SEOUL SWAF0J

SPECIFICATION
ITEM
WHITE SIDE VIEW LED
MODEL
SWAF0J
CUSTOMER
Customer
Approved by Approved by Approved by
/
/
/
Supplier
Drawn by
Checked by
Approved by
/
/
/
SEOUL SEMICONDUCTOR CO., LTD.
Rev. 1.00
SWAF0J
Contents
1.
Features
02
2.
Application
02
3.
Absolute Maximum Ratings
03
4.
Electro-Optical Characteristics
03
5.
CIE Chromaticity Diagram
04
6.
Characteristic Diagram
05
7.
Reliability
08
8.
Precautions
09
9.
Soldering Profile
10
10. Outline Dimension
11
11. Packing
12
12. Reel Packing Structure
13
13. History
14
SSC-QP-7-03-44(갑)
1
SEOUL SEMICONDUCTOR CO., LTD.
Rev. 1.00
SWAF0J
1. Features
Package: SMT Solderability
Dimension : 3.2 × 0.87 × 0.32 (mm)
RoHS Compliant, Lead Free
Suitable for Small Applications
Own Patent Reserved
SWAF0J is Very Useful Side View LED in Back Light Unit Application
2. Applications
Flat Backlighting (LCD, Display)
Mobile Phone, Camera, PDA, Notebook
Coupling into Light Guide Panel
AV Systems
SSC-QP-7-03-44(갑)
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SEOUL SEMICONDUCTOR CO., LTD.
Rev. 1.00
SWAF0J
3. Absolute Maximum Ratings
(Ta = 25°C)
Parameter
Symbol
Value
Unit
Power Dissipation
Pd*1
120
mW
IF
30
mA
IFM*2
100
mA
V
Forward Current
Peak Forward Current
*1
*2
Reverse Voltage
VR
5
Operating Temperature
Topr
-30 ~ +85
°
Storage Temperature
Tstg
-40 ~ +100
°
Junction Temperature
Tj
125
°
C
C
C
Care is to be taken that Power Dissipation does not exceed the Absolute Maximum Rating of the product.
IFM conditions : Pulse width TW ≤ 0.1ms, Duty ratio ≤ 1/10
4. Electro-Optical Characteristics
Item
(Ta = 25°C)
Symbol
Condition
Rank Y
Forward Voltage*
Rank Z
VF
IF = 20 mA
Rank A
Reverse Current
IR
VR = 5 V
Rank J0
Luminous Intensity*1
Rank J1
Rank J2
IV
IF = 20 mA
Rank J3
Viewing Angle
2θ1/2
*2
Rank b
Color Coordinates
*3
Rank e
Rank f
Min
Typ
Max
2.7
-
3.0
3.0
-
3.3
3.3
-
3.7
-
-
50
1000
-
1100
1100
-
1200
1200
-
1300
1300
-
1400
IF = 20 mA
120
0.264
-
0.296
y
0.248
-
0.295
0.287
-
0.311
0.276
-
0.315
x
0.307
-
0.330
y
0.294
-
0.339
y
IF = 20 mA
V
µA
mcd
˚
x
x
Unit
*1 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package.
Luminous Intensity Measurement allowance is ±10%.
*2 θ1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity.
*3 Measurement Uncertainty of the Color Coordinates is ±0.01
*
Note : All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at
20mA within the maximum ratings shown above.
All measurements were made under the standardized environment of Seoul Semiconductor.
SSC-QP-7-03-44(갑)
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SEOUL SEMICONDUCTOR CO., LTD.
Rev. 1.00
SWAF0J
5. CIE Chromaticity Diagram
0.9
0.7
y Coord.
0.6
0.5
0.4
0.3
0.2
0.34
0.32
y Coord.
0.8
0.36
520
515 525530
535
540
510
545
550
555
505
560
565
570
500
575
580
585
590
495
595
600
610
620
490
630
830
0.0
0.0
480
475
470
460
0.1
0.30
e
0.28
b
0.26
485
0.1
f
0.24
0.2
0.3
0.4
0.5
0.6
0.7
0.22
0.24
0.8
0.26
0.28
x Coor d.
