RF3315 0 BROADBAND HIGH LINEARITY AMPLIFIER Pb-Free Product Typical Applications • Basestation Applications • WLL, W-CDMA Systems • Cellular and PCS Systems • Final PA for Low-Power Applications Product Description The RF3315 is a high-efficiency GaAs Heterojunction Bipolar Transistor (HBT) amplifier packaged in a low-cost surface-mount package. This amplifier is ideal for use in applications requiring high-linearity and low noise figure over the 300MHz to 3GHz frequency range. The RF3315 operates from a single 5V power supply. 1.04 0.80 0.50 0.30 3.10 2.90 1.60 1.40 4.60 4.40 0.48 0.36 2.60 2.40 2 PL Dimensions in mm. 1.80 1.45 Shaded lead is pin 1. 1.75 1.40 0.53 0.41 0.43 0.38 Optimum Technology Matching® Applied 9 Si BJT GaAs HBT GaAs MESFET Si Bi-CMOS SiGe HBT Si CMOS InGaP/HBT GaN HEMT SiGe Bi-CMOS Package Style: SOT89 Features • 300MHz to 3GHz • +40dBm Output IP3 • 12.5dB Gain at 2.0GHz GND • +23dBm P1dB • 3.0dB Typical Noise Figure at 2.0GHz 4 • Single 5V Power Supply 3 RF OUT 2 GND RF IN 1 Functional Block Diagram Rev A9 050310 Ordering Information RF3315 Broadband High Linearity Amplifier RF3315PCBA-410 Fully Assembled Evaluation Board (2GHz) RF3315PCBA-411 Fully Assembled Evaluation Board (900MHz) RF Micro Devices, Inc. 7628 Thorndike Road Greensboro, NC 27409, USA Tel (336) 664 1233 Fax (336) 664 0454 http://www.rfmd.com 4-557 RF3315 Absolute Maximum Ratings Parameter RF Input Power Device Voltage Device Current Operating Temperature Storage Temperature Parameter Min. Rating Unit +20 -0.5 to +6.0 250 -40 to +85 -40 to +150 dBm V mA °C °C Specification Typ. Max. Caution! ESD sensitive device. RF Micro Devices believes the furnished information is correct and accurate at the time of this printing. However, RF Micro Devices reserves the right to make changes to its products without notice. RF Micro Devices does not assume responsibility for the use of the described product(s). Unit Condition Overall VCC =5V, RFIN =-10dBm, Freq=2.0GHz, with 2GHz application schematic. AC Specifications (2GHz) Frequency Gain (Small Signal) Input Return Loss Output Return Loss Output IP3 Output P1dB Noise Figure 300 11.0 +36 +21 3000 12.5 15 15 +40.0 +23.0 3.0 4.0 MHz dB dB dB dBm dBm dB AC Specifications (900MHz) Frequency Gain (Small Signal) Input Return Loss Output Return Loss Output IP3 Output P1dB Noise Figure VCC =5V, RFIN =-10dBm, Freq=900MHz, with 900MHz application schematic. 300 16 +36 +23 3000 18 20 20 +41 +25 2.5 3.5 MHz dB dB dB dBm dBm dB F1 = 900MHz, F2 =901MHz, PIN =-10dBm ICC =150mA, PDISS =770mW. (See Note.) Thermal ThetaJC Maximum Measured Junction Temperature at DC Bias Conditions Mean Time To Failure F=2GHz F=2GHz F=2GHz F1 = 1.99GHz, F2 =2.00GHz, PIN =-5dBm 88 154 °C/W °C TCASE =+85°C 370 years TCASE =+85°C DC Specifications Device Voltage 4.5 5.0 5.5 V ICC =150mA Operating Current Range 100 150 170 mA VCC =5V Note: The RF3315 must be operated at or below 170mA to ensure the highest possible reliability and electrical performance. 4-558 Rev A9 050310 RF3315 Pin 1 Function RF IN Description Interface Schematic RF input pin. This pin is not internally DC-blocked. A DC blocking capacitor, suitable for the frequency of operation, should be used in most applications. VCC RF IN 2 3 4 Pkg Base GND RF OUT GND GND Rev A9 050310 Ground connection. RF output and bias pin. For biasing, an RF choke is needed. Because DC is present on this pin, a DC blocking capacitor, suitable for the frequency of operation, should be used in most applications. See application schematic for configuration and value. VCC RF OUT Ground connection. Ground connection. 