CXG1090EN High Power 2 × 4 Antenna Switch MMIC with Integrated Control Logic Description The CXG1090EN is a high power antenna switch MMIC. This IC is suited to connect Tx/Rx to one of 4 antennas in cellular handset such as PDC. The CXG1090EN has the integrated control logic and can be operated with CMOS input. This IC is designed using the Sony's GaAs J-FET process which enable the CXG1090EN to be operated with low voltage. 16 pin VSON (Plastic) Features • Low insertion loss: 0.30dB (Typ.)@900MHz, 0.40dB (Typ.)@1.5GHz • Small package: 16-pin VSON • High power handling: Pl dB: 37dBm • CMOS compatible input control • Low bias voltage: VDD = 3.0V Applications 2 × 4 antenna switch for digital cellular telephones such as PDC handsets Structure GaAs J-FET MMIC Absolute Maximum Ratings • Bias voltage VDD • Control voltage VCTL • Operating temperature Topr • Storage temperature Tstg 7 5 –35 to +85 –65 to +150 V @Ta = 25°C V @Ta = 25°C °C °C Note on Handling GaAs MMICs are ESD sensitive devices. Special handling precautions are required. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. –1– E00222-PS CXG1090EN Block Diagram RF4 (Ant/Ext.1) Pin Configuration F1 9 8 F2 RF5 11 (Rx) RF6 13 (Diversity 1) RF4 F4 6 F3 4 F5 RF3 (Tx) F6 F7 RF2 (Ant/Ext. 2) RF1 (Diversity 2) F8 14 3 RF-GND6 RF-GND1 9 8 RF3 GND 10 7 GND RF5 11 6 RF2 GND 12 5 GND RF6 13 4 RF1 RF-GND6 14 3 RF-GND1 VDD 15 2 CTLC CTLA 16 1 CTLB Recommended Circuit 9 RF4 L1 GND RF5 L1 RF6 L1 RF-GND6 100pF 10 7 11 6 100pF GND 12 5 13 4 VDD 3 15 2 100pF 16 CTLA 1kΩ RF2 L1 GND RF1 100pF 14 L1 GND 100pF 100pF Z6 RF3 8 100pF L1 Z1 100pF RF-GND1 CTLC 1kΩ 1 100pF CTLB 100pF 1kΩ ∗ DC blocking capacitors (CRF) are needed. ∗ Recommended to use bypass capacitors (Cbypass). ∗ Recommended to use control resistors (RCTL), when it is necessary to improve the electrostatic discharge strength (ESD). –2– CXG1090EN Truth Table Control ON F1 F2 F3 F4 F5 F6 F7 F8 L RF3 → RF2 OFF ON OFF ON OFF OFF ON ON L H RF3 → RF4 ON OFF ON OFF OFF OFF ON ON L L L RF5 → RF2 ON OFF ON OFF OFF OFF ON ON L L H RF5 → RF4 OFF ON OFF ON OFF OFF ON ON L H L RF5 → RF6 OFF OFF OFF OFF ON OFF OFF ON L H H RF5 → RF1 OFF OFF OFF OFF OFF ON ON OFF CTLA CTLB CTLC H L H DC Bias Condition Item (Ta = 25°C) Min. Typ. Max. Unit VCTL (H) A to C 2.4 3.6 V VCTL (L) A to C 0 0.8 V 2.8 3.2 V VDD –3– CXG1090EN Electrical Characteristics 1 Item Insertion loss Isolation VSWR ACP (±50kHz) (VCTL (L) = 0V, VCTL (H) = 3V, Ta = 25°C) Frequency Typ. Max. Unit RF3-RF2 889 to 960MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V 0.32 0.55 dB RF3-RF4 889 to 960MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V 0.30 0.55 dB RF5-RF2 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V 0.55 0.85 dB RF5-RF4 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V 0.55 0.85 dB RF5-RF1 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V 0.5 0.8 dB RF5-RF6 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V 0.5 0.8 dB 17 19 dB RF3-RF4 889 to 960MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V 17 21 dB RF5-RF2 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V 17 21 dB RF5-RF4 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V 17 19 dB RF5-RF1 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V 