DYNEX DSF20060SF

DSF20060SF
DSF20060SF
Fast Recovery Diode
Replaces March 1997 version, DS4218-3.4
DS4219-4.0 January 2000
KEY PARAMETERS
VRRM
6000V
IF(AV)
780A
IFSM
7800A
Qr
1400µC
trr
6.5µs
APPLICATIONS
■ Inverters
■ Choppers
■ Inverse Parallel Diode
■ Freewheel Diode
FEATURES
■ Double Side Cooling
■ High Surge Capability
■ Low Recovery Charge
VOLTAGE RATINGS
Type Number
Repetitive Peak
Reverse Voltage
VRRM
V
DSF20060SF60
DSF20060SF58
DSF20060SF56
DSF20060SF55
6000
5800
5600
5500
Conditions
VRSM = VRRM + 100V
Lower voltage grades available.
Outline type code: CB450.
See Package Details for further information.
CURRENT RATINGS
Symbol
Parameter
Conditions
Max.
Units
Double Side Cooled
IF(AV)
Mean forward current
Half wave resistive load, Tcase = 65oC
620
A
IF(RMS)
RMS value
Tcase = 65oC
960
A
Continuous (direct) forward current
Tcase = 65oC
840
A
IF
Single Side Cooled (Anode side)
IF(AV)
Mean forward current
Half wave resistive load, Tcase = 65oC
412
A
IF(RMS)
RMS value
Tcase = 65oC
645
A
Continuous (direct) forward current
Tcase = 65oC
535
A
IF
1/6
DSF20060SF
SURGE RATINGS
Symbol
IFSM
I2t
IFSM
I2t
Conditions
Parameter
Surge (non-repetitive) forward current
Max.
Units
7.8
kA
300 x 103
A2s
6.4
kA
205 x 103
A2s
10ms half sine; with 0% VRRM, Tj = 125oC
I2t for fusing
Surge (non-repetitive) forward current
10ms half sine; with 50% VRRM, Tj = 125oC
I2t for fusing
THERMAL AND MECHANICAL DATA
Conditions
Parameter
Symbol
Double side cooled
Rth(j-c)
Thermal resistance - junction to case
Min.
Max.
Units
dc
-
0.022
o
Anode dc
-
0.039
o
Cathode dc
-
0.050
o
Double side
-
0.004
o
Single side
-
0.008
o
-
125
o
C/W
C/W
Single side cooled
Rth(c-h)
Thermal resistance - case to heatsink
Clamping force 19.5kN
with mounting compound
C/W
C/W
C/W
Tvj
Virtual junction temperature
Tstg
Storage temperature range
-55
150
o
Clamping force
18.0
22.0
kN
Typ.
Max.
Units
-
On-state (conducting)
C
C
CHARACTERISTICS
Symbol
VFM
Forward voltage
At 1500A peak, Tcase = 25oC
-
3.9
V
IRRM
Peak reverse current
At VRRM, Tcase = 125oC
-
75
mA
-
6.5
µs
trr
Reverse recovery time
Recovered charge (50% chord)
IF = 1000A, diRR/dt = 100A/µs
-
1400
µC
IRM
Reverse recovery current
Tcase = 125oC, VR = 100V
-
450
A
K
Soft factor
1.8
-
-
QRA1
VTO
Threshold voltage
At Tvj = 125oC
-
2.2
V
rT
Slope resistance
At Tvj = 125oC
-
1.24
mΩ
Forward recovery voltage
di/dt = 1000A/µs, Tj = 100oC
-
260
V
VFRM
2/6
Conditions
Parameter
DSF20060SF
DEFINITION OF K FACTOR AND QRA1
QRA1 = 0.5x IRR(t1 + t2)
dIR/dt
t1
k = t1/t2
t2
τ
0.5x IRR
IRR
CURVES
100000
QS = ∫
IF
Conditions:
50µs
0
Tj = 125˚C,
VR = 100V
Reverse recovered charge QS - (µC)
QS
tp = 1ms
dIR/dt
10000
IRR
IF = 2000
IF = 1000
IF = 500
IF = 200
1000
100
IF = 100
1
10
100
Rate of rise of reverse current dIR/dt - (A/µs)
1000
Fig.1 Recovered charge
3/6
DSF20060SF
Reverse recovery current IRR - (A)
1000
Conditions:
IF = 2000A
Tj = 125˚C,
IF = 1000A
VR = 100V
IF = 500A
IF = 200A
IF = 100A
100
10
1
10
100
Rate of rise of reverse current dIR/dt - (A/µs)
1000
Fig.2 Typical reverse recovery current vs rate of rise of reverse current
Thermal Impedance - Junction to case (˚C/W)
0.1
Double side cooled
0.01
0.001
0.001
0.01
0.1
Time - (s)
1.0
Fig.3 Maximum (limit) transient thermal impedance - junction to case - (˚C/W)
4/6
10
DSF20060SF
PACKAGE DETAILS - CB450 (alternative outline F includes gate connection, all other details are the same as CB450).
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
2 holes Ø3.6x2.0 deep (in both electrodes)
Cathode
27.0
25.4
Ø76 max
Ø48 nom
Ø48 nom
Anode
Nominal weight: 500g
Clamping force: 19.6kN ± 10%
Package outline type code: CB450
ASSOCIATED PUBLICATIONS
Title
Application Note
Number
Calculating the junction temperature or power semiconductors
AN4506
Recommendations for clamping power semiconductors
AN4839
Thyristor and diode measurement with a multi-meter
AN4853
Use of V , r on-state characteristic
AN5001
TO
T
5/6
DSF20060SF
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and
current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
solution (PACs).
DEVICE CLAMPS
Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of preloaded clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of ‘T’ 22mm
Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies.
Please refer to our application note on device clamping, AN4839
HEATSINKS
Power Assembly has it’s own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the
performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the
factory.
http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
Unit 7 - 58 Antares Drive,
Nepean, Ontario, Canada K2E 7W6.
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
CUSTOMER SERVICE CENTRES
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50
North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50
Germany Tel: 07351 827723
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2000 Publication No. DS4218-4 Issue No. 4.0 January 2000
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
6/6