3.8x2.0mm DOME LENS SMD CHIP LED LAMP APED3820EC HIGH EFFICIENCY RED Features Description lLOW with Gallium Arsenide Phosphide on Gallium Phosphide l3.8mmx2.0mm SMT LED,3.2mm THICKNESS. POWER CONSUMPTION. lIDEAL FOR BACKLIGHT AND INDICATOR. l VARIOUS l PACKAGE COLORS AND LENS TYPES AVAILABLE. The High Efficiency Red source color devices are made Orange Light Emitting Diode. : 500PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.008") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAB0730 APPROVED : J. Lu REV NO: V.4 CHECKED : Allen Liu DATE: APR/04/2003 DRAWN: D.H.FANG PAGE: 1 OF 4 Selection Guide P ar t N o . Dic e A P E D 3820E C Iv (m c d ) @ 20 m A L en s Ty p e HIGH EFFIC IENC Y RED (GaAsP/GaP) WATER C LEAR Mi n . Ty p . 18 40 Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25°°C Sy m b o l P ar am et er λp e a k Peak Wavelength Hi gh Effi ci ency Red λD D omi nate Wavelength Hi gh Effi ci ency Red ∆λ1/2 D ev i c e Spectral Li ne Half-wi dth Hi gh Effi ci ency Red Ty p . 2θ1/2 60° (H) 35° (V) Un its Tes t C o n d i t i o n s 627 nm I F =20mA 625 nm I F =20mA 45 nm I F =20mA pF VF=0V;f=1MHz 2.5 V I F =20mA 10 uA V R = 5V C C apaci tance Hi gh Effi ci ency Red 15 VF Forward Voltage Hi gh Effi ci ency Red 2.0 IR Reverse C urrent Hi gh Effi ci ency Red Max . V i ew i n g An g le Absolute Maximum Ratings at TA=25°°C P ar am et er H i g h E f f i c i en c y R ed Un its Power di ssi pati on 105 mW Peak Forward C urrent [1] 160 mA D C Forward C urrent 30 Reverse Voltage mA 5 -40°C To +85°C Operati ng/Storage Temperature V Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAB0730 APPROVED : J. Lu REV NO: V.4 CHECKED : Allen Liu DATE: APR/04/2003 DRAWN: D.H.FANG PAGE: 2 OF 4 High Efficiency Red SPEC NO: DSAB0730 APPROVED : J. Lu APED3820EC REV NO: V.4 CHECKED : Allen Liu DATE: APR/04/2003 DRAWN: D.H.FANG PAGE: 3 OF 4 APED3820EC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAB0730 APPROVED : J. Lu REV NO: V.4 CHECKED : Allen Liu DATE: APR/04/2003 DRAWN: D.H.FANG PAGE: 4 OF 4