0.30
0.32
0.34
0.36
x Coor d.
Luminous Intensity
Ranking by Color Coordinates
Ranking by Luminous Intensity
*
RANK
Min
Max
J0
1000
1100
J1
1100
1200
J2
1200
1300
J3
1300
1400
b
e
f
√
√
√
√
√
√
√
√
√
Unit
mcd
The Checked ranks are available
Color Rank
(IF = 20 mA, Ta = 25°C)
b
e
f
x
y
x
y
x
y
0.264
0.280
0.296
0.287
0.267
0.248
0.276
0.295
0.296
0.311
0.307
0.287
0.276
0.294
0.315
0.295
0.311
0.330
0.330
0.307
0.294
0.318
0.339
0.315
SSC-QP-7-03-44(갑)
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SEOUL SEMICONDUCTOR CO., LTD.
Rev. 1.00
SWAF0J
6. Characteristic Diagram
Forward Current vs. Forward Voltage
Intensity vs. Forward Current
1800
Ta = 25 C
O
Ta = 25 C
O
Intensity [mcd]
Forward Current [mA]
1600
10
1400
1200
1000
800
600
400
1
200
0
2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4
5
10
15
20
25
30
35
Forward Current [mA]
Forward Voltage [ V ]
Forward Current vs. Ambient Temperature
Radiation Diagram
30
1.0
x axis
y axis
Ta = 25 C
O
25
20
Intensity
Forward current [mA]
0
15
0.5
10
y
5
0
-30 -15
x
0.0
0
-100 -80 -60 -40 -20
15 30 45 60 75 90
20
40
60
80 100
o
Theta [ ]
o
Ambient temperature [ C]
SSC-QP-7-03-44(갑)
0
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SEOUL SEMICONDUCTOR CO., LTD.
Rev. 1.00
SWAF0J
Color Coordinate vs. Forward Current
Spectrum
0.283
Ta = 25 C
O
30 mA
O
Ta = 25 C
IF = 20 mA
Intensity [%]
y Coord.
0.282
0.281
1 mA
0.280
0.279
0.288
0.289
0.290
0.291
0.292
0.293
400
Forward Voltage vs. Ambient Temperature
700
800
0.29
IF = 20 mA
IF = 20 mA
1.04
o
0.28
1.02
y Coord.
O
600
Color Coordinate vs. Ambient Temperature
1.06
VF / VF [25 C]
500
Wavelength [nm]
x Coord.
1.00
25 C
o
-30 C
0.27
0.98
0.96
0.26
0.94
-45 -30 -15
0
15 30
45 60
75
90
0.27
o
Ambient Temperature [ C]
SSC-QP-7-03-44(갑)
o
85 C
0.28
0.29
x Coord.
6
SEOUL SEMICONDUCTOR CO., LTD.
Rev. 1.00
SWAF0J
Relative Luminosity vs. Ambient Temperature
Allowable Forward Current vs. Duty Ratio
120
Allowable Forward Current [mA]
1.1
o
Iv / Iv [25 C]
1.2
1.0
0.9
0.8
0.7
-30 -15 0 15 30 45 60 75
90
o
Ambient Temperature [ C]
SSC-QP-7-03-44(갑)
Ta = 25 C
O
100
80
60
40
20
1
10
100
Duty Ratio [%]
7
SEOUL SEMICONDUCTOR CO., LTD.
Rev. 1.00
SWAF0J
7. Reliability
(1) TEST ITEMS AND RESULTS
TEST ITEM
Test conditions
Note
Number of
Damaged
Reference
EIAJ ED-4701
100 101
EIAJ ED-4701
100 101
EIAJ ED-4701
300 307
Life Test 1
Ta = 25°C; IF = 20 mA
1000 hrs.