4-559 RF3315 Typical Application Schematic for 2GHz VCC VCC 100 pF + 1 µF 1 µF + 4 + 100 pF + 1 2 3 82 nH RF OUT RF IN 100 pF 1.5 pF 2.2 pF 3.6 nH Evaluation Board Schematic for 2GHz P1 P1-1 VCC VCC C3 + 100 pF + 4 1 VCC1 2 GND 3 GND CON3 1 µF C4 + 1 µF 100 pF + J1 RF IN 4-560 1 50 Ω µstrip C1 100 pF 2 C2 2.2 pF 3 L1 82 nH C3 1.5 pF 50 Ω µstrip J2 RF OUT L2 3.6 nH Rev A9 050310 RF3315 Typical Application Schematic for 900MHz 4 VCC 100 pF 1 2 1 µF + 3 100 nH 4.7 pF 6 pF RF OUT RF IN 8.7 nH 4.7 nH Evaluation Board Schematic for 900MHz 4 P1 P1-1 1 VCC 2 GND 3 GND VCC 1 2 C3 100 pF 3 + C4 1 µF CON3 J1 RF IN C1 4.7 pF L1 4.7 nH Rev A9 050310 L2 100 nH C2 6 pF J2 RF OUT L3 8.7 nH 4-561 RF3315 Evaluation Board Layout for 1.9GHz Board Size 1.195” x 1.000” Board Thickness 0.033”, Board Material FR-4 Note: A small amount of ground inductance is required to achieve datasheet performance. The necessary inductance may be generated by ensuring that no ground vias are placed directly below the footprint of the part. Evaluation Board Layout for 900MHz Board Size 1.195” x 1.000” Board Thickness 0.033”, Board Material FR-4 Note: A small amount of ground inductance is required to achieve datasheet performance. The necessary inductance may be generated by ensuring that no ground vias are placed directly below the footprint of the part. 4-562 Rev A9 050310 RF3315 Gain versus Frequency Across Temperature, 44.0 14.0 43.0 13.0 42.0 12.0 41.0 11.0 40.0 OIP3 (dBm) Gain (dB) OIP3 versus Frequency Across Temperature VCC=5.0V (2GHz Application Frequency) 15.0 10.0 9.0 8.0 VCC=5.0V (2GHz Application Frequency) 39.0 38.0 37.0 7.0 36.0 -40°C 25°C 85°C 6.0 5.0 1750.0 1800.0 1850.0 1900.0 1950.0 2000.0 2050.0 2100.0 2150.0 2200.0 2250.0 34.0 1750.0 1800.0 1850.0 1900.0 1950.0 2000.0 2050.0 2100.0 2150.0 2200.0 2250.0 Frequency (MHz) Frequency (MHz) P1dB versus Frequency Across Temperature Reverse Isolation versus Frequency Across Temp VCC=5.0V (2GHz Application Frequency) 26.0 -40°C 25°C 85°C 35.0 -15.0 25.0 VCC=5.0V (2GHz Application Circuit) -16.0 24.0 -17.0 23.0 -18.0 Isolation (dB) P1dB (dBm) 22.0 21.0 20.0 19.0 -19.0 -20.0 -21.0 -22.0 18.0 -23.0 17.0 -40°C 25°C 85°C 16.0 15.0 1750.0 1800.0 1850.0 1900.0 1950.0 2000.0 2050.0 2100.0 2150.0 2200.0 2250.0 Frequency (MHz) -40°C 25°C 85°C -24.0 -25.0 1750.0 1800.0 1850.0 1900.0 1950.0 2000.0 2050.0 2100.0 2150.0 2200.0 2250.0 Frequency (MHz) Noise Figure versus Frequency Across Temperature 6.0 VCC=5.0V (2GHz Application Circuit) Noise Figure (dB) 5.0 4.0 3.0 2.0 1.0 -40°C 25°C 85°C 0.0 1750.0 1800.0 1850.0 1900.0 1950.0 2000.0 2050.0 2100.0 2150.0 2200.0 2250.0 Frequency (MHz) Rev A9 050310 4-563 RF3315 Input VSWR versus Frequency Across Temperature, VCC=5.0V (2GHz Application Circuit) 2.4 2.2 2.2 2.0 2.0 1.8 1.8 VSWR VSWR Output VSWR versus Frequency Across Temperature, VCC=5.0V (2GHz Application Circuit) 2.4 1.6 1.4 1.6 1.4 -40°C -40°C 25°C 85°C 1.2 25°C 1.2 85°C 1.0 1.0 1750.0 1800.0 1850.0 1900.0 1950.0 2000.0 2050.0 2100.0 2150.0 2200.0 2250.0 1750.0 1800.0 1850.0 1900.0 1950.0 2000.0 2050.0 2100.0 2150.0 2200.0 2250.0 Frequency (MHz) Frequency (MHz) Gain versus Frequency Across Temperature, OIP3 versus Frequency Across Temperature VCC=5.0V (900MHz Application Circuit) 20.0 VCC=5.0V (900MHz Application Circuit) 48.0 19.0 45.0 18.0 