XILINX XC9572XV

0
XC9572XV High-performance
CPLD
R
DS052 (v2.2) August 27, 2001
0
5
Advance Product Specification
Features
Power Estimation
•
•
Power dissipation in CPLDs can vary substantially depending on the system frequency, design application and output
loading. To help reduce power dissipation, each macrocell
in a XC9500XV device may be configured for low-power
mode (from the default high-performance mode). In addition, unused product-terms and macrocells are automatically deactivated by the software to further conserve power.
•
•
•
•
•
For a general estimate of ICC, the following equation may be
used:
ICC (mA) =
MCHP(0.36) + MCLP(0.23) + MC(0.005 mA/MHz) f
Where:
MCHP = Macrocells in high-performance (default) mode
MCLP = Macrocells in low-power mode
MC = Total number of macrocells used
f = Clock frequency (MHz)
This calculation is based on typical operating conditions
using a pattern of 16-bit up/down counters in each Function
Block with no output loading. The actual ICC value varies
with the design application and should be verified during
normal system operation.
Figure 1 shows the above estimation in a graphical form.
90
70
Typical ICC (mA)
•
72 macrocells with 1,600 usable gates
Available in small footprint packages
- 44-pin PLCC (34 user I/O pins)
- 44-pin VQFP (34 user I/O pins)
- 48-pin CSP (38 user I/O pins)
- 100-pin TQFP (72-user I/O pins)
Optimized for high-performance 2.5V systems
- Low power operation
- Multi-voltage operation
Advanced system features
- In-system programmable
- Two separate output banks
- Superior pin-locking and routability with
FastCONNECT II™ switch matrix
- Extra wide 54-input Function Blocks
- Up to 90 product-terms per macrocell with
individual product-term allocation
- Local clock inversion with three global and one
product-term clocks
- Individual output enable per output pin
- Input hysteresis on all user and boundary-scan pin
inputs
- Bus-hold ciruitry on all user pin inputs
- Full IEEE Standard 1149.1 boundary-scan (JTAG)
Fast concurrent programming
Slew rate control on individual outputs
Enhanced data security features
Excellent quality and reliability
- Endurance exceeding 10,000 program/erase
cycles
- 20 year data retention
- ESD protection exceeding 2,000V
50
Hig
h
fo
P er
Low
30
rm a
Pow
nce
er
10
Description
The XC9572XV is a 2.5V CPLD targeted for high-performance, low-voltage applications in leading-edge communications and computing systems. It is comprised of four
54V18 Function Blocks, providing 1,600 usable gates with
propagation delays of 4 ns.
0
50
100
150
Clock Frequency (MHz)
200
DS052_01_012501
Figure 1: Typical ICC vs. Frequency for XC9572XV
© 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS052 (v2.2) August 27, 2001
Advance Product Specification
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1
R
XC9572XV High-performance CPLD
3
JTAG Port
1
JTAG
Controller
In-System Programming Controller
54
Function
Block 1
18
I/O
Macrocells
1 to 18
I/O
FastCONNECT II Switch Matrix
I/O
I/O
I/O
Blocks
I/O
I/O
I/O
54
Function
Block 2
18
Macrocells
1 to 18
54
Function
Block 3
18
Macrocells
1 to 18
I/O
3
I/O/GCK
54
1
I/O/GTS
Function
Block 4
Macrocells
1 to 18
18
I/O/GSR
2
DS052_02_041200
Figure 2: XC9572XV Architecture
Function Block outputs (indicated by the bold line) drive the I/O Blocks directly.
2
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DS052 (v2.2) August 27, 2001
Advance Product Specification
R
XC9572XV High-performance CPLD
Absolute Maximum Ratings
Symbol
Value
Units
Supply voltage relative to GND
–0.5 to 2.7
V
VCCIO
Supply voltage for output drivers
–0.5 to 3.6
V
VIN
Input voltage relative to GND(1)
–0.5 to 3.6
V
VTS
Voltage applied to 3-state output(1)
–0.5 to 3.6
V
TSTG
Storage temperature (ambient)
–65 to +150
oC
TSOL
Maximum soldering temperature (10s @ 1/16 in. = 1.5 mm)
+260
oC
Junction temperature
+150
oC
VCC
TJ
Description
Notes:
1. Maximum DC undershoot below GND must be limited to either 0.5V or 10 mA, whichever is easier to achieve. During transitions, the
device pins may undershoot to –2.0V or overshoot to +3.6V, provided this over- or undershoot lasts less than 10 ns and with the
forcing current being limited to 200 mA.
2. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
Recommended Operation Conditions
Symbol
VCCINT
VCCIO
Parameter
Min
Max
Units
Commercial TA = 0oC to +70oC
2.37
2.62
V
Industrial TA = –40oC to +85oC
2.37
2.62
Supply voltage for output drivers for 3.3V operation
3.13
3.46
V
Supply voltage for output drivers for 2.5V operation
2.37
2.62
V
Supply voltage for output drivers for 1.8V operation
1.71
1.89
V
Supply voltage for internal logic
and input buffers
VIL
Low-level input voltage
0
0.8
V
VIH
High-level input voltage
1.7
3.6
V
VO
Output voltage
0
VCCIO
V
Quality and Reliability Characteristics
Symbol
Parameter
Min
Max
Units
20
-
Years
TDR
Data retention
NPE
Program/Erase cycles (endurance)
10,000
-
Cycles
VESD
Electrostatic Discharge (ESD)
2,000
-
Volts
DS052 (v2.2) August 27, 2001
Advance Product Specification
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XC9572XV High-performance CPLD
DC Characteristics (Over Recommended Operating Conditions)
Symbol
VOH
Parameter
Test Conditions
Min
Max
Units
Output high voltage for 3.3V outputs
IOH = –4.0 mA
2.4
-
V
Output high voltage for 2.5V outputs
IOH = –1.0 mA
2.0
-
V
Output high voltage for 1.8V outputs
IOH = –100 µA
-
V
Output low voltage for 3.3V outputs
IOL = 8.0 mA
90% VCCIO
-
0.4
V
Output low voltage for 2.5V outputs
IOL = 1.0 mA
-
0.4
V
Output low voltage for 1.8V outputs
IOL = 100 µA
-
0.4
V
IIL
Input leakage low current
VCC = 2.62V
VCCIO = 3.6V
VIN = GND or 3.6V
-
10
µA
IIH
Input leakagehigh current
VCC = 2.62V
VCCIO = 3.6V
VIN = GND or 3.6V
-
10
µA
CIN
I/O capacitance
VIN = GND
f = 1.0 MHz
-
10
pF
ICC
Operating Supply Current
(low power mode, active)
VI = GND, No load
f = 1.0 MHz
VOL
14
mA
AC Characteristics
XC9572XV-4
Symbol
Parameter
XC9572XV-5
XC9572XV-7
Min
Max
Min
Max
Min
Max
Units
-
4.0
-
5.0
-
7.5
ns
2.8
-
3.5
-
4.8
-
ns
TPD
I/O to output valid
TSU
I/O setup time before GCK
TH
I/O hold time after GCK
0
-
0
-
0
-
ns
GCK to output valid
-
2.8
-
3.5
-
4.5
ns
Multiple FB internal operating
frequency
-
250.0
-
222.2
-
125.0
MHz
TCO
fSYSTEM
TPSU
I/O setup time before p-term clock
input
0.8
-
1.0
-
1.6
-
ns
TPH
I/O hold time after p-term clock input
2.0
-
2.5
-
3.2
-
ns
P-term clock output valid
-
4.8
-
6.0
-
7.7
ns
TOE
GTS to output valid
-
3.2
-
4.0
-
5.0
ns
TOD
GTS to output disable
-
3.2
-
4.0
-
5.0
ns
TPOE
Product term OE to output enabled
-
5.6
-
7.0
-
9.5
ns
TPOD
Product term OE to output disabled
-
5.6
-
7.0
-
9.5
ns
TAO
GSR to output valid
-
7.9
-
10.0
-
12.0
ns
TPAO
P-term S/R to output valid
-
8.5
-
10.7
-
12.6
ns
TWLH
GCK pulse width (High or Low)
2.0
-
2.2
-
4.0
-
ns
TPLH
P-term clock pulse width (High or Low)
5.0
-
5.0
-
6.5
-
ns
TPCO
Advance Information
Preliminary Information
Notes:
1. Please contact Xilinx for up-to-date information on advance specifications.
4
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DS052 (v2.2) August 27, 2001
Advance Product Specification
R
XC9572XV High-performance CPLD
VTEST
R1
Output Type
Device Output
R2
CL
VCCIO
VTEST
R1
R2
CL
3.3V
3.3V
320Ω
360Ω
35 pF
2.5V
2.5V
250Ω
660Ω
35 pF
1.8V
1.8V
10KΩ
14KΩ
35 pF
DS051_03_0601000
Figure 3: AC Load Circuit
Internal Timing Parameters
XC9572XV-4
Symbol
Parameter
XC9572XV-5
XC9572XV-7
Min
Max
Min
Max
Min
Max
Units
Buffer Delays
TIN
Input buffer delay
-
1.6
-
2.0
-
2.3
ns
TGCK
GCK buffer delay
-
1.0
-
1.2
-
1.5
ns
TGSR
GSR buffer delay
-
1.6
-
2.0
-
3.1
ns
TGTS
GTS buffer delay
-
3.2
-
4.0
-
5.0
ns
TOUT
Output buffer delay
-
1.6
-
2.1
-
2.5
ns
TEN
Output buffer enable/disable delay
-
0
-
0
-
0
ns
Product Term Control Delays
TPTCK
Product term clock delay
-
1.4
-
1.7
-
2.4
ns
TPTSR
Product term set/reset delay
-
0.6
-
0.7
-
1.4
ns
TPTTS
Product term 3-state delay
-
4.0
-
5.0
-
7.2
ns
Internal Register and Combinatorial Delays
TPDI
Combinatorial logic propagation delay
-
0.2
-
0.2
-
1.3
ns
TSUI
Register setup time
1.6
-
2.0
-
2.6
-
ns
THI
Register hold time
1.2
-
1.5
-
2.2
-
ns
TECSU
Register clock enable setup time
1.6
-
2.0
-
2.6
-
ns
TECHO
Register clock enable hold time
1.2
-
1.5
-
2.2
-
ns
TCOI
Register clock to output valid time
-
0.2
-
0.2
-
0.5
ns
TAOI
Register async. S/R to output delay
-
4.7
-
5.9
-
6.4
ns
TRAI
Register async. S/R recover before clock
TLOGI
Internal logic delay
-
0.6
-
0.7
-
1.4
ns
TLOGILP
Internal low power logic delay
-
5.6
-
5.7
-
6.4
ns
-
1.6
-
1.6
-
3.5
ns
4.0
5.0
7.5
ns
Feedback Delays
TF
FastCONNECT II™ feedback delay
Time Adders
TPTA
Incremental product term allocator delay
-
0.6
-
0.7
-
0.8
ns
TPTA2
Adjacent macrocell p-term allocator delay
-
0.2
-
0.3
-
0.3
ns
TSLEW
Slew-rate limited delay
-
3.0
-
3.0
-
4.0
ns
Advance Information
Preliminary Information
Notes:
1. Please contact Xilinx for up-to-date information on advance specifications.
DS052 (v2.2) August 27, 2001
Advance Product Specification
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5
R
XC9572XV High-performance CPLD
XC9572XV I/O Pins
Function MacroBlock
cell
PC44 VQ44 CS48
TQ100
BScan
Order
Function MacroBScan
Block
cell
PC44 VQ44 CS48 TQ100 Order
1
1
-
-
-
16
213
3
1
-
-
-
41
105
1
2
1
39
D7
13
210
3
2
11
5
B5
32
102
1
3
-
-
D4
18
207
3
3
-
-
C4
49
99
1
4
-
-
-
20
204
3
4
-
-
-
50
96
1
5
2
40
D6
14
201
3
5
12
6
A4
35
93
1
6
3
41
C7
15
198
3
6
-
-
-
53
90
1
7
-
-
-
25
195
3
7
-
-
-
54
87
1
8
4
42
C6
17
192
3
8
13
7
B4
37
84
1
9
5(1)
43(1)
B7(1)
22(1)
189
3
9
14
8
A3
42
81
1
10
-
-
-
28
186
3
10
-
-
D3
60
78
1
11
6(1)
44(1)
B6(1)
23(1)
183
3
11
18
12
B2
52
75
1
12
-
-
-
33
180
3
12
-
-
-
61
72
1
13
-
-
-
36
177
3
13
-
-
-
63
69
1
14
7(1)
1(1)
A7(1)
27(1)
174
3
14
19
13
B1
55
66
1
15
8
2
A6
29
171
3
15
20
14
C2
56
63
1
16
-
-
-
39
168
3
16
24
18
D2
64
60
1
17
9
3
C5
30
165
3
17
22
16
C3
58
57
1
18
-
-
-
40
162
3
18
-
-
-
59
54
2
1
-
-
-
87
159
4
1
-
-
-
65
51
2
2
35
29
F4
94
156
4
2
25
19
E1
67
48
2
3
-
-
-
91
153
4
3
-
-
-
71
45
2
4
-
-
-
93
150
4
4
-
-
-
72
42
2
5
36
30
G5
95
147
4
5
26
20
E2
68
39
2
6
37
31
F5
96
144
4
6
-
-
E4
76
36
2
7
-
-
-
3(2)
141
4
7
-
-
-
77
33
2
8
38
32
G6
97
138
4
8
27
21
F1
70
30
2
9
39(1)
33(1)
G7(1)
99(1)
135
4
9
-
-
-
66
27
2
10
-
-
-
1
132
4
10
-
-
-
81
24
2
11
40(1)
34(1)
F6(1)
4(1)
129
4
11
28
22
G1
74
21
2
12
-
-
-
6
126
4
12
-
-
-
82
18
2
13
-
-
-
8
123
4
13
-
-
-
85
15
2
14
42(3)
36(3)
E6(3)
9(3)
120
4
14
29
23
F2
78
12
2
15
43
37
E7
11
117
4
15
33
27
E3
89
9
2
16
-
-
-
10
114
4
16
-
-
-
86
6
2
17
44
38
E5
12
111
4
17
34
28
G4
90
3
2
18
-
-
-
92
108
4
18
-
-
-
79
0
Notes:
1. Global control pin.
2. GTS1 for TQ100
3. GTS1 for PC44, CS48, VQ44
6
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DS052 (v2.2) August 27, 2001
Advance Product Specification
R
XC9572XV High-performance CPLD
XC9572XV Global, JTAG and Power Pins
Pin Type
PC44
VQ44
CS48
TQ100
I/O/GCK1
5
43
B7
22
I/O/GCK2
6
44
B6
23
I/O/GCK3
7
1
A7
27
I/O/GTS1
42
36
E6
3
I/O/GTS2
40
34
F6
4
I/O/GSR
39
33
G7
99
TCK
17
11
A1
48
TDI
15
9
B3
45
TDO
30
24
G2
83
TMS
16
10
A2
47
VCCINT 2.5V
21, 41
15, 35
C1, F7
5, 57, 98
VCCIO 1.8/2.5V/3.3V
32
26
G3
26, 38, 51, 88
GND
10, 23, 31
4, 17, 25
A5, D1, F3
21, 31, 44, 62, 69, 75,
84, 100
No Connects
-
-
-
2, 7, 19, 24, 34, 43,
46, 73, 80
DS052 (v2.2) August 27, 2001
Advance Product Specification
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XC9572XV High-performance CPLD
Ordering Information
Example:
XC9572XV -7 TQ 100 C
Device Type
Temperature Range
Number of Pins
Speed Grade
Package Type
Device Ordering Options
Speed
Package
Temperature
-7
7.5 ns pin-to-pin delay
PC44
44-pin Plastic Lead Chip Carrier (PLCC)
C = Commercial
TA = 0°C to +70°C
-5
5 ns pin-to-pin delay
VQ44
44-pin Very Thin Quad Flat Pack (VQFP)
I = Industrial
TA = –40°C to +85°C
-4
4 ns pin-to-pin delay
CS48
48-ball Chip Scale Package (CSP)
TQ100
100-pin Thin Quad Flat Pack (TQFP)
Component Availability
Pins
44
44
48
100
Type
Plastic PLCC
Plastic VQFP
Plastic CSP
Plastic TQFP
Code
PC44
VQ44
CS48
TQ100
-7
C, I
C, I
C, I
C, I
-5
C
C
C
C
-4
(C)
(C)
-
(C)
XC9572XV
Notes:
1. C = Commercial (TA = 0oC to +70oC); I = Industrial (TA = –40oC to +85oC).
2. ( ) Parenthesis indicate future planned products. Please contact Xilinx for up-to-date information.
Revision History
8
Date
Revision No.
Description
02/01/00
1.1
Initial Xilinx release. Advance information specification.
01/29/01
2.0
Added -4 performance specification and VQ44 pagkage. Deleted VQ64 package.
Updated ICC vs. Frequency Figure 1.
05/15/01
2.1
Updated ICC formula, Recommended Operation Conditions, -4 and -5 AC
Characteristics and Internal Timing Parameters
08/27/01
2.2
Changed VCCIO 3.3V from 3.13 to 3.0 (min), 3.46 to 3.60 (max); DC characteristics: IIL
- added "low" current, IIH - changed to "Input leakage high current"; Internal Timing: -5
TAOI from 6.5 to 5.9.
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DS052 (v2.2) August 27, 2001
Advance Product Specification