0/20
Life Test 2
Ta = 25°C; IF = 30 mA
500 hrs.
0/20
-30°C ~ 85°C
20 cycle
0/50
High Temperature Life Test
Ta = 85°C; IF = 5 mA
1000 hrs.
0/20
-
Low Temperature Life Test
Ta = - 30°C; IF = 20 mA
1000 hrs.
0/20
-
High Temperature Storage
Ta = 100°C
1000 hrs.
0/50
Low Temperature Storage
Ta = - 40°C
1000 hrs.
0/50
Ta = 60°C; RH = 90%, IF = 20 mA
500 hrs.
0/20
Ta = 85°C; RH = 85%
1000 hrs.
0/50
2 times
0/50
1 time
over 95%
0/50
100 cycle
0/50
10 cycle
0/50
Thermal Shock
(30 min) (30 min)
High Humidity Heat Life Test*1
Humidity Heat Load
Resistance to Soldering Heat
Solder ability (Reflow Soldering)
°
Tsld = 260 C, 10 sec
Pre treatment; 30°C, 70%, 168 hr
Tsld = 215±5°C, 3 sec
(Lead Solder)
- 40°C ~ 25°C ~ 100°C ~ 25°C
Temperature Cycle
(30 min)
Moisture Resistance Cycle
(5 min)
(30 min)
(5 min)
25°C ~ 65°C ~ - 10°C
RH = 90%, 24 hr / 1 cycle
EIAJ ED-4701
200 201
EIAJ ED-4701
200 202
EIAJ ED-4701
100 102
EIAJ ED-4701
100 103
EIAJ ED-4701
301 302
EIAJ ED-4701
303
EIAJ ED-4701
100 105
EIAJ ED-4701
200 203
(2) CRITERIA FOR JUDGING THE DAMAGE
Item
Symbol
Test Condition
Criteria for Judgment
Min.
Max.
Forward Voltage
VF
IF = 20 mA
-
U.S.L × 1.2
Reverse Current
IR
VR = 5 V
-
U.S.L × 2.0
Luminous Intensity
IV
IF = 20 mA
L.S.L × 0.5
-
U.S.L. : Upper Standard Level,
SSC-QP-7-03-44(갑)
L.S.L. : Lower Standard Level,
8
SEOUL SEMICONDUCTOR CO., LTD.
Rev. 1.00
SWAF0J
8. Precautions
(1) Storage conditions
Keep the product in a dry box or a desiccator with a desiccant in order to prevent moisture absorption.
a. Keep it at a temperature in the range from 5°C to 30°C and at a humidity of less than 60% RH.
In case of being stored for more than 3 months, the product should be sealed with Nitrogen gas.
(2) After opening the package
When soldering, this could result in a decrease of the photoelectric effect or light intensity.
a. Soldering should be done right after mounting the product.
b. Keep the temperature in the range from 5°C to 40°C and the humidity at less than 30%.
Soldering should be done within 7 days after opening the desiccant package.
If the product has been exposed for more than 7 days after opening the package or the indicating color
of the desiccator changes, the product must be baked at a temperature between 60°C and 65°C for 10 to
12 hours.
An unused and unsealed product should be repacked in a desiccant package and kept sealed in a dry
atmosphere.
(3) Precautions for use
Any external mechanical force or excessive vibration should not be applied to the product during cooling
after soldering, and it is preferable to avoid rapid cooling.
The product should not be mounted on a distorted part of PCB.
Gloves or wrist bands for ESD(Electric Static Discharge) should be wore in order to prevent ESD and
surge damage, and all devices and equipments must be grounded to the earth.
(4) Miscellaneous
Radiation resistance is not considered.
When cleaning the product, any kind of fluid such as water, oil and organic solvent must not be used
and IPA(Isopropyl Alcohol) must be used.
When using the product, operating current should be settled in consideration of the maximum ambient
temperature.
Its appearance or specification for improvement is subject to change without notice.
SSC-QP-7-03-44(갑)
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SEOUL SEMICONDUCTOR CO., LTD.
Rev. 1.00
SWAF0J
9. Soldering Profile
The LED can be soldered in place using the reflow soldering method.
(1)
Lead solder
Preliminary heating to be at maximum 210°C for maximum 2 minutes.
Soldering heat to be at maximum 240°C for maximum 10 seconds.
o
Device Surface Temperature [ C]
280
240
200
160
120
80
40
0
0
15
30
45
60
75
90
105 120 135 150 165 180 195
Soldering Times [sec]
(2)
Lead-free solder
Preliminary heating to be at maximum 220°C for maximum 2 minutes.
Soldering heat to be at maximum 260°C for maximum 10 seconds.
o
Device Surface Temperature [ C]
280
240
200
160
120
80
40
0
0
15
30
45
60
75
90
105
120 135 150
165
180 195
Soldering Times [sec]
(3)
Hand Soldering conditions
Not more than 5 seconds @MAX 300°C, under Soldering iron.
SSC-QP-7-03-44(갑)
10
SEOUL SEMICONDUCTOR CO., LTD.
Rev. 1.00
SWAF0J
10. Outline Dimension
( Tolerance : ±0.2, Unit : mm )
[Bottom View]
Cathode
SSC-QP-7-03-44(갑)
Anode
11
SEOUL SEMICONDUCTOR CO., LTD.
Rev. 1.00
SWAF0J
11. Packing
( Tolerance : ±0.2, Unit : mm )
4.0±0.10
+0.10
-0.00
2.0±0.05
Cathode
Anode
0.45±0.05
4.0±0.1
SECTION B-B'
180
15.4 ±1.0
+0
-3
13 +0.2
-0
60 +1
-0
2 ±0.2
22
13 ±0.3
Label
(1)
Quantity: 3500 pcs / Reel
(2)
Cumulative Tolerance : Cumulative Tolerance / 10 pitches to be ±0.2 mm
(3)
Adhesion Strength of Cover Tape: Adhesion strength to be 0.1 - 0.7 N when the cover tape is turned off from
the carrier tape at 10° angle to be the carrier tape
(4)
Package: P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package
SSC-QP-7-03-44(갑)
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SEOUL SEMICONDUCTOR CO., LTD.
Rev. 1.00
SWAF0J
12. Reel Packing Structure
Reel
Aluminum Vinyl Bag
Desiccant
Humidity indicator
Barcode Label
RANK :
Outer Box Structure
XXX
QUANTITY : XXXX
LOT NUMBER : XXXXXXXX
TUV
SSC PART NUMBER : XXXXXXXX
SEOUL
MADE IN KOREA
142 (mm)
Acriche
SWAF0J X
Material : Paper(SW3B(B))
RoHS
245 (mm)
SIZE (mm)
a
c
b
245 220 142
7inch
245 220 80
TYPE
Semiconductor EcoLight
220 (mm)
Lot Number
The lot number is composed of the following characters;
SWAF0J ○□□◎◎ ◇◇◇
Symbol
Meaning
○
Year
□□
Month
◎◎
Day
◇◇◇
Number
SSC-QP-7-03-44(갑)
Example
8 for 2008, 9 for 2009 ‥‥
01 for Jan., 02 for Feb., ‥‥ 12 for Dec.
01, 02, 03, 04, 05, ‥‥ 27, 28, 29, 30, 31
001, 002, 003, 004, 005, 006, 007 ‥‥
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SEOUL SEMICONDUCTOR CO., LTD.
Rev. 1.00
SWAF0J
13. History
Rev. No.
1.00
Contents
- The institution of New Spec.
Date
2008.06.03
Published by
SEOUL SEMICONDUCTOR CO., LTD.
http://www.seoulsemicon.com
148-29, Gasan-Dong, Geumcheon-Gu,
Seoul, 153-801. South Korea
© All Right Reserved.
SSC-QP-7-03-44(갑)
14
SEOUL SEMICONDUCTOR CO., LTD.