42.0 16.0 OIP3 (dBm) Gain (dB) 17.0 15.0 14.0 13.0 39.0 36.0 33.0 12.0 10.0 700.0 -40°C 25°C 85°C 30.0 -40°C 25°C 85°C 11.0 27.0 750.0 800.0 850.0 900.0 950.0 1000.0 700.0 1050.0 750.0 800.0 850.0 900.0 950.0 1000.0 1050.0 Frequency (MHz) Frequency (MHz) P1dB versus Frequency Across Temperature Reverse Isolation versus Frequency Across Temp, VCC=5.0 (900MHz Application Circuit) 28.0 -10.0 VCC=5.0V (900MHz Application Circuit) 27.0 26.0 -15.0 Reverse Isolation (dB) P1dB (dBm) 25.0 24.0 23.0 22.0 21.0 -20.0 -25.0 20.0 -40°C 25°C 85°C 19.0 18.0 700.0 -30.0 750.0 800.0 850.0 900.0 Frequency (MHz) 4-564 -40°C 25°C 85°C 950.0 1000.0 1050.0 700.0 750.0 800.0 850.0 900.0 950.0 1000.0 1050.0 Frequency (MHz) Rev A9 050310 RF3315 Noise Figure versus Frequency Across Temperature Input VSWR versus Frequency Across Temperature VCC=5.0V (900MHz Application Circuit) 7.0 VCC=5.0V (900MHz Application Circuit) 3.5 6.0 3.0 2.5 4.0 VSWR Noise Figure (dB) 5.0 3.0 2.0 2.0 1.5 -40°C 25°C 85°C 1.0 -40°C 25°C 85°C 0.0 1.0 700.0 750.0 800.0 850.0 900.0 950.0 1000.0 1050.0 700.0 750.0 800.0 Frequency (MHz) Output VSWR versus Frequency Across Temperature, 900.0 950.0 1000.0 1050.0 ICC versus VCC Across Temperature VCC=5.0V (900MHz Application Circuit) 3.5 850.0 Frequency (MHz) 200.0 180.0 3.0 160.0 VSWR ICC (mA) 2.5 2.0 140.0 120.0 100.0 1.5 -40°C 25°C 85°C 80.0 -40°C 25°C 85°C 1.0 60.0 700.0 750.0 800.0 850.0 900.0 950.0 1000.0 1050.0 Frequency (MHz) 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VCC (V) MTTF versus Junction Temperature, (60% Confidence Interval) 1000000.0 100000.0 MTTF (Years) 10000.0 1000.0 100.0 10.0 1.0 100.0 125.0 150.0 175.0 200.0 Junction Temperature (°C) Rev A9 050310 4-565 RF3315 0.8 Swp Max 3GHz 2.0 2.0 0.6 0.8 0.6 Swp Max 3GHz 1.0 S22 1.0 S11 0. 4 3.0 0. 4 3 GHz 3.0 4.0 4. 0 5.0 5.0 0.2 0.2 3 GHz 10.0 5.0 4.0 3.0 2.0 1.0 0.8 0.6 300 MHz 0.4 0.2 0 10.0 5.0 4.0 3.0 2.0 1.0 0.8 0.6 0.4 0 300 MHz 10.0 -10.0 -0.2 -10.0 0.2 10.0 -0.2 -5.0 -5.0 -4 . 0 -4. -3 .0 0 .4 -0 .0 4-566 -1.0 Swp Min 0.3GHz -0.8 -0 . 6 -1.0 -0.8 -0 . 6 .0 -2 .0 -2 -3 .4 -0 Swp Min 0.3GHz Rev A9 050310 RF3315 PCB Design Requirements PCB Surface Finish The PCB surface finish used for RFMD’s qualification process is electroless nickel, immersion gold. Typical thickness is 3µinch to 8µinch gold over 180µinch nickel. PCB Land Pattern Recommendation PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and tested for optimized assembly at RFMD; however, it may require some modifications to address company specific assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances. PCB Metal Land Pattern A = 1.27 x 0.86 (mm) Typ. Dimensions in mm. Pin 1 A 3.43 2.79 2.34 1.48 1.02 0.43 A 0.03 0.66 Typ. 1.88 Typ. 5.36 Figure 1. PCB Metal Land Pattern (Top View) Rev A9 050310 4-567 RF3315 PCB Solder Mask Pattern Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be provided in the master data or requested from the PCB fabrication supplier. A = 1.37 x 0.96 (mm) Typ. Dimensions in mm. Pin 1 A 3.48 2.89 2.44 1.48 1.02 0.48 A 0.03 0.72 Typ. 1.88 Typ. 5.46 Figure 2. PCB Solder Mask Pattern (Top View) Thermal Pad and Via Design Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing strategies. The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size on a 0.5mm to 1.2mm grid pattern with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested that the quantity of vias be increased by a 4:1 ratio to achieve similar results. 4-568 Rev A9 050310