diode
Replaces September 2001 version, DS4170-5.0
DS4170-5.1 December 2001
FEATURES
KEY PARAMETERS
■ Double Side Cooling
VRRM 1500V
■ High Surge Capability
IF(AV) 7810A
IFSM
APPLICATIONS
79000A
■ Rectification
■ Freewheel Diode
■ DC Motor Control
■ Power Supplies
■ Welding
■ Battery Chargers
VOLTAGE RATINGS
Type Number
Repetitive Peak
Reverse Voltage
VRRM
V
DS2101SY15
1500
DS2101SY14
1400
DS2101SY13
1300
DS2101SY12
1200
DS2101SY11
1100
DS2101SY10
1000
Lower voltage grades available.
Conditions
VRSM = VRRM + 100V
Outline type code: F
See Package Details for further information.
Fig. 1 Package outline
ORDERING INFORMATION
When ordering, select the required part number shown in the
Voltage Ratings selection table, e.g.:
DS2101SY13
Note: Please use the complete part number when ordering
and quote this number in any future correspondance relating
to your order.
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DS2101SY
CURRENT RATINGS
Tcase = 75oC unless otherwise stated
Symbol
Parameter
Conditions
Max.
Units
7810
A
Double Side Cooled
Half wave resistive load
IF(AV)
Mean forward current
IF(RMS)
RMS value
-
12268
A
Continuous (direct) forward current
-
11091
A
5035
A
IF
Single Side Cooled (Anode side)
IF(AV)
Mean forward current
IF(RMS)
RMS value
-
7909
A
Continuous (direct) forward current
-
6579
A
Conditions
Max.
Units
6630
A
IF
Half wave resistive load
Tcase = 100oC unless otherwise stated
Symbol
Parameter
Double Side Cooled
IF(AV)
Mean forward current
Half wave resistive load, Tcase = 100oC
IF(RMS)
RMS value
Tcase = 100oC
10400
A
Continuous (direct) forward current
Tcase = 100oC
8600
A
IF
Single Side Cooled (Anode side)
IF(AV)
Mean forward current
Half wave resistive load, Tcase = 100oC
4220
A
IF(RMS)
RMS value
Tcase = 100oC
6630
A
Continuous (direct) forward current
Tcase = 100oC
5190
A
IF
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DS2101SY
SURGE RATINGS
Parameter
Symbol
IFSM
I2t
IFSM
I2t
Surge (non-repetitive) forward current
I2t for fusing
Surge (non-repetitive) forward current
Conditions
Max.
Units
10ms half sine; Tcase = 190oC
72.0
kA
VR = 50% VRRM - 1/4 sine
25.9 x 106
A2s
10ms half sine; Tcase =190oC
79.0
kA
VR = 0
31.2 x 106
A2s
I2t for fusing
THERMAL AND MECHANICAL DATA
Min.
Max.
dc
-
0.0095
o
Anode dc
-
0.019
o
Cathode dc
-
0.019
o
C/W
Double side
-
0.002
o
C/W
Single side
-
0.004
o
C/W
On-state (conducting)
-
200
o
Reverse (blocking)
-
190
o
Storage temperature range
–55
190
o
Clamping force
38.0
47.0
Parameter
Symbol
Conditions
Double side cooled
Rth(j-c)
Thermal resistance - junction to case
Units
C/W
C/W
Single side cooled
Rth(c-h)
Tvj
Tstg
-
Thermal resistance - case to heatsink
Clamping force 43.0kN
with mounting compound
C
Virtual junction temperature
C
C
kN
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DS2101SY
CHARACTERISTICS
Symbol
Conditions
Parameter
Min.
Max.
Units
VFM
Forward voltage
At 3000A peak, Tcase = 25oC
-
0.95
V
IRRM
Peak reverse current
At VRRM, Tcase = 190oC
-
100
mA
QS
Total stored charge
IF = 2000A, dIRR/dt = 3A/µs
-
1600
µC
IRM
Peak recovery current
Tcase =175˚C, VR = 100V
-
90
A
VTO
Threshold voltage
At Tvj = 190˚C
-
0.67
V
Slope resistance
At Tvj = 190˚C
-
0.038
mΩ
rT
CURVES
10000
16000
Measured under pulse conditions
8000
Mean power dissipation - (W)
Instantaneous forward current, IF - (A)
12000
6000
Tj = 190˚C
Tj = 25˚C
4000
8000
4000
2000
dc
Half wave
3 phase
6 phase
0
0
0.5
1.0
Instantaneous forward voltage, VF -(V)
1.5
0
0
Fig.2 Maximum (limit) forward characteristics
VFM Equation:VFM = A + Bln (IF) + C.IF+D.√IF
4000
8000
12000
Mean forward current, IF(AV) - (A)
16000
Fig.3 Dissipation curves
Where
A = 0.081707
B = 0.100349
C = 5.72 x 10–5
D = –0.00529
these values are valid for Tj = 125˚C for IF 500A to 16000A
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DS2101SY
100000
IF
175
Conditions:
Tj = 175˚C
VR = 100V
IF = 2000A
QS
I2t = Î2 x t
2
150
dIF/dt
Stored charge, QS - (µC)
10000
125
100
30
75
25
50
I2t
20
25
1000
0.1
1.0
10
Rate of decay of forward current, dIF/dt - (A/µs)
100
15
0
1
10
ms
Fig.4 Total stored charge
1
2 3
5
10
20
I2t value - (A2s x 106)
Peak half sine forward current - (kA)
IRM
10
50
Cycles at 50Hz
Duration
Fig.5 Surge (non-repetitive) forward current vs time
(with 50% VRRM at Tcase 190˚C)
0.1
Thermal impedance - (˚C/W)
Anode side cooled
0.01
Double side cooled
0.001
Conduction
d.c.
Halfwave
3 phase 120˚
6 phase 60˚
0.0001
0.001
0.01
0.1
1
Time - (s)
Effective thermal resistance
Junction to case ˚C/W
Double side
0.0095
0.0105
0.0112
0.0139
10
Single side
0.019
0.020
0.0207
0.0234
100
Fig.7 Maximum (limit) transient thermal impedance junction to case
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DS2101SY
PACKAGE DETAILS
For further package information, please contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
Hole Ø3.6 x 2.0 deep (One in each electrode)
Cathode
37.7
36.0
Ø112.5 max
Ø73 nom
Ø73 nom
Anode
Nominal weight: 1600g
Clamping force: 50kN ±10%
Package outine type code: Y
Note:
1. Package maybe supplied with pins and/or tags.
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DS2101SY
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor,
and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current
capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our
customers.
Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete solution
(PACs).
DEVICE CLAMPS
Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of pre-loaded
clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of ‘T’ 22mm
Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies.
Please refer to our application note on device clamping, AN4839
HEATSINKS
Power Assembly has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance
or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or Customer
Services.
http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
99 Bank Street, Suite 410,
Ottawa, Ontario, Canada, K1P 6B9
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
CUSTOMER SERVICE CENTRES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2001 Publication No. DS4170-5 Issue No. 5.1December 2001
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
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a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
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