31 38 dB RF5-RF6 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V 24 29 dB Each ON 810 to 960MHz Port RF3-RF2 RF3-RF2 RF3-RF2 Pin = 29.5dBm, VDD = 3.0V∗1 Pin = 29.5dBm, VDD = 2.8V∗1 889 to 960MHz Pin = 29.5dBm, VDD = 3.0V∗1 Pin = 29.5dBm, VDD = 2.8V∗1 889 to 960MHz Pin = 29.5dBm, VDD = 3.0V∗1 Pin = 29.5dBm, VDD = 2.8V∗1 889 to 960MHz Pin = 29.5dBm, VDD = 3.0V∗1 Pin = 29.5dBm, VDD = 2.8V∗1 RF3-RF4 3nd harmonics RF3-RF2 RF3-RF4 1.4 889 to 960MHz RF3-RF4 2nd harmonics –67 –57 dBc –67 –55 dBc –75 –65 dBc –75 –62 dBc –67 –60 dBc –67 –57 dBc –67 –60 dBc –67 –57 dBc 85 150 µA VDD = 3.0V 0.45 1 mA VDD = 2.8V 0.4 0.9 mA 1.0 5.0 µs Control current Bias current Min. RF3-RF2 889 to 960MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V RF3-RF4 ACP (±100kHz) Condition Switching speed ∗1 Input signal: ACP (±50kHz) < –65dBc, APC (±100kHz) < –75dBc, 2nd harmonics < –65dBc, 3rd harmonics < –65dBc –4– CXG1090EN Electrical Characteristics 2 Item Insertion loss Isolation VSWR ACP (±50kHz) (VCTL (L) = 0V, VCTL (H) = 3V, Ta = 25°C) Frequency Typ. Max. Unit RF3-RF2 1429 to 1453MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V 0.40 0.70 dB RF3-RF4 1429 to 1453MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V 0.40 0.70 dB RF5-RF2 1477 to 1501MHz Pin = 7dBm, VDD = 2.8 to 3.0V 0.65 0.95 dB RF5-RF4 1477 to 1501MHz Pin = 7dBm, VDD = 2.8 to 3.0V 0.65 0.95 dB RF5-RF1 1477 to 1501MHz Pin = 7dBm, VDD = 2.8 to 3.0V 0.60 0.90 dB RF5-RF6 1477 to 1501MHz Pin = 7dBm, VDD = 2.8 to 3.0V 0.60 0.90 dB 12 15 dB RF3-RF4 1429 to 1453MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V 15 18 dB RF5-RF2 1477 to 1501MHz Pin = 7dBm, VDD = 2.8 to 3.0V 15 18 dB RF5-RF4 1477 to 1501MHz Pin = 7dBm, VDD = 2.8 to 3.0V 13 16 dB RF5-RF1 1477 to 1501MHz Pin = 7dBm, VDD = 2.8 to 3.0V 35 40 dB RF5-RF6 1477 to 1501MHz Pin = 7dBm, VDD = 2.8 to 3.0V 20 25 dB Each ON 1429 to 1501MHz Port RF3-RF2 RF3-RF2 RF3-RF2 Pin = 29.5dBm, VDD = 3.0V∗1 Pin = 29.5dBm, VDD = 2.8V∗1 1429 to 1453MHz Pin = 29.5dBm, VDD = 3.0V∗1 Pin = 29.5dBm, VDD = 2.8V∗1 1429 to 1453MHz Pin = 29.5dBm, VDD = 3.0V∗1 Pin = 29.5dBm, VDD = 2.8V∗1 1429 to 1453MHz Pin = 29.5dBm, VDD = 3.0V∗1 Pin = 29.5dBm, VDD = 2.8V∗1 RF3-RF4 3nd harmonics RF3-RF2 RF3-RF4 1.4 1429 to 1453MHz RF3-RF4 2nd harmonics –67 –55 dBc –67 –53 dBc –75 –65 dBc –75 –62 dBc –67 –60 dBc –67 –57 dBc –67 –57 dBc –67 –55 dBc 85 150 µA VDD = 3.0V 0.45 1 mA VDD = 2.8V 0.4 0.9 mA 1.0 5.0 µs Control current Bias current Min. RF3-RF2 1429 to 1453MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V RF3-RF4 ACP (±100kHz) Condition Switching speed ∗1 Input signal: ACP (±50kHz) < –65dBc, APC (±100kHz) < –75dBc, 2nd harmonics < –65dBc, 3rd harmonics < –65dBc –5– CXG1090EN Package Outline Unit: mm 16PIN VSON(PLASTIC) 0.9 MAX 0.6 3.5 0.05 S A B 0.4 2x 0.35 ± 0.1 0.2 S B 4x 0.2 S A B 0.03 ± 0.03 0.2 ± 0.01 0.05 M S A-B 0.23 ± 0.02 1.4 0.5 ± 0.2 2.7 2.5 0.35 ± 0.1 S Soldrer Plating 0.13 ± 0.025 + 0.09 0.14 – 0.03 NOTE: 1) The dimensions of the terminal section apply to the ranges of 0.1mm and 0.25mm from the end of a terminal. TERMINAL SECTION PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN LEAD TREATMENT SOLDER PLATING EIAJ CODE LEAD MATERIAL COPPER ALLOY JEDEC CODE PACKAGE MASS 0.02 g SONY CODE VSON-16P-01 –6–