TI UC1836L883B

UC1835 UC1836
UC2835 UC2836
UC3835 UC3836
High Efficiency Regulator Controller
FEATURES
DESCRIPTION
•
Complete Control for a High Current,
Low Dropout, Linear Regulator
•
Fixed 5V or Adjustable Output Voltage
•
Accurate 2.5A Current Limiting with
Foldback
•
Internal Current Sense Resistor
The UC1835/6 families of linear controllers are optimized for the design of low cost, low dropout, linear regulators. Using an external pass
element, dropout voltages of less than 0.5V are readily obtained.
These devices contain a high gain error amplifier, a 250mA output
driver, and a precision reference. In addition, current sense with foldback provides for a 2.5A peak output current dropping to less than
0.5A at short circuit.
•
Remote Sense for Improved Load
Regulation
•
External Shutdown
•
Under-Voltage Lockout and Reverse
Voltage Protection
•
Thermal Shutdown Protection
•
8 Pin Mini-Dip Package
(Surface Mount also Available)
BLOCK DIAGRAM
Note: Pin numbers refer to 8-Pin DIL Package
8/94
These devices are available in fixed, 5V, (UC1835), or adjustable,
(UC1836), versions. In the fixed 5 volt version, the only external parts
required are an external pass element, an output capacitor, and a compensation capacitor. On the adjustable version the output voltage can
be set anywhere from 2.5V to 35V with two external resistors.
Additional features of these devices include under-voltage lockout for
predictable start-up, thermal shutdown and short circuit current limiting
to protect the driver device. On the fixed voltage version, a reverse
voltage comparator minimizes reverse load current in the event of a
negative input to output differential.
UC1835 UC1836
UC2835 UC2836
UC3835 UC3836
ABSOLUTE MAXIMUM RATINGS (Note 1)
Input Supply Voltage (+VIN) . . . . . . . . . . . . . . . . –1.0V to + 40V
Driver Output Current (Sink or Source) . . . . . . . . . . . . . 600mA
Driver Source to Sink Voltage . . . . . . . . . . . . . . . . . . . . . + 40V
Maximum Current Through Sense Resistor. . . . . . . . . . . . . . 4A
VOUT Sense Input Voltage . . . . . . . . . . . . . . . . . . –.3V to + 40V
Power Dissipation at TA = 25°C (Note 2) . . . . . . . . . . . 1000mW
Power Dissipation at TC = 25°C (Note 2) . . . . . . . . . . . 2000mW
Operating Junction Temperature . . . . . . . . . . . -55°C to +150°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . -65°C to +150°C
Lead Temperature (Soldering, 10 Seconds) . . . . . . . . . . 300°C
Note 1: Voltages are referenced to ground, (Pin 3). Currents are
positive into, negative out of, the specified terminals.
Consult Packaging Section of Databook for thermal
considerations and limitations of packages.
CONNECTION DIAGRAMS
DIL-8, SOIC-8 (TOP VIEW)
N or J Package, D Package
PLCC-20, LCC-20
(TOP VIEW)
Q, L Packages
PACKAGE PIN FUNCTION
FUNCTION
PIN
N/C
+VIN
+VIN
N/C
Compensation/
Shutdown
N/C
Ground
N/C
N/C
Driver Source
N/C
VOUT Sense
N/C
N/C
Driver Sink
N/C
Current Limit (-)
N/C
Sense Resistor Out
Sense Resistor Out
SOIC-16 (TOP VIEW)
DW Package
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
ELECTRICAL CHARACTERISTICS: Unless otherwise stated, specifications hold for TA = 0°C to + 70°C for the
UC3835/6, –25°C to + 85°C for the UC2835/6, and –55°C to +125°C for the
UC1835/6, +VIN = 6V, Driver Source= 0V, Driver Sink = 5V, TA = TJ.
PARAMETER
Input Supply
Supply Current
TEST CONDITIONS
+VIN = 6V
+VIN = 40V
+VIN Low to High, VOUT Sense = 0V
UVLO Threshold
Threshold Hysteresis
Reverse Current
+VIN = -1.0V, Driver Sink Open
Regulating Voltage and Error Amplifier (UC1835 Family Only)
Driver Current = 10mA, TJ = 25°C
Regulating Level at VOUT Sense (VREG)
Over Temperature
Line Regulation
+VIN = 5.2V + 35V
Load Regulation
Driver Current = 0 to 250mA
VOUT Sense = 5.0V
Bias Current at VOUT Sense
Error Amp Transconductance
±100µA at Compensation/Shutdown Pin
Maximum Compensation Output Current
Sink or Source, Driver Source Open
2
MIN.
TYP.
MAX. UNITS
3.9
2.75
3.75
4.4
0.1
6.0
4.0
6.0
4.9
0.35
20
mA
mA
V
V
mA
5.0
5.06
5.1
40
25
210
2.0
260
V
V
mV
mV
µA
mS
µA
4.94
4.9
75
0.8
90
15
6.0
125
1.3
200
UC1835 UC1836
UC2835 UC2836
UC3835 UC3836
ELECTRICAL CHARACTERISTICS: Unless otherwise stated, specifications hold for TA = 0°C to + 70°C for the
UC3835/6, –25°C to + 85°C for the UC2835/6, and –55°C to +125°C for the
UC1835/6, +VIN = 6V, Driver Source= 0V, Driver Sink = 5V, TA = TJ.
