SKM 200GB124D Absolute Maximum Ratings Symbol Conditions IGBT 7-8 -< 7!8 ? 7 SEMITRANSTM 3 Low Loss IGBT Modules SKM 200GB124D + 4 02 D BD ? 4 052 6- Characteristics Symbol Conditions IGBT 7-8 Typical Applications $ ( 3 Units 0122 1;2 122 =22 > 12 A2 BBB C 052 015 7 . . 7 6- 1522 7 0;5 0=2 =22 . . 0A52 . .- 0 B +< 7-8 -8 8<. @ 4 15 :2 6 4 0 + -8 !" #$ #$ #$ $ $ % &' ( ) * # ( + , ( -.# & /-" / - " ' $ # 01 12 4 15 :5 6 4 0 Values Inverse diode 7!8 Features 4 15 6- $ ( 7!8 4 7-8 - 4 ) . 7!8 4 2 7-8 4 7-8 ? 4 15 015 6? 4 15 015 67!8 4 05 7 ? 4 15 015 6- 4 15 6- $ ( min. A5 4 052 . 7!8 4 05 7 - - - #-8 ($ 7!8 4 2 7-8 4 15 7 ( 4 0 %G <--HC88H B 4 15 015 6- (( ( 7-- 4 )22 7 - 4 052 . <! 4 <!(( 4 E F ? 4 015 67!8 4 > 05 7 8 8(( typ. max. Units 55 20 00 00 )E :E )5 2= 015 015 : 02E 7 . 7 F 10 1A 1A5 1:5 7 00 0) 2: 05 1 0 12 + + + % 2=5 25 F E5 52 512 52 10 0; I Inverse diode 7+ 4 78- J + 4 052 .D 7!8 4 2 7D ? 4 15 015 6? 4 015 6? 4 015 6+ 4 052 .D ? 4 015 6K 4 .KL 8 7!8 4 7 7 << 1 0: 15 7 00 01 E 7 F . L- E: 0;5 I Thermal characteristics <? <?/ !" / 22; 215 MKN MKN < 22=: MKN 5 5 =15 Mechanical data O ) ) $ = 15 GB 1 14-06-2005 SEN © by SEMIKRON SKM 200GB124D Fig. 1 Typ. output characteristic, inclusive RCC'+ EE' Fig. 2 Rated current vs. temperature IC = f (TC) Fig. 3 Typ. turn-on /-off energy = f (IC) Fig. 4 Typ. turn-on /-off energy = f (RG) Fig. 5 Typ. transfer characteristic Fig. 6 Typ. gate charge characteristic 2 14-06-2005 SEN © by SEMIKRON SKM 200GB124D Fig. 7 Typ. switching times vs. IC Fig. 8 Typ. switching times vs. gate resistor RG Fig. 9 Transient thermal impedance of IGBT Fig. 10 Transient thermal impedance of FWD Zthp(j-c) = f (tp); D = tp/tc = tp*f Zthp(j-c) = f (tp); D = tp/tc = tp*f Fig. 11 CAL diode forward characteristic Fig. 12 Typ. CAL diode peak reverse recovery current 3 14-06-2005 SEN © by SEMIKRON SKM 200GB124D Fig. 13 Typ. CAL diode recovered charge UL Recognized File no. E 63 532 Dimensions in mm !" - / 5) - / 5) This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX. This technical information specifies semiconductor devices but promises no characteristics. No warranty or guarantee expressed or implied is made regarding delivery, performance or suitability. 4 14-06-2005 SEN © by SEMIKRON