PARAMETER
TEST CONDITIONS
MIN. TYP.
Regulating Voltage and Error Amplifier (UC1836 Family Only)
Driver Current = 10mA, TJ = 25°C
2.47
2.5
Regulating Level at VOUT Sense (VREG)
Over Temperature
2.45
6.0
Line Regulation
+VIN = 5.2V to 35V
Load Regulation
Driver Current = 0 to 250mA
3.0
VOUT Sense =2.5V
-1.0
-0.2
Bias Current at VOUT Sense
Error Amp Transconductance
±100µA at Compensation/Shutdown Pin
0.8
1.3
Maximum Compensation Output Current
Sink or Source, Driver Source Open
90
200
Driver
Maximum Current
250
500
Saturation Voltage
Driver Current = 250mA, Driver Sink
2.0
Pull-Up Current at Driver Sink
Compensation/Shutdown=0.45V
140
250
Driver Sink Leakage
In UVLO
In Reverse Voltage (UC1835 Family Only)
Thermal Shutdown
165
Foldback Current Limit
2.2
2.5
Current Limit Levels at Sense Resistor Out
VOUT Sense = (0.99) VREG
VOUT Sense = (0.5) VREG
1.3
1.5
0.25
0.4
VOUT Sense = 0V
12
24
Current Limit Amp Tansconductance
±100µA at Compensation/Shutdown,
VOUT Sense = (0.9) VREG
Limiting Voltage at Current Limit (-)
VOUT Sense = (0.9) VREG
80
100
(Note 2)
Volts Below +VIN, TJ = 25°C
Sense Resistor Value (Note 3)
VOUT Sense = (0.9) VREG,
40
IOUT = IA, TJ = 25°C
Note 2: This voltage has a positive temperature coefficient of approximately 3500ppm/°C.
Note 3: This resistance has a positive temperature coefficient of approximately 3500ppm/°C.
The total resistance from Pin 1 to Pin 8 will include an additional 60 to 100mΩ of package resistance.
MAX. UNITS
2.53
2.55
20
15
2.0
260
2.8
300
10
10
mA
V
µA
µA
µA
°C
2.8
1.7
0.55
42
A
A
A
mS
140
mV
APPLICATION AND OPERATION INFORMATION
UC 1835 − Typical configurations for a 2A,
Low Dropout 5V Regulator
UC1836 − Typical Configuration for a 2A,
Low Dropout Adjustable Regulator
Note 4: Suggested Pass devices are TIP 32B. (Dropout Voltage ≤0.75V) or, D45H, (Dropout Voltage ≤0.5V), or equivalents.
3
V
V
mV
mV
µA
mS
µA
mΩ
UC1835 UC1836
UC2835 UC2836
UC3835 UC3836
APPLICATION AND OPERATION INFORMATION (cont.)
UC1835/6 Foldback Current Limiting
UC3835/36 TYPICAL APPLICATIONS
Low Current Application
Typical Output Current vs VIN and VOUT
using the UC3836 internal drive transistor
of the UC3836 internal drive transistor
for PDISS = 0.5W (approx.)
High Current Application
Parallel Pass Transistors
using drive transistor Q2 to increase Q1 base drive
and reduce UC3836 power dissipation
can be added for high current or
high power dissipation applications
EQUATIONS:
R1 = 0.100 V/IOUT (MAX)
R2 = (VOUT - 2.5V/1mA)
R3 = ((VIN - VBE - VSAT)*BETA(min))/IOUT (max)
UNITRODE INTEGRATED CIRCUITS
7 CONTINENTAL BLVD. • MERRIMACK, NH 03054
TEL. (603) 424-2410 • FAX 603-424-3460
4
PACKAGE OPTION ADDENDUM
www.ti.com
5-Sep-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
1
5962-9065002PA
ACTIVE
CDIP
JG
8
UC1835J
OBSOLETE
CDIP
JG
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
(Requires Login)
TBD
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8
TBD
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UC1835J883B
OBSOLETE
CDIP
JG
8
TBD
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UC1835L883B
OBSOLETE
LCCC
FK
20
TBD
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UC1836J
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
1
TBD
A42
N / A for Pkg Type
TBD
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UC1836J883B
ACTIVE
CDIP
JG
8
UC1836L
OBSOLETE
TO/SOT
L
20
UC1836L883B
OBSOLETE
TO/SOT
L
20
UC2835D
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC2835DG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
TBD
TBD
UC2835J
OBSOLETE
CDIP
JG
8
UC2835N
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
UC2835NG4
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
UC2836D
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC2836DG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC2836DW
OBSOLETE
SOIC
DW
16
UC3835N
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
UC3835NG4
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
UC3836D
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC3836DG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC3836DTR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
TBD
Addendum-Page 1
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Samples
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PACKAGE OPTION ADDENDUM
www.ti.com
5-Sep-2011
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
UC3836DTRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC3836N
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
UC3836NG4
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UC1835, UC1836, UC3835, UC3836 :
• Catalog: UC3835, UC3836
• Military: UC1835, UC1836
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
5-Sep-2011
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
UC3836DTR
Package Package Pins
Type Drawing
SOIC
D
8
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2500
330.0
12.4
Pack Materials-Page 1
6.4
B0
(mm)
K0
(mm)
P1
(mm)
5.2
2.1
8.0
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
UC3836DTR
